(固态)产品的质量和可靠性标准全系列(JEDEC+ASTM)-最齐全、最完整及最新版

更新时间:2023-08-10 14:35:42 阅读: 评论:0

(固态)产品的质量和可靠性标准全系列(JEDEC+ASTM)-最齐全、最完整及
最新版
(固态)产品的质量和可靠性标准全系列(JEDEC+ASTM) - 最齐全、最完整及最新版
 下⾯列出了JEDEC和ASTM产品质量和可靠性标准全系列,都是最新的及最完整的标准集, JEDEC偏重于IC和芯⽚, ASTM则是通⽤性的, 两者偏向不同但⼜可以相互借鉴参考使⽤, 具体见下⾯标准,如有任何建议及疑问可私信或微信:John-130 , 谢谢!
1. JEDEC全系列
Note:
如需要下⾯全部JEDEC标准, 请私信或微信:John-130, 当然,如有任何疑问和需求包括标准查询, 欢迎联系
16
A121A 2008(R2019)
Finishes(测试锡和锡合⾦表⾯处理中晶须⽣长的测试⽅法)
17JESD671D2018JEDEC JESD671D:2018 Device Quality Problem Analysis and Corrective Action Resolution Methodology(设备质量问题分析和纠正措施解决⽅法
18JESD74A2007(R2019)Early Life Failure Rate Calculation Procedure for Semiconductor Components (半
导体元件的早期故障率计算程序)
19JESD246A2020Customer Notification Process for Disasters(客户灾难通知流程)
20JS709C2018Definition of “Low-Halogen” For Electronic Products(电⼦产品的 "低卤素 "的定义)
21JESD22-
A109B
2011HERMETICITY(⽓密性)
22J-STD-0482014Notification Standard for Product Discontinuance(产品停产通知标准)
英语作文模板万能句型23JESD217.012016Test Methods to Characterize Voiding in Pre-SMT Ball Grid Array Packages(表征betteroff
acc
SMT前球栅阵列封装中空隙的测试⽅法)
24JESD972004
Marking, Symbols, And Labels For Identification Of Lead (Pb) Free Asmblies,
Components, And Devices - Superded By J-Std-609, August 2007(⽤于识别⽆铅组件、部件和设备的标记、符号和标签–被2007年8⽉的J-STD-609所取代)
如需要J-Std-
609请私信或
微信:John-
130
25JESD2372014Reliability Qualification of Power Amplifier Modules (功放模块可靠性鉴定)
26JESD94B2015(R2021)Application Specific Qualification Using Knowledge Bad Test Methodology(使
⽤基于知识的测试⽅法的特定应⽤资格)
27JESD2412015Procedure for Wafer-Level DC Characterization of Bias Temperature Instabilities(偏置温度不稳定性的晶圆级 DC 表征程序
28JESD85A2021Methods For Calculating Failure Rates In Units Of Fits(以FITS为单位计算故障率的
⽅法
29JESD47K2018Stress-Test-Driven Qualification of Integrated Circuits(集成电路的应⼒测试驱动的
鉴定)
30JEP1612011System Level ESD Part 1:Common Misconceptions and Recommended Basic Approaches(系统级ESD第⼀部分:常见的误解和推荐的基本⽅法)
31JESD22-
frosting
B111A
2016
Board Level Drop Test Method of Components for Handheld Electronic
Products(⼿持式电⼦产品元件的板级跌落测试⽅法)
32JESD69C2017Information Requirements for the Qualification of Silicon Devices( 硅器件资格认证
的信息要求)
33J-STD-0462016Customer Notification Standard for Product-Process Changes by Electronic Product Suppliers (电⼦产品供应商产品⼯艺变更的客户通知标准)
34JESD22-
A104F
2020Temperature Cycling(温度循环)
35JESD22-
B116B
2017Wire Bond Shear Test Method(引线键合剪切测试⽅法)
36JESD50C2018Special Requirements for Maverick Product Elimination and Outlier Management (Maverick 产品排除和异常品管理的特殊要求)
37JESD22-
B105E
2018Lead Integrity(引线完整性)
rain cats and dogs38JESD201A2008(R2020)Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finishes (锡和锡合⾦表⾯处理的锡须敏感性的环境验收要求)
39JESD214.012017
Constant-Temperature Aging Method to Characterize Copper Interconnect Metallization for Stress-Induced Voiding (⽤于表征应⼒诱导空洞的铜互连⾦属化的恒
温⽼化⽅法)
Evaluation Procedure for Determining Capability to Bottom Side Board Attach by
No Document
#
Issued Date Title Remarks
40JESD22-A111B 2018Evaluation Procedure for Determining Capability to Bottom Side Board Attach by
Full Body Solder Immersion of Small Surface Mount Solid State Devices(通过⼩型表⾯安装固态器件的全⾝焊锡浸⼊确定底部侧板连接能⼒的评估程序
41JESD22-B103B.01
2016Vibration, Variable Frequency(振动,变频)
42
JESD22-A117E
2018
Electrically Erasable Programmable ROM (EEPROM) Program Era Endurance
and Data Retention Stress Test(电可擦除可编程 ROM (EEPROM) 程序擦除耐久性和
数据保留压⼒测试)
43JESD659C
2017
Failure-Mechanism-Driven Reliability Monitoring (故障机制驱动的可靠性监控)44JEP143D 2019
Solid-State Reliability Asssment and Qualification Methodologies (固体可靠性评
估和鉴定⽅法 )
45JEP001-1A 2018
Foundry Process Qualification Guidelines – Backend Of Line (芯⽚⼯⼚⼯艺资格指
南 – ⽣产线后端)
46JEP155B 2018
Recommended ESD Target Level for HBM Qualification(HBM认证的推荐ESD⽬标⽔
平)
47JESD91A 2003(R2016)
Method for Developing Acceleration Models for Electronic Component Failure
Mechanisms(开发电⼦元件失效机制加速模型的⽅法
48
JESD22-B112B
2018
Package Warpage Measurement of Surface-Mount Integrated Circuits at
Elevated Temperature(⾼温下的表⾯贴装集成电路的封装翘曲测量)
49JESD89-2B 2021
Test Method for Alpha Source Accelerated Soft Error Rate (Alpha 源加速软错误
率的测试⽅法
50JESD62-A 2002
OUTLIER IDENTIFICATION AND MANAGEMENT SYSTEM FOR ELECTRONIC
COMPONENTS, RESCINDED January 2009. Replaced by JESD50.
请参照JESD50
51
JESD22-A122A
2016Power Cycling(功率循环)
52JEP1782021
Electrostatic Discharge (ESD) Sensitivity Testing – Reporting ESD Withstand Levels on Datasheets(静