b350

243D-0009C-01P1/11

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ReferenceOnly

ChipCommonModeChokeCoil

DLM0NS□□□□HY2□ReferenceSpecification

ThisreferencespecificationappliestoChipCommonModeChokeCoilDLM0NSSeriesfordifferentialsignal

interfaceinElectronics.

mbering

(ex.)DLM0NSB120HY2D

(1)(2)(3)(4)(5)(6)(7)(8)(9)(10)

(1)ChipCommonModeChokeCoil

(2)Structure(M:MonolithicType)

(3)Dimension(LW)

(4)TypeS:Magneticallyshieldedonecircuittype

(5)Category

Customer

PartNumber

Murata

PartNumber

CommonModeImpedance

(at100MHz,Under

StandardTestingCondition)

Rated

Voltage

Withstanding

Voltage

Rated

Current

DC

Resistance

Insulation

Resistance

Cut-off

Frequency

DLM0NSB120HY2D

125

5V(DC)12.5V(DC)

160mA

1.225%

10M

min.

8GHz(Typ.)

DLM0NSB120HY2B

DLM0NSB280HY2D

2830%130mA

1.925%

DLM0NSB280HY2B

DLM0NSN500HY2D

5025%

5V(DC)12.5V(DC)100mA

2.725%

10M

min.

5GHz(Typ.)

DLM0NSN500HY2B

DLM0NSN900HY2D

9025%4.025%

2GHz(Typ.)

DLM0NSN900HY2B

OperatingTemperature:-40to+85CStorageTemperature:-40to+85C

rdTestingConditions

Temperature:OrdinaryTemperature15to35CTemperature:202C

Humidity:OrdinaryHumidity25to85%(RH)Humidity:60to70%(RH)

AtmosphericPressure:86to106kPa

ndDimensions

■EquivalentCircuits

Nopolarity

(6)Impedance(100MHz)

(7)CircuitH:CharacteristicImpedance100system

(8)Features

(9)NumberofLine

(10)PackagingCodeD:Taping/B:Bulk

(1)(2)

(4)(3)

Nopolarity

■UnitMass(Typicalvalue)

0.9mg

243D-0009C-01P2/11

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g

NoMarking.

icalPerformance

ecificationTestMethod

7.1CommonMode

Impedance

ingFrequency:1001MHz(10.)

MeasuringEquipment:KEYSIGHT4291Aorthe

equivalents

(我学会了什么作文400字 Incaofdoubtinstandardcondition,theheat

treatment(200C,about10min)shallbeapplied.

7.2Withstanding

Voltage

ltage:2.5timesforRatedVoltage

Time:1to5s

ChargeCurrent:1mAmax.(10.)

7.3DCResistance

(Rdc)

ingcurrent:100mAmax.(10.)

7.4Insulation

Resistance(I.R.)

Measuringvoltage:RatedVoltage

Measuringtime:1minmax.(10.)

icalPerformance

ecificationTestMethod

8.1Appearanceand

Dimensions

InspectionandmeasuredwithSlideCalipers.

8.2SolderabilityTheelectrodesshallbeatleast

95%coveredwithnewsolder

coating.

Flux:Ethanolsolutionofrosin,25(wt)%

Pre-Heating:15010C,60～90s

Solder:Sn-3.0Ag-0.5Cu

SolderTemperature:2303C

ImmersionTime:30.5s

Immersionandemersionrates:25mm/s

8.3Resistanceto

SolderingHeat

MeetTable1.

Table1

Flux:Ethanolsolutionofrosin,25(wt)%

Pre-Heating:15010C,60～90s

Solder:Sn-3.0Ag-0.5Cu

SolderTemperature:2705C

ImmersionTime:51s

Immersionandemersionrates:25mm/s

Thenmeasuredarterexposureintheroomcondition

for4hto48h.

8.4DropItshallbedroppedonconcreteorsteelboard.

Method:freefall

Height:1m

TheNumberofTimes:10times

8.5VibrationItshallbesolderedonthesubstrate.

OscillationFrequency:10to2000for20min

Totalamplitude:3.0mmorAccelerationamplitude

196m/s2whicheverissmaller.

