PCB专业术语
pcb专业术语
一、综合词汇
1、印制电路:printedcircuit2、印制线路:printedwiring3、印制板:
printedboard
8、印制板装配:printedboardasmbly9、板:board
10、单面印制板:single-sidedprintedboard(ssb)11、双面印制板:double-
sidedprintedboard(dsb)12、多层印制板:mulitlayerprintedboard(mlb)13、多层印制
电路板:mulitlayerprintedcircuitboard14、多层印制线路板:
mulitlayerpritedwiringboard15、刚性印制板:rigidprintedboard
16、刚性单面印制板:rigidsingle-sidedprintedborad17、刚性双面印制板:
rigiddouble-sidedprintedborad18、刚性多层印制板:rigidmultilayerprintedboard19、
挠性多层印制板:flexiblemultilayerprintedboard20、挠性印制板:
flexibleprintedboard
21、挠性单面印制板:flexiblesingle-sidedprintedboard22、挠性双面印制板:
flexibledouble-sidedprintedboard23、挠性印制电路:
flexibleprintedcircuit(fpc)24、挠性印制线路:flexibleprintedwiring
25、刚性印制板:flex-rigidprintedboard,rigid-flexprintedboard
26、刚性双面印制板:flex-rigiddouble-sidedprintedboard,rigid-flexdouble-
sidedprinted27、刚性多层印制板:flex-rigidmultilayerprintedboard,rigid-
flexmultilayerprintedboard28、齐平印制板:flushprintedboard29、金属芯印制板:
metalcoreprintedboard30、金属基为印制板:metalbaprintedboard31、多重布线印制
板:mulit-wiringprintedboard32、陶瓷印制板:ceramicsubstrateprintedboard33、导
电胶印制板:electroconductivepasteprintedboard34、模塑电路板:
moldedcircuitboard35、模压印制板:stampedprintedwiringboard
36、顺序层压多层印制板:quentially-laminatedmulitlayer37、散线印制板:
discretewiringboard38、微线印制板:microwireboard39、积层印制板:buile-
upprintedboard
40、积层多层印制板:build-upmulitlayerprintedboard(bum)41、积层抖印制板:
build-upflexibleprintedboard42、表面层再分电路板:surfacelaminarcircuit(slc)
43、埋入凸块连印制板:b2itprintedboard44、多层膜基板:multi-
layeredfilmsubstrate(mfs)
45、层间全内导通多层印制板:alivhmultilayerprintedboard46、有载芯片板:
chiponboard(cob)47、掩埋电阻板:buriedresistanceboard48、母板:motherboard49、
子板:daughterboard50、背板:backplane51、裸板:bareboard
52、键盘板夹心板:copper-invar-copperboard53、动态挠性板:
dynamicflexboard54、静态挠性板:staticflexboard55、可断拼板:break-
awayplanel56、电缆:cable
57、挠性扁平电缆:flexibleflatcable(ffc)58、薄膜开关:membraneswitch59、混
合电路:hybridcircuit60、厚膜:thickfilm
61、厚膜电路:thickfilmcircuit62、薄膜:thinfilm
63、薄膜混合电路:thinfilmhybridcircuit64、互连:interconnection65、导线:
conductortraceline66、齐平导线:flushconductor67、传输线:transmissionline68、
跨交:crossover
79、导电图形:conductivepattern80、非导电图形:non-conductivepattern81、字
符:legend82、标志:mark二、基材:
1、基材:bamaterial2、层压板:laminate
3、覆金属箔基材:metal-cladbadematerial
4、覆以铜箔层压板:copper-cladlaminate(ccl)
9、金属芯覆铜箔层压板:metalcorecopper-cladlaminate10、金属基覆铜层压板:
metalbacopper-cladlaminate11、挠性覆铜箔绝缘薄膜:flexiblecopper-
claddielectricfilm12、基体材料:basismaterial13、预浸材料:prepreg14、粘结片:
bondingsheet
15、预浸导电片:preimpregnatedbondingsheer16、环氧玻璃基板:
epoxyglasssubstrate
17、加成法用层压板:laminateforadditiveprocess18、预制内层覆箔板:
masslaminationpanel19、内层芯板:corematerial
20、催化剂板材:catalyzedboard,coatedcatalyzedlaminate21、涂胶催化剂层压板:
adhesive-coatedcatalyzedlaminate22、涂胶并无急层压板:adhesive-
coateduncatalyzedlaminate23、导电层:bondinglayer24、导电膜:filmadhesive
25、涂胶粘剂绝缘薄膜:adhesivecoateddielectricfilm26、无支撑胶粘剂膜:
unsupportedadhesivefilm27、覆盖层:coverlayer(coverlay)28、增强板材:
