SEMICONDUCTOR DEVICE WITH HEAT SINK AND ULTRASONIC
专利名称:SEMICONDUCTOR DEVICE WITH HEAT SINKAND ULTRASONIC JUNCTION METHOD OFHEAT SINK她是一个废物发明人:SAKAMOTO YASUSHI,坂本 泰,KURATO KENJI,蔵藤 健二申请号:JP特願平9-93981申请日:19970411网站升级公开号:JP特開平10-289916A公开日:中国冬奥会奖牌199810
时间:2023-05-21 热度:9℃