TestingTime:Aperiodof4hoursineachof3

mutuallyperpendiculardirections.

8.6Bending

Strength

MeetTable2.

Table2

Substrate:(t=1.0mm).

Deflection:2mm

SpeedofApplyingForce:1.0mm/s

Keepingtime:60s

AppearanceNodamaged

CommonMode

Impedance

Change

within30%

I.R.

10Mmin.

DCResistance

Change

within30%

45

R230F

Deflection

45

Product

Pressurejig

AppearanceNodamaged

DCResistance

Change

within30%

243D-0009C-01P3/11

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nmentalPerformance(Productsshallbesolderedontheglass-epoxysubstrate)

ecificationTestMethod

9.1Temperature

Cycle

MeetTable1.1Cycle

Step1-40C(+0C,-3C)/30(+3,-0)min

Step2OrdinaryTemp./within3min

Step3+85(+2C,-0C)/30(+3,-0)min

Step4OrdinaryTemp./within3min

Totalof100cycles.

Thenmeasuredafterexposureintheroomcondition

for4hto48h.

9.2HumidityTemperature:402C

Humidity:90to95%(RH)

Time:1000h(+48h,-0h)

Thenmeasuredafterexposureintheroomcondition

for4hto48h.

9.3HeatlifeTemperature:852C

TestVoltage:2timesforRatedVoltage

Time:1000h(+48h,-0h)

Thenmeasuredafterexposureintheroomcondition

for4hto48h.(10.)

9.4ColdResistanceTemperature:-402C

Time:1000h(+48h,-0h)

Thenmeasuredafterexposureintheroomcondition

for4hto48h.

altobeTested.

Whenmeasuringandsupplyingthevoltage,thefollowingterminalisapplied.

rminaltobeTested

10.1CommonMode

Impedance

10.2WithstandingVoltage

InsulationResistance

HeatLife

10.3DCResistance

ingmethodforcommonmodeimpedance.

Measuredcommonmodeimpedancemaybeincludedmeasurementerrorduetostraycapacitance,residual

inductanceoftestfixture.

Tocorrectthirror,thecommonmodeimpedanceshouldbecalculateasfollows;

(1)Measureadmittanceofthefixture(opened),GoBo.

(2)Measureimpedanceofthefixture(shorted),RsXs.

(3)Measureadmittanceofthespecimen,GmBm.

(4)CalculatecorrectedimpedanceZusingtheformulabelow.

Z=(Rx2+Xx2)1/2

Where

Rx=

Gm-Go

(Gm-Go)２+(Bm-Bo)２

－Rs

Xx=

-(Bm-Bo)

(Gm-Go)２+(Bm-Bo)２

－Xs

12.P.C.B.,Flux,SolderandSolderingcondition

TestshallbedoneusingP.C.B.,Flux,SolderandSolderingconditionwhicharespecifiedinitem16exceptthe

caofbeingspecifiedspecialcondition.

ＩＮ

ＯＵＴ

ＩＮ

ＯＵＴ

ＩＮ

ＯＵＴ

ＩＮ

ＯＵＴ

243D-0009C-01P4/11

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nceFrequencyCharacteristics(Typical)

DLM0NSN500HY2

DLM0NSN900HY2

DLM0NSB120HY2

DLM0NSB280HY2

Frequency(MHz)

Frequency(MHz)

DifferentialMode

CommonMode

DifferentialMode

CommonMode

243D-0009C-01P5/11

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icationofPackagingFrequency

14.1AppearanceandDimensions(8mm-wide,2mmpitchPapertape)

14.2SpecificationofTaping

(1)Packingquantity(Standardquantity)10,000pcs./reel

(2)PackingMethod

ProductsshallbepackedinthecavityofthebatapeandaledbyCovertape.

(3)SprocketHole

Thesprocketholesaretotherightasthetapeispulledtowardtheur.

(4)Splicedpoint

Thecovertapehavenosplicedpoint.

(5)Missingcomponentsnumber

Missingcomponentsnumberwithin0.1%ofthenumberperreelor1pc.,whicheverisgreater,andarenot

cifiedquantityperreeliskept.