stiffenermaterial29、铜箔面:copper-cladsurface30、去铜箔面:
foilremovalsurface31、层压板面:uncladlaminatesurface32、基膜面:
bafilmsurface33、胶粘剂面:adhesivefaec34、原始光洁面:platefinish35、粗面:
mattfinish
36、横向:lengthwidirection37、模向:crosswidirection38、剪切板:
cuttosizepanel
39、酚醛纸质覆铜箔板:phenoliccellulopapercopper-
cladlaminates(phenolic/paperccl)40、环氧纸质覆铜箔板:
epoxidecellulopapercopper-cladlaminates(epoxy/paperccl)41、环氧玻璃布基覆铜
箔板:epoxidewovenglassfabriccopper-cladlaminates
42、环氧玻璃布纸无机覆以铜箔板:
epoxidecellulopapercore,glassclothsurfacescopper-cladlaminates
43、环氧玻璃布玻璃纤维复合覆铜箔板:
epoxidenonwoven/wovenglassreinforcedcopper-cladlaminates
44、聚酯玻璃布覆以铜箔板:ployesterwovenglassfabriccopper-cladlaminates45、
聚酰亚胺玻璃布覆以铜箔板:polyimidewovenglassfabriccopper-cladlaminates
46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板:
bismaleimide/triazine/epoxidewovenglassfabriccopper-cladlamimates
47、环氧合成纤维布覆铜箔板:epoxidesyntheticfiberfabriccopper-
cladlaminates48、共聚四乙烯玻璃纤维覆以铜箔板:teflon/fiberglasscopper-
cladlaminates49、超薄型层压板:ultrathinlaminate
50、陶瓷基覆铜箔板:ceramicsbacopper-cladlaminates51、紫外线阻挡型覆铜箔
板:uvblockingcopper-cladlaminates三、基材的材料
1、a阶树脂:a-stageresin2、b阶树脂:b-stageresin3、c阶树脂:c-stageresin4、
环氧树脂:epoxyresin5、酚醛树脂:phenolicresin6、聚酯树脂:polyesterresin7、聚
酰亚胺树脂:polyimideresin
8、双马来酰亚胺三嗪树脂:bismaleimide-triazineresin9、丙烯酸树脂:
acrylicresin
10、三聚氰胺甲醛树脂:melamineformaldehyderesin11、多官能环氧树脂:
polyfunctionalepoxyresin12、溴化环氧树脂:brominatedepoxyresin13、环氧酚醛:
epoxynovolac14、氟树脂:fluroresin15、硅树脂:siliconeresin16、硅烷:silane17、
聚合物:polymer
18、无定形聚合物:amorphouspolymer19、结晶现象:crystallinepolamer20、双晶
现象:dimorphism21、共聚物:copolymer22、合成树脂:synthetic
23、热固性树脂:thermottingresin24、热塑性树脂:thermoplasticresin25、感
光性树脂:photonsitiveresin
26、环氧当量:weightperepoxyequivalent(wpe)27、环氧值:epoxyvalue28、双氰
胺:dicyandiamide29、粘结剂:binder30、胶粘剂:adesive31、固化剂:
curingagent32、阻燃剂:flameretardant33、遮光剂:opaquer34、增塑剂:
plasticizers
35、不饱和聚酯:unsatuiatedpolyester36、聚酯薄膜:polyester
37、聚酰亚胺薄膜:polyimidefilm(pi)38、聚四氟乙烯:
polytetrafluoetylene(ptfe)
39、共聚全氟乙烯丙烯薄膜:perfluorinatedethylene-
propylenecopolymerfilm(fep)40、进一步增强材料:reinforcingmaterial41、玻璃纤维:
glassfiber42、e玻璃纤维:e-glassfibre43、d玻璃纤维:d-glassfibre44、s玻璃纤维:
s-glassfibre45、玻璃布:glassfabric46、非缝纫:non-wovenfabric47、玻璃纤维垫:
glassmats48、纱线:yarn49、单丝:filament50、绞股:strand51、纬纱:weftyarn52、
经纱:warpyarn53、但尼尔:denier54、经向:warp-wi
55、纬向:weft-wi,filling-wi56、织物经纬密度:threadcount57、织物组织:
weavestructure58、平纹组织:plainstructure59、坏布:greyfabric60、稀松织物:
wovenscrim61、弓纬:bowofweave62、断经:endmissing63、缺纬:mis-picks64、纬斜:
bias65、折痕:crea66、云织:waviness67、鱼眼:fisheye68、毛圈长:
featherlength69、厚薄段:mark70、裂缝:split71、捻度:twistofyarn72、浸润剂含
量:sizecontent73、浸润剂残留量:sizeresidue74、处理剂含量:finishlevel75、浸
润剂:size
76、偶联剂:couplintagent77、处置织物:finishedfabric78、聚酰胺纤维:
polyarmidefiber
79、聚酯纤维非织布:non-wovenpolyesterfabric80、浸渍绝缘纵纸:
impregnatinginsulationpaper
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