MSA_SFP_图文

Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)

Cooperation Agreement for Small Form-Factor Pluggable Transceivers

Agilent Technologies, Blaze Network Products, E2O Communications, Inc.,

ExceLight Communications, Finisar Corporation, Fujikura Technology America Corp.,

Hitachi Cable, Infineon Technologies Corp., IBM Corp., Lucent Technologies,

Molex, Inc., Optical Communication Products, Inc., Picolight, Inc.,

Stratos Lightwave, Tyco Electronics

I. Purpo of the Cooperation Agreement (Agreement)

Each party desires to establish internationally compatible sources of a pluggable fiber optic

transceiver module in support of standards for fiber optic systems including Asynchronous

Transfer Mode (ATM), FDDI, Fibre Channel, Fast Ethernet and Gigabit Ethernet, and

Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)

B. Licensing and Fees

No licen is granted under the patents, know-how, tradecrets or any other technology of

any party to this Agreement either expressly or by implication or by estoppel. Each of the

MSA parties have agreed that licens to all required intellectual property will be made

available to all interested parties under reasonable and non-discriminatory terms and

conditions applicable to that MSA party. Individual parties to this Agreement may have

Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)

B. Promotion of the Agreement

After the Agreement is announced, each party may adverti or otherwi promote this

Agreement in any way that it deems appropriate. Mutual connt of the other party is required

if such other party is to be mentioned by name.

IV. Other Vendors

A. Other Vendors Matching the Product Configuration

The parties recognize that additional vendors may choo to match the attached product

specifications after this Agreement is announced.

Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)

B. Withdrawal

The parties recognize that at some future time it may become less feasible to offer the

products envisioned by this Agreement. A party may withdraw from its commitment to

cooperate at its own discretion upon a 90-day notice to the other parties. This notice is

Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)

Appendix A. Mechanical Interface

A1. SFP Transceiver Package Dimensions

A2. Mating of SFP Transceiver PCB to SFP Electrical Connector

A3. Host Board Layout

A4. Inrtion, Extraction and Retention Forces for SFP Transceivers

A5. Labeling of SFP Transceivers

Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)

Appendix A. Mechanical Interface

A1. SFP Transceiver Package Dimensions

A common mechanical outline is ud for all SFP transceivers. The package dimensions for

the SFP transceiver are described in Table 1 and Figures 1A and 1B.

Table 1. Dimension Table for Drawing of SFP Transceiver

DesignatorDimensionToleranceComments

A13.7Transceiver width, nopiece or front that extends inside cage

B8.6Transceiver height, front, that extends inside cage

C8.5Transceiver height, rear

D13.4Transceiver width, rear

E1.0MaximumExtension of front sides outside of cage, e Note 2 Figure 1B

F2.3ReferenceLocation of cage grounding springs from centerline, top

G4.2ReferenceLocation of side cage grounding springs from top

H2.0MaximumWidth of cage grounding springs

J28.5MinimumLocation of transition between no piece and rear of

K56.5ReferenceTransceiver overall length

LMinimumChamfer on bottom of housing

M2.0Height of rear shoulder from transceiver printed circuit board

N2.25Location of printed circuit board to bottom of transceiver

P1.0Thickness of printed circuit board

Q9.2Width of printed circuit board

R0.7MaximumWidth of skirt in rear of transceiver

S45.0Length from latch shoulder to rear of transceiver

T34.6Length from latch shoulder to bottom opening of transceiver

U41.8Length from latch shoulder to end of printed circuit board

V2.5Length from latch shoulder to shoulder of transceiver outside

W1.7Clearance for actuator tines

X9.0ReferenceTransceiver length extending outside of cage, e Note 2

Y2.0MaximumMaximum length of top and bottom of transceiver extending

Z0.45Height of latch boss

AA8.6ReferenceTransceiver height, front, that extends inside cage

AB2.6MaximumLength of latch boss (design optional)

ACEntry angle of actuator

AD0.3MaximumRadius on entry angle of actuator

AE6.3ReferenceWidth of cavity that contains the actuator

AF2.6Width of latch boss (design optional)

AG0.40MinimumMaximum radius of front of latch boss, 2 places (design

(mm)(mm)

1.1x45°

45°± 3°

± 0.1

± 0.1

± 0.1

± 0.1

± 0.25

± 0.1

± 0.1

± 0.1

± 0.2

± 0.3

± 0.15

± 0.05

± 0.1

± 0.05

± 0.05

transceiver

of cage (location of positive stop).