14.3PullStrengthofPaperTape

PaperTape5Nmin.

CoverTape10Nmin.

14.4PeelingoffforceofCoverTape

0.1to0.6N(MinimumvalueisTypical)

SpeedofPeelingoff:300mm/min.

14.5DimensionsofLeader-tape,TrailerandReel

(in:mm)

165to180degree

F

Covertape

Plastictape

Emptytape

190min.

Leader

Trailer

Toptape

2.00.5

13.00.2

21.00.8

180

60

9

131.4

1

0

0

3

Directionoffeed

210min.

160min.

1

0

Label

0

.

7

3

0

.

0

3

2.00.05

2.00.05

4.00.1

1.5+0.1

-0

1

.

7

5

0

.

1

3

.

5

0

.

0

5

8

.

0

0

.

2

引き出し方向

0.55以下

0.600.03

Directionoffeed

(in:mm)

0.770.03

0.

9

7

0.

0

3

0.8max.

＊(1)(2)(3)(4)indicates

terminalnumber

(1)

(2)

(3)

(4)

243D-0009C-01P6/11

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14.6Markingforreel

Customerpartnumber,MURATApartnumber,Inspectionnumber(∗1),RoHSmarking(∗2),Quantity,etc

∗1)ExpressionofInspectionNo.□□OOOO

(1)(2)(3)

(1)FactoryCode

(2)DateFirstdigit:Year/Lastdigitofyear

Seconddigit:Month/.→1to9,.→O,N,D

Third,Fourthdigit:Day

(3)SerialNo.

∗2)ExpressionofRoHSmarkingROHS–Y(△)

(1)(2)

(1)RoHSregulationconformityparts.

(2)MURATAclassificationnumber

14.7MarkingforOutsidepackage

CustomernamePurchasingOrderNumber,CustomerPartNumber,MURATApartnumber,

RoHSmarking(∗2),Quantity,etc

14.8SpecificationofOuterCa

OuterCaDimensions

(mm)

StandardReelQuantityinOuterCa

(Reel)

WDH

186186935

∗ndsonaquantityofanorder.

15.△!弹力产生条件 Caution

15.1MountingDirection

Mountproductsinrightdirection.

Wrongdirectionwhichis90rotatedfromrightdirectioncausnotonlyopenorshortcircuitbutalsoflamesor

otherrioustrouble.

15.2LimitationofApplications

Pleacontactusbeforeusingourproductsfortheapplicationslistedbelowwhichrequireespeciallyhigh

reliabilityforthepreventionofdefectswhichmightdirectlycaudamagetothethirdparty'slife,bodyor

property.

(1)Aircraftequipment(6)Transportationequipment(vehicles,trains,ships,etc.)

(2)Aerospaceequipment(7)Trafficsignalequipment

(3)Underaequipment(8)Disasterprevention/crimepreventionequipment

(4)Powerplantcontrolequipment(9)Data-processingequipment

(5)Medicalequipment(10)Applicationsofsimilarcomplexityand/orreliability

requirementstotheapplicationslistedintheabove.

Thisproductisdesignedforsoldermounting.(reflowsolderingonly)

Pleaconsultusinadvanceforapplyingothermountingmethodsuchasconductiveadhesive.

16.1FluxandSolder

FluxUrosin-badflux,butn春节假期法定几天 othighlyacidicflux(withchlorinecontentexceeding0.2(wt)%.)

Donotuwater-solubleflux.

SolderUSn-3.0Ag-0.5Cusolder

UofSn-Znbadsolderwilldeteriorateperformanceofproducts.

IncaofusingSn-Znbadsolder,pleacontactMuratainadvance.

16.2Asmbling

Preiphone怎么重启 -heatingshouldbeinsuchawaythatthetemperaturedifferencebetweensolderandceramicsurfaceis

limitedto100olingintosolventaftersolderingshouldbeinsuchawaythatthetemperature

differenceislimitedto100Cmax.表示声音的词语有

ＺＺ

rightdirection

wrongdirection

W

D

Label

H

243D-0009C-01P7/11

.,LTD

ReferenceOnly

16.3Resincoating

Theimpedancevaluemaychangeand/oritmayaffectontheproduct'sperformanceduetohighcure-stressof

resintobeudforcoating/

priortou,pleamakethereliabilityevaluationwiththeproductmountedinyourapplicationt.

g

ThefollowingshallbeconsideredwhendesigningandlayingoutP.C.B.'s.

(1)edesignedsothatproductsarenotsubjecttothemechanicalstressduetowarpingthe

board.

［Productsdirection］

Productsshallbelocationthesideways

Direction(Length:a

Stress.

［Wrapingdirection］

Products(wrapingdirection1,wrapingdirection

2)shallbelocatedcarefullysothatproducts

arenotsubjecttothemechanicalstressdueto

etheymaybe

subjectedthemechanicalstressinorderof

wrapingdirection1>wrapingdirection2.

(2)tion

Itiffectivetoimplementthefollowingmeasures,toreducestressinparatingtheboard.

Itisbesttoimplementallofthefollowingthreemeasures;however,implementasmanymeasures

aspossibletoreducestress.

ContentsofMeasuresStressLevel

(1)Turnthemountingdirectionofthecomponentparalleltotheboardparationsurface.A>D*1

(2)Addslitsintheboardparationpart.A>B

(3)Keepthemountingpositionofthecomponentawayfromtheboardparationsurface.A>C

*1A>DisvalidwhenstressisaddedverticallytotheperforationaswithHandSeparation.

IfaCuttingDiscisud,stresswillbediagonaltothePCB,thereforeA>Disinvalid.

(3)MountingComponentsNearScrewHoles

Whenacomponentismountednearascrewhole,itmaybeaffectedbytheboarddeflection

hecomponentinapositionasfaraway

fromthescrewholesaspossible.

〈Poorexample〉

〈Goodexample〉

b

a

b

a

b

a

〈Wrapingdirection1〉

〈Wrapingdirection2〉

ScrewHole

Recommended

D

Perforation

Slit

A

B

C

243D-0009C-01P8/11

.,LTD

ReferenceOnly

Pick-upnozzle

Supportpin

P.C.B.

Product

edesignedsothatproductsare

farfromtheportionofperforation.

Theportionofperforationshallbedesigned

asnarrowaspossible,andshallbedesigned

soasnottobeappliedthestressinthe

tion.

Productsshallnotbearrangedontheline

ofariesofholeswhentherearebig

holesinP.C.B.

(Becauthestressconcentrateonthe

lineofholes.)

SupportpinsshallbetunderP.C.B.

topreventcausingawarptoP.C.B.

duringplacingtheproductsontheother

sideofP.C.B.

otbeparatedwithhand.

g.

ng

Incaofmountingbyuofmountingmachine,pleachoonozzlewhichcanpickup

componentsof0603size.

16.7StandardLandDimensions

○

○

P.C.B.

Portionof

Perforation

Portionof

Perforation

Product

Product

P.C.B.

Hole

○

0

.

8

0

0.30

0

.

3

0

0.90

*(1)(2)(3)(4)In收获作文600字 dicatesterminalnumber

Resist

Copperfoilpattern

Nopattern

(in:mm)

(1)(2)

(4)(3)

0

.

5

0

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16.8Soldering(Reflowsoldering)

Standardsolderingprofileandthelimitsolderaabc式词语 ingprofileisasfollows.

Theexcessivelimitsolderingconditionsmaycauleachingoftheelectrodeand/orresultinginthe

deteriorationofproductquality.

StandardProfileLimitProfile

Pre-heating150～180C、90s30s

Heatingabove220C、30s～60sabove230C、60smax.

Peakt第五元素插曲 emperature2453C260C、10s

Cycleofreflow2times2times

(1)Standardprintingpatternofsolderpaste

•Standardthicknessofthesolderpasteshouldbe100to150m.

•Uthesolderpasteprintingpatternoftherightpattern.

•Fortheresistandcopperfoilpattern,ustandardlanddimensions.

•USn-3.0Ag-0.5Cusolder.

(2)ReworkingwithSolderingiron

•Thefollowingconditionsshallbestrictlyfollowedwhenusingasolderingironafterbeing

mountedbyreflowsoldering.

Pre-heating:150C,1minSolderingironoutput:30Wmax.

Tiptemperature:380Cmax.Tipdiameter:3mmmax.

Solderingtime:3(+1,-0)conds.Times:2timesmax.

•Donottouchtheproductsdirectlywiththetipofthesolderingiron.

(3)SolderVolume

Soldershallbeudnottobeexceededtheupperlimitsasshownbelow.

Accordinglyincreasingthesoldervolume,themechanicalstresstoproductisalsoincread.

Excessivesoldervolumemaycauthefailureofmechanicalorelectricalperformance.

16.9CleaningConditions

Productsshallbecleanedonthefollowingconditions.

(1)Cleaningtemperatureshallbelimitedto60Cmax.(40propylalcohol.)

(2)Ultrasoniccleaningshallcomplywiththefollowingconditions,avoidingtheresonancephenomenon

atthemountedproductsandP.C.B..

・Power:20W/lmax.・Frequency:28kHzto40kHz・Time:5minmax.

(3)Cleaner

ativecleaner•Isopropylalcohol(IPA)

sagent•PINEALPHAST-100S

(4)Thereshallbenoresidualfluxandresidualcleaneraftercleaning.

Inthecaofusingaqueousagent,productsshallbedriedcompletelyafterrinwithde-ionized

waterinordertoremovethecleaner.

(5)Othercleaning

Pleacontactus.

StandardProfile

LimitProfile

Temp.

Time

90s30s

230℃

260℃

245℃3℃

220℃

30s～60s

60smax.

180

150

(s)

(℃)

1/3T≦ｔ≦T（T:Chipthickness）

t

UpperLimit

UpperLimit

Recommendable

Recommendable

(inmm)

0.

5

0

(in:mm)

0.

3

0

0.300.300.30

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16.10Handlingofasubstrate

Aftermountingproductsonasubstrate,donotapplyanystresstotheproductcaudbybendingortwistingto

thesubstratewhencroppingthesubstrate,inrtingandremovingaconnectorfromthesubstrateortightening

screwtothesubstrate蒜蓉粉丝蒸带子 .

Excessivemechanicalstressmaycaucrackingintheproduct.

BendingTwisting

16.11OperatingEnvironment

Donotuthisproductunderthefollowingenvironmentalconditions,ondeteriorationoftheperformance,

suchasinsulationresistancemayresultfromtheu.

(1)incorrosivegas(acidicgas,alkalinegas,chlorine,sulfurgas,organicgasandetc.)

(2)intheatmospherewhereliquidsuchasorganicsolvent,maysplashontheproducts.

16.12StorageConditions

(1)Storageperiod

Utheproductswithin12monthsafterdelivered.

Solderabilityshouldbecheckedifthisperiodixceeded.

(2)Storageenvironmentcondition

•Productsshouldbestoredinthewarehouonthefollowingconditions.

Temperature:-10to+40C

Humidity:15to85%relativehumidity

Norapidchangeontemperatureandhumidity

•Productsshouldnotbestoredincorrosivegas,suchassulfureous,acidgas,alkalinegas,topreventthe

followingdeterioration.

Poorsolderabilityduetotheoxidizedelectrode.

•Productsshouldbestoredonthepaletteforthepreventionoftheinfluencefromhumidity,dustandsoon.

•Productsshouldbestoredinthewarehouwithoutheatshock,vibration,directsunlightandsoon.

•Productsshouldbestoredundertheairtightpackagedcondition.

(3)Delivery

Careshouldbetakenwhentransportingorhandlingproducttoavoidexcessivevibrationormechanicalshock.

17.△!Note

(1)Pleamakesurethatyourproducthasbeenevaluatedinviewofyourspecificationswithourproductbeing

mountedtoyourproduct.

(2)Youarerequestednottouourproductdeviatingfromthereferencespecifications.

(3)Thecontentsoftapproveour

productspecificationsortransacttheapprovalsheetforproductspecificationsbeforeordering.