PTH(plated-through hole)镀覆孔
rigid printed board刚性印制板single-sided printed board单面印制板
double-sided printed board双面印制板
multilayer printed board多层印制板HDI(high density interconnect） 高密度互连
distribitive capacitive planes离散电容层
capacitive components埋容元器件
resistive components埋阻元器件
metal core printed board金属芯印制板
blind via盲孔
buried via埋孔procurement documentation采购文件AABUS(as agreed between ur and supplier)由供需双方确定space and military avionics航天和军用设备thermal stress test热应力测试
wave solder波峰焊
lective solder选择性焊接hand solder asmbly process 手工焊组装工艺reflow process再流焊工艺
lead-free无铅
customer drawing客户图纸SCP（supplier control plan)供应商控制方案
final finish最终涂覆
lective finish选择性涂覆
VP(via protection)导通孔保护WBP(wire bondable pads)金属线键合盘
AMC（active metal core） 有源金属芯
NAMC（nonactive metal core)无源金属芯
HF(external heat frame）外置散热框架
EP(embedded passives)埋入式无源器件VIP-C(via in pad,conductive fill)盘内导通孔（导电物塞孔）
VIP-N(via in pad,nonconductive fill)盘内导通孔（非导电物塞孔）Epoxy-Glass Laminate环氧玻璃布层压板Electrodeposited电解铜箔Conductor Width tolerance导体宽度公差
Conductor Spacing tolerance导体间距公差Dielectric Separation介质层间隔Lateral Conductor Separation侧向导体间距
Marking Ink标记油墨
Solder Mask阻焊膜
Solder Coating焊料涂覆层
Solderability Test可焊性测试
Isolation Resistance绝缘电阻
Laminate Material基板材料acid copper electroplating 酸性镀铜pyrophosphate copper electroplating 焦磷酸盐镀铜additive/electroless copper加成法/化学镀铜
tin-lead plate锡铅电镀
S(solder coating)焊料涂层OSP(organic solderibility prervative有机可焊性保护层
ENIG(Electorless Nickel Immersion Gold)化学镍/沉金IAg（Immersion silver）沉银
Isn（Immersion tin)沉锡
C（bare copper）裸铜interconnecting and packaging electronic circuit电子电路互连与封装micorctioning显微剖切ionizable surface contaminants表面离子污染物tensile strength and elongation，in-hou plating内部镀层的抗拉强度和延伸率测试land bond strength焊盘连接强度
bow and twist弓曲和扭曲
tape testmethod胶带测试法
rework simulation模拟返工
plated-through holes for leaded components有引线元器件的镀覆孔
coefficient of thermal expansion热膨胀系数strain Gage method应变计法TDR(Time Domain Reflectometer)时域反射计法fungus resistance耐霉性
moistrue 耐湿性
physical shock物理冲击
thermal shock热冲击
vibration震动electrical insulating compound电气绝缘化合物permanent solder mask永久性阻焊膜generic standard通用标准packaging of high speed electronic circuit高速电子电路封装high speed/frequency高频/高速
flexible ba dielectric挠性基底介质
flexible printed circuitry挠性印制电路
resin coated copper foil覆树脂铜箔Embedded passive device resistor materials埋入式无源器件电阻tin-lead alloy锡铅合金test for flammability可燃性测试bonding material（prepreg)粘接材料
heat sinks散热器photoimageable dielectric感光成像介质
bond enhancement treatment粘接增强处理foil profile铜箔轮廓resistive metal foil电阻性金属箔
master drawing布设总图
substrate基材conductive coating导电涂覆层ba metallic plating depositions基底金属电镀层via hole导通孔fud tin-lead plating锡铅熔融镀层solder coating焊料涂覆层
vertical conductor edges导体垂直边缘
electroless copper depositions化学沉积铜
plating process电镀过程
vacuum deposited metal真空沉积金属
electroless metal 化学沉积金属electrodeposited copper电镀铜
elongation延伸率fully addictive electroless copper deposition全加成法化学镀铜HASL（hot air solder leveling)热风整平
eutectic tin-lead soldering coating共晶锡铅焊料涂覆层electrodeposited nickel电镀镍
electrodeposited gold电镀金
brittle solder joints脆性焊点
XRF Spectrometry XRF光谱测定法
corrosion腐蚀ENEPIG(Electroless nickel/Electroless palladium/immersion gold化学镍钯金
anti-tarnish抗氧化
geometries几何图形
micorvias微导通孔
lar激光
mechanical drilling机械钻孔
wet/dry etching湿/干蚀刻
photo imaging光致成像
conductive ink导电油墨
polymer coating聚合物涂覆层fusing fluids and fluxes热熔液和助焊剂
heatsink planes散热面
resistor电阻
visual examination目视检查
diopter屈光度
nicks缺口
crazing微裂纹
haloing penetration晕圈渗透
breakaway tab分离槽口
measling白斑process indicator制程警示CAF(Conductive Anodic Filament)导电阳极丝delamination/blistering分层/起泡
foreign inclusions外来夹杂物particles夹杂物expod/disrupted fibers露织物
scratch/dent/tool mark划痕/压痕/加工痕迹surface void表面空洞mottle斑点
pink ring粉红圈
lifted lands连接盘起翘
lead-free无铅press-fit component压接元器件
plating adhesion镀层附着力overhang镀层突沿
workmanship工艺质量
flux residdue助焊剂残留物printed board periphery板外形
notches槽口feature tolerance特征公差ba/bilateral tolerance基准/双向公差AOI（automated optical inspection）自动光学检测hole size孔径hole pattern accuracy孔图形精度
pattern feature accuracy图形要素精度finished hole size tolerance完成孔径公差nodule结瘤annular ring and breakout孔环和孔破环pits麻点
dents凹痕
nicks缺口
pinhole针孔
splay斜孔
filleting填角法
tear drop泪滴surface mount component表面贴装元器件conductor definition导体精度
conductor imperfections导体缺陷solderable surface mount lands可焊表面贴装焊盘
rectangular surface mount lands矩形表面贴装焊盘pristine area完好区域
round surface mount lands(BGA PADS)圆形表面贴装焊盘（BGA焊盘）BGA（ball grid array)球栅阵列封装SMT(surface mount technology）表面安装技术ultrasonic(GWB-1)超声波压焊
thermosonic(GWB-2)热压焊
roughness-width cutoff粗糙度取样宽度noble metal贵金属
dewetting退润湿
nowetting不润湿
tin/lead reflow锡铅再流
expod copper露铜cap plating of filled holes塞孔的盖覆电镀
depressions/dimples凹陷/凹坑
protrusions/bumps凸起/凸块
structural integrity结构完整性
vertical cross ction垂直剖面
plating integrity镀层完整性
plating crack镀层裂缝
plating void镀层空洞circumferential plating void环状镀层空洞