Figure 1B

outside of cage, e Note 2 Figure 1B

optional)

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September 14, 2000 Page 6

Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)

Figure 1A. Drawing of SFP Transceiver

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September 14, 2000 Page 7

Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)

Notes:

1. Cage grounding springs permitted in this

area and may extend full length of

transceiver, 4 places. Grounding springs

may contribute a maximum force of 3.5N

(Newtons) to the withdrawal force of the

transceiver from the cage.

Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)

A2. Mating of SFP Transceiver PCB to SFP Electrical Connector

The SFP transceiver contains a printed circuit board that mates with the SFP electrical

connector. The pads are designed for a quenced mating:

• First mate – ground contacts

• Second mate – power contacts

• Third mate – signal contacts

The design of the mating portion of the transceiver printed circuit board is illustrated in Figure 2

and the electrical pad layout is illustrated in Figure 3. A typical contact pad plating for the

printed circuit board is 0.38 micrometers minimum hard gold over 1.27 micrometers minimum

thick nickel.Other plating options that meet the performance requirements are acceptable.

Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)

20

19

18

17

16

15

14

13

12

11

VeeT

Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)

Figure 4A. SFP Host Board Mechanical Layout

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September 14, 2000 Page 11

Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)

Figure 4B. SFP Host Board Mechanical Layout (Cont.)

A4. Inrtion, Extraction and Retention Forces for SFP Transceivers

Therequirement for the various functional forces and the durability cycles are specified in

Table 2.

Table 2. Inrtion, Extraction, and Retention Forces

MeasurementMinimumMaximumUnitsComments

SFP transceiver inrtion040Newtons

SFP transceiver extraction011.5Newtons

SFP transceiver retention90170NewtonsNo damage to transceiver

Cage retention (Latch strength)180N/ANewtons

Cage kickout spring force11.522Newtons

Inrtion / removal cycles,100N/Acycles

connector/cage

Inrtion / removal cycles, SFP50N/Acycles

transceiver

below 90N

No damage to latch below

180N

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Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)

A5. Labeling of SFP Transceivers

Color coding requirements for optical SFP transceivers are specified in Figure 1B.

Each SFP transceiver should be clearly labeled. The complete labeling need not be visible

when the SFP transceiver is installed. Labeling should include appropriate manufacturing and

part number identification, appropriate regulatory compliance labeling, and a clear specification

Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)

A7. SFP Electrical Connector Mechanical Specifications

The SFP Connector is a 20-contact, right angle surface mount connector. It is described in

Table 3 and Figure 6. The plating on the contacts is specified as follows:

• Contact area:

0.38 micrometers minimum hard gold over 2.54 micrometers minimum

thick nickel

• Solder terminal area: gold flash or 2.54 micrometers tin lead plating over 2.54

minimum thick nickel.

Table 3. SFP Transceiver Connector Dimensions

DesignatorDimensionToleranceComments

A9.4Connector card slot width

B1.4Guide pin diameter

C11.2MaximumConnector width

D9.2MaximumConnector length

E3.5ReferenceDistance from centerline of connector

F3.9ReferenceDistance from centerline of connector

G1.35MaximumConnector card slot height

H2.6MinimumHeight from bottom of connector to

J9.6TPDistance between guide pins

K0.9ReferenceDiamond guide pin width

L1.4Diamond guide pin length

M5.4MaximumConnector height

N0.8ReferenceLength of solder leads past housing,

P6.0MinimumDepth of card slot from front face of

Q3.0MaximumDepth of contact point from front face

R0.7Size of chamfer on top face of

S0.3ReferenceDistance boss extends past front face

T1.0MinimumSize of chamfer at entry of card slot,

U4.5ReferenceLength from centerline of guide posts

(mm)(mm)

± 0.08

± 0.05

± 0.05

± 0.1

to outer contact

to outer contact

bottom of card slot

front & rear

housing

of connector

connector

of connector

all around

to end of solder lead

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Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)

Figure 6. SFP Transceiver Connector Illustration

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Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)

A8. SFP Cage Asmbly Dimensions

The SFP Cage Asmbly consists of two components: a lower cage that is soldered to the

host board and a top cage that is asmbled to the lower cage after soldering. A reference

drawing describing the SFP Cage Asmbly is provided in Table 4 and Figures 7A and 7B.

