Gold to Gold Thermosonic Flip-Chip Bonding
Gold to Gold Thermosonic Flip-Chip Bonding北京五道口L. K. Cheah, Y. M. Tan, J. Wei and C. K. WongElectronics Packaging Group, Gintic Institute of Manufacturing Technology,71 Nanyang Drive, Singapore 638075
时间:2023-05-18 热度:6℃