Emergency stop SW pccurred.元件废弃异常。Failed in the Lar recog angle error.激光识别角度发生异常。R1-Head failed to relea component.在R1-Head中,带回了贴片元件。The gotten nozzle width does not meet that of le
苹果黄瓜汁的功效倒装工艺FC和扇出工艺FOWLP第一部分芹菜虾仁2.1引言在本章中,将倒装芯片定义为[1-4],该芯片连接到基板的焊盘或具有各种互连材料(例如,Sn-Pb,Cu,Au,Ag,Ni,In和各向同性的另一个芯片)的芯片或各向异性导电粘合剂)和方法(例如,回流焊和热压键合(TCB)),只要芯片表面(有效区域或I / O侧)面向基板或另一个芯片,如图2.1所示。整改情况报告Fig2.1 a
商贾Emergency stop SW pccurred.元件废弃异常。Failed in the Lar recog angle error.激光识别角度发生异常。R1-Head failed to relea component.在R1-Head中,带回了贴片元件。The gotten nozzle width does not meet that of
SMT专业英语翻译SMT专业英语翻译(Surface Mount Technology)IC:集成电路(INTEREGRATED CIRCUIT)resistor:电阻[ri?zist?]capacitor:电容[k??p?sit?]inductor:电感[in?d?kt?]diode:二极管[?dai?ud]transistor:三极管[tr?n?sist?]TANT:钽质电容switch:开关
SMT专业英语翻译SMT专业英语翻译(Surface Mount Technology)IC:集成电路(INTEREGRATED CIRCUIT)resistor:电阻[ri?zist?]capacitor:电容[k??p?sit?]inductor:电感[in?d?kt?]diode:二极管[?dai?ud]transistor:三极管[tr?n?sist?]TANT:钽质电容switch:开关