The cage material is copper alloy and plating options are:

• Tin-lead plate 2.54 micrometers minimum over copper flash

• Tin plate 2.54 micrometers minimum over 0.76 micrometers minimum nickel

Table 4. Dimension Table for Drawing of SFP Cage Asmbly

DesignatorDimensionToleranceComments

A48.8MaximumOverall length

B8.3MaximumLength from inside top of cage to latch

C14.0Inside width of cage

D14.25BasicDistance between solderleg centerlines on side of cage

E0.249Thickness of solderleg

F9.0BasicDistance between vent holes along length

G11.8BasicDistance from front of cage to beginning of center vent

H7.9BasicDistance between vent holes across the width of the

J2.0Diameter of vent holes

K16.5BasicDistance from front of cage to solderleg

L10.0BasicDistance between chassis ground solderlegs along side

M0.6Width of EMI pins

N0.7Width of all chassis ground solderlegs

P2.0MaximumWidth of solderleg shoulder

Q1.25MaximumLength of solderleg

R3.95BasicDistance from centerline of cage to centerline of

S1.45BasicDistance from centerline of cage to centerline of

T1.45BasicDistance from centerline of cage to centerline of

U4.8BasicDistance from centerline of cage to centerline of EMI

V0.5Width of EMI pins on top cage

W9.2Distance from inside top of cage to inside bottom

X9.8MaximumMaximum height of cage asmbly from host board

Z10.0BasicDistance between chassis ground solderlegs along side

AA11.5BasicDistance from front of cage to solderleg

AB7.5MinimumLength of 9.2 (W) dimension from front of cage

AC15.0MaximumMaximum width of cage asmbly

AD13.9MinimumMinimum width of inside of cage

AE8.95Height of inside of cage asmbly

AF1.0MinimumHeight of clearance slots

AG2.4BasicDistance of clearance slots from cage centerline

(mm)(mm)

± 0.1

± 0.025

± 0.1

± 0.1

± 0.1

± 0.05

± 0.15

± 0.15

hole row

cage

chassis ground solderleg

chassis ground solderleg

chassis ground solderleg

pins

surface of front ction of cage asmbly

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September 14, 2000 Page 16

Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)

Table 4. Dimension Table for Drawing of SFP Cage Asmbly (Cont.)

DesignatorDimensionToleranceComments

AH3.0Width of clearance slots

AJ2.35Distance from front of cage to latch opening

AK2.8Length of latch opening

AL0.5MinimumHeight of latch lead-in

AM45.6MaximumDistance from front of cage to kickout spring

AN35.0MaximumDistance from front of cage to end of cage floor

AP0.7Width of solderlegs that extend from floor of cage

AQ5.1MaximumWidth of latch

AR3.0Width of latch opening

AS16.3BasicFront of cage to beginning of outer vent hole rows

AT0.65MaximumInside radius of cage, four places

AU5.8MinimumDistance between panel ground spring supports

AV12.7MaximumLength of plug extending outside of the cage

AW15.75MaximumWidth of plug extending outside of the cage

AX10.9MaximumHeight of plug extending outside of the cage

(mm)(mm)

± 0.1

± 0.1

± 0.1

± 0.1

± 0.05

recommended

A9. Dust / EMI Cover

The order to prevent contamination of the internal components and to optimize EMI

performance, it is recommended that a Dust/EMI Plug be inrted into cage asmblies when

no transceiver is prent. The maximum dimensions of the Dust/EMI Cover are listed in Table

4 and the maximum size is illustrated in Figure 7A. The Dust/EMI Cover shall exert a

maximum force of 4.0 Newtons per side to the inside surfaces of the cage. This force shall be

measured as the force/side required to compress the Dust/EMI Cover’s compliant feature(s) to

the maximum dimensions listed in Table 4 (Illustrated in Figure 7A).

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September 14, 2000 Page 17

Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)

Figure 7A. SFP Cage Asmbly

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September 14, 2000 Page 18

Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)

Figure 7B. SFP Cage Asmbly (Cont.)

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September 14, 2000 Page 19

Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)

Appendix B. Electrical Interface

B1. Introduction

This annex contains pin definition data for the small form-factor pluggable (SFP) transceiver.

The pin definition data is specific to gigabit rate datacom applications such as Fibre Channel

and Gigabit Ethernet. It is expected that different pin definitions will be developed for

SONET/ATM and lower data rate datacom applications.

B2. Pin Definitions

Figure 1 below shows the pin names and numbering for the connector block on the host board.

The diagram is in the same relative orientation as the host board layout (e Appendix A,

Figure 4.). As mentioned, this pinout only applies to gigabit rate datacom applications. The

pin functions are defined in Table 1 and the accompanying notes. Figure 2A shows the

recommended power supply filtering network. Figure 2B shows an example of a complete

SFP host board schematic with connections to SerDes and protocol ICs. For EMI protection

the signals to the 20-pin connector should be shut off when the transceiver is removed.

Standard board layout practices such as connections to Vcc and GND with Vias, u of short-

and equal-length differential signal lines, u of microstrip-lines and 50Ω terminations are

recommended. Chassis grounds and external electromagnetic interference shields should not

be attached to circuit ground.

VeeT

1

2

3

Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)

Table 1. Pin Function Definitions

PinPlug

Num.

1VeeTTransmitter Ground1

2TX FaultTransmitter Fault3Note 1

3TX DisableTransmitter Disable3Note 2

4MOD-DEF2Module Definition 23Note 3, 2 wire rial ID interface

5MOD-DEF1Module Definition 13Note 3, 2 wire rial ID interface

6MOD-DEF0Module Definition 03Note 3, Grounded in Module

7Rate SelectSelect between full or3Note 4

NameFunctionSeq.Notes

Indication

reducedLow or Open – reduced bandwidth,

receiver bandwidthHigh– full bandwidth

Loss of SignalNote 58LOS3

Receiver GroundNote 69VeeR1

Receiver GroundNote 610VeeR1

Receiver GroundNote 611VeeR1

Inv. Received Data OutNote 712RD-3

Received Data OutNote 713RD+3

Receiver GroundNote 614VeeR1

Receiver Power15VccR2

Transmitter Power16VccT2

Transmitter GroundNote 617VeeT1

Transmit Data InNote 918TD+3

Inv. Transmit Data InNote 919TD-3

Transmitter GroundNote 620VeeT1

Module disables on high or open

3.3 ± 5%, Note 8

3.3 ± 5%, Note 8

Plug Seq.: Pin engagement quence during hot plugging.

1) TX Fault is an open collector/drain output, which should be pulled up with a 4.7K – 10KΩ

resistor on the host board. Pull up voltage between 2.0V and VccT, R+0.3V. When high,

output indicates a lar fault of some kind. Low indicates normal operation. In the low

state, the output will be pulled to < 0.8V.

2) TX disable is an input that is ud to shut down the transmitter optical output. It is pulled

up within the module with a 4.7 – 10 KΩ

resistor. Its states are:

Low (0 – 0.8V): Transmitter on

(>0.8, < 2.0V): Undefined

High (2.0 – 3.465V): Transmitter Disabled

Open: Transmitter Disabled

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September 14, 2000 Page 21

Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)

Table 1 Notes (Cont.)

3) Mod-Def 0,1,2. The are the module definition pins. They should be pulled up with a

4.7K – 10KΩ resistor on the host board. The pull-up voltage shall be VccT or VccR (e

Section IV for further details).

Mod-Def 0 is grounded by the module to indicate that the module is prent

Mod-Def 1 is the clock line of two wire rial interface for rial ID

Mod-Def 2 is the data line of two wire rial interface for rial ID

4) This is an optional input ud to control the receiver bandwidth for compatibility with

multiple data rates (most likely Fibre Channel 1x and 2x Rates). If implemented, the input

will be internally pulled down with > 30kΩ resistor. The input states are:

Low (0 – 0.8V): Reduced Bandwidth

(>0.8 , < 2.0V):Undefined

High (2.0 – 3.465V): Full Bandwidth

Open: Reduced Bandwidth

5) LOS (Loss of Signal) is an open collector/drain output, which should be pulled up with a

4.7K – 10KΩ resistor. Pull up voltage between 2.0V and VccT, R+0.3V. When high, this

output indicates the received optical power is below the worst-ca receiver nsitivity (as

defined by the standard in u). Low indicates normal operation. In the low state, the

output will be pulled to < 0.8V.

6) VeeR and VeeT may be internally connected within the SFP module.

7) RD-/+: The are the differential receiver outputs. They are AC coupled 100 Ω differential

lines which should be terminated with 100 Ω (differential) at the ur SERDES. The AC

coupling is done inside the module and is thus not required on the host board. The voltage

swing on the lines will be between 370 and 2000 mV differential (185 – 1000 mV single

ended) when properly terminated.

8) VccR and VccT are the receiver and transmitter power supplies. They are defined as 3.3V

±5% at the SFP connector pin. Maximum supply current is 300 mA. Recommended host

Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)

VccT

0.1 uF

1 uH

VccR3.3 V

0.1 uF0.1 uF10 uF

1 uH

10 uF

SFP ModuleHost Board

Figure 2A. Recommended Host Board Supply Filtering Network

Protocol

Vcc

Protocol Vcc

4.7k to 10k Ohms

1 uH

3.3 V

1 uH

10 uF.1uF

SFP

Module

.1uF

Vcc,T

4.7k to 10k Ohms

Tx_Disable

Tx_Disable

Tx_Fault

Tx_Fault

TD +

TD -

.01uF

100 Ohms

Lar Driver

.01uF

Gnd,T

Protocol IC SerDes IC

4.7k to 10k Ohms

10 uF.1uF

Vcc,R

RD +

100 Ohms

.01uF

Preamp &

Quantizer

.01uF

RD -

Rx_LOS

Rx_LOS

Rx_Rate

Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)

B3. Timing Requirements of Control and Status I/O

The timing requirements of the control and status lines are drawn largely from the GBIC

standard at the time of writing. They are summarized in Table 2 below:

Table 2. Timing Requirements of Control and Status I/0

ParameterSymbolMinMaxUnitCondition

TX Disable Asrt

Time

TX Disable NegateTime from falling edge of TX

TimeDisable to when the modulated

t_off10

µs

Time from rising edge of TX

Disable to when the optical

output falls below 10% of

nominal

optical output ris above 90%

of nominal

From power on or negation of TXTime to initialize,

Fault using TX Disable

Time from fault to TX fault on.TX Fault Asrt Timet_fault100

Time TX Disable must be heldTX Disable to rett_ret10

high to ret TX_fault

Time from LOS state to RX LOS

asrt

Time from non-LOS state to RXLOS Deasrt Timet_loss_off100

LOS deasrt

Time from rising or falling edgeRate-Select Changet_ratel10

of Rate Select input until receiverTime

bandwidth is in conformance

with appropriate specification.

t_on1ms

including ret of

TX_Fault

LOS Asrt Timet_loss_on100

t_init300ms

µs

µs

Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)

SFP transceiver power on initialization procedure, TX_DISABLE negated (Cont.)

If no transmitter safety circuitry is implemented, the TX_FAULT signal may be tied to its

negated state.

The power-on initialization timing for a transceiver with TX_DISABLE negated is shown in

Figure 3.

V > 3.15 V

CC

Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)

V > 3.15 V

CC

TX_FAULT

TX_DISABLE

Transmitted Signal

t_init

Figure 4. Power on initialization of SFP, TX_DISABLE asrted

Initialization during hot plugging of SFP TRANSCEIVER.

When a transceiver is not installed, TX_FAULT is held to the asrted state by the pull up

circuits on the host. As the SFP transceiver is installed, contact is made with the ground,

voltage, and signal contacts in the specified order. After the SFP has determined that VT has

CC

reached the specified value, the power on initialization takes place as described in the above

ctions. An example of initialization during hot plugging is provided in Figure 5.

V > 3.15 V

CC

Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)

TX_FAULT

TX_DISABLE

Transmitted Signal

t_offt_on

Figure 6. SFP TX_DISABLE timing during normal operation.

SFP transceiver fault detection and prentation

TX_FAULT shall be implemented by tho module definitions of SFP transceiver supporting

safety circuitry. If TX_FAULT is not implemented, the signal shall be held to the low state by

the SFP transceiver.

Occurrence of Fault

TX_FAULT

Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)

SFP transceiver fault recovery (Cont.)

of reasonable single fault conditions. The SFP transceiver may require internal protective

circuitry to prevent the frequent asrtion of the TX_DISABLE signal from generating frequent

puls of energy that violate the safety requirements. The timing for successful recovery from

a transient safety fault condition is shown in Figure 8.

Occurrence of Fault

TX_FAULT

TX_DISABLE

Transmitted Signal

t_ret

*SFP shall clear TX_FAULT in < t_init if the failure is transient

t_init*

Figure 8. Successful recovery from transient safety fault condition

Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)

SFP transceiver loss of signal indication

The LOS signal is intended as a preliminary indication to the system in which the SFP

transceiver is installed that the link signals are likely to be outside the required values for

proper operation. Such indications typically point to non-installed cables, broken cables, or a

disabled, failing or powered off transmitter at the far end of the cable. Additional indications are

provided by the system in which the SFP transceiver is installed to verify that the information

Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)

B4. Module Definition Interface and Data Field Description

The definition of the MOD-DEF function is drawn largely from the GBIC standard with some

small, but backwards compatible, changes to the fields or allowed values to reflect the latest

standards and expectations for the transceivers. In some cas, this backward compatibility

approach results in the possibility of illegal combinations (such as defining an SFP module with

SC optical connectors). Some locations previously rerved in the GBIC rial identification

have now been defined.

It should be noted that only the rial module definition and the basic Mod-Def 0 indication of

module prent are implemented. The u of MOD DEF lines as static codes for module

definition as done with GBIC are not implemented.

Overview

The SFP rial ID provides access to sophisticated identification information that describes the

transceiver’s capabilities, standard interfaces, manufacturer, and other information. The rial

interface us the 2-wire rial CMOS EPROM protocol defined for the ATMEL

2

Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)

Serial information definition (Cont.)

The word address is transmitted with the high order bit transmitted first. The protocol for the 2-

wire rial interface quentially transmits one or more 8-bit bytes, with the data byte

addresd by the lowest word address transmitted first. In each data byte, the high order bit

Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)

Table 3.1. Serial ID: Data Fields

DataName of

Addressfield

01IdentifierType of rial transceiver (e Table 3.2)

11Ext. IdentifierExtended identifier of type of rial transceiver

21ConnectorCode for connector type (e Table 3.3)

3-108TransceiverCode for electronic compatibility or optical compatibility

111EncodingCode for rial encoding algorithm (e Table 3.5)

121BR, NominalNominal bit rate, units of 100 MBits/c.

131Rerved

141Length(9m) - kmLink length supported for 9/125 mm fiber, units of km

151Length (9m)Link length supported for 9/125 mm fiber, units of 100 m

161Length (50m)Link length supported for 50/125 mm fiber, units of 10 m

171Length (62.5m)Link length supported for 62.5/125 mm fiber, units of 10 m

181Length (Copper)Link length supported for copper, units of meters

191Rerved

20-3516Vendor nameSFP transceiver vendor name (ASCII)

361Rerved

37-393Vendor OUISFP transceiver vendor IEEE company ID

40-5516Vendor PNPart number provided by SFP transceiver vendor (ASCII)

56-594Vendor revRevision level for part number provided by vendor (ASCII)

60-623Rerved

631CC_BASECheck code for Ba ID Fields (address 0 to 62)

64-652

661

671

68-8316

84-918

92-943

951

96-12732

128-511384

512-n

Field

SizeDescription of field

(Bytes)

OptionsIndicates which optional SFP signals are implemented

BR, maxUpper bit rate margin, units of %

BR, minLower bit rate margin, units of %

Vendor SNSerial number provided by vendor (ASCII)

Date codeVendor’s manufacturing date code (e Table 3.7)

Rerved

CC_EXTCheck code for the Extended ID Fields (address 64 to 94)

BASE ID FIELDS

(e Table 3.4)

EXTENDED ID FIELDS

(e Table 3.6)

VENDOR SPECIFIC ID FIELDS

Read-onlyVendor specific data, read only

Rerved

Vendor specific

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September 14, 2000 Page 32

Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)

Identifier

The identifier value specifies the physical device described by the rial information. This value

shall be included in the rial data. The defined identifier values are shown in Table 3.2.

Table 3.2. Identifier Values

ValueDescription of Physical Device

00hUnknown or unspecified

01hGBIC

02hModule/connector soldered to motherboard

03hSFP transceiver

04-7FhRerved

80-FFhVendor specific

Extended Identifier

The field should be t to 04h for all SFP modules indicating rial ID module definition.

Connector

The Connector value indicates the external connector provided on the interface. This value

shall be included in the rial data. The defined connector values are shown in Table 3.3. Note

that 01h – 05h are not SFP compatible, and are included for compatibility with GBIC standards

TABLE 3.3. Connector Values

ValueDescription of Connector

00hUnknown or unspecified

01h

02h

03h

04h

05h

06hFiberJack

07hLC

08hMT-RJ

09hMU

0AhSG

0BhOptical pigtail

0C-1FhRerved

20hHSSDC II

Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)

Transceiver

The following bit significant indicators define the electronic or optical interfaces that are

supported by the SFP transceiver. At least one bit shall be t in this field. For Fibre Channel

SFPs, the Fibre Channel speed, transmission media, transmitter technology, and distance

capability shall all be indicated.

Table 3.4. Transceiver codes

DataBitDescription of transceiverDataBitDescription of transceiver

AddrAddr

37-0Rerved77very long distance (V)

47-4Rerved76short distance (S)

43Rerved74long distance (L)

42OC 48, long reachFibre Channel transmitter technology

41OC 48, intermediate reach73-2Rerved

40OC 48 short reach71Longwave lar (LC)

57Rerved70Electrical inter-enclosure (EL)

56OC 12, single mode long reach87Electrical intra-enclosure (EL)

55OC 12, single mode inter. reach86Shortwave lar w/o OFC (SN)

54OC 12 multi-mode short reach85Shortwave lar w/ OFC (SL)

53Rerved84Longwave lar (LL)

52OC 3, single mode long reach80-3Rerved

51OC 3, single mode inter. reach

50OC 3, multi-mode short reachFibre Channel transmission media

11

Rerved Standard Compliance CodesFibre Channel link length

SONET Compliance Codes75intermediate distance (I)

7Twin Axial Pair (TW)9

6Shielded Twisted Pair (TP)9

5Miniature Coax (MI)9

4Video Coax (TV)Gigabit Ethernet Compliance Codes9

3Multi-mode, 62.5m (M6)67-4Rerved9

2Multi-mode, 50 m (M5)631000BASE-T9

1Rerved621000BASE-CX9

0Single Mode (SM)611000BASE-LX9

Fibre Channel speed

7-5Rerved10

4400 MBytes/Sec10

3Rerved10

2200 MBytes./Sec10

1Rerved10

0100 MBytes/Sec10

601000BASE-SX

1

Bit 7 is the high order bit and is transmitted first in each byte.

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September 14, 2000 Page 34

Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)

Encoding

The encoding value indicates the rial encoding mechanism that is the nominal design target

of the particular SFP transceiver. The value shall be contained in the rial data. The defined

encoding values are shown in Table 3.5.

Table 3.5. Encoding codes

codeDescription of encoding mechanism

00hUnspecified

01h8B10B

02h4B5B

03hNRZ

04hManchester

05h -FFhRerved

Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)

Length (50m)

This value specifies the link length that is supported by the SFP transceiver while operating in

Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)

Vendor Rev

The vendor revision number (vendor rev) is a 4-byte field that contains ASCII characters, left-

aligned and padded on the right with ASCII spaces (20h), defining the vendor’s product

revision number. A value of all zero in the 4-byte field indicates that the vendor Rev is

unspecified.

CC_BASE

The check code is a one byte code that can be ud to verify that the first 64 bytes of rial

information in the SFP transceiver is valid. The check code shall be the low order 8 bits of the

sum of the contents of all the bytes from byte 0 to byte 62, inclusive.

Options

The bits in the option field shall specify the options implemented in the SFP transceiver as

described in Table 3.6.

Table 3.6. Option Values

databitDescription of option

address

647-0Rerved

657-6Rerved

655RATE_SELECT is implemented

If bit is t then active control of the rate lect pin is required

to change rates. If bit is not t, no control of pin is required.

In all cas, compliance with multiple rate standards should

be determined by Transceiver Codes in Bytes 4, 5, 6 and 10.

(See Table 3.4)

4TX_DISABLE is implemented and disables the rial output.65

Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)

Vendor SN

The vendor rial number (vendor SN) is a 16 character field that contains ASCII characters,

left-aligned and padded on the right with ASCII spaces (20h), defining the vendor’s rial

number for the SFP transceiver. A value of all zero in the 16-byte field indicates that the

vendor SN is unspecified.

Date Code

The date code is an 8-byte field that contains the vendor’s date code in ASCII characters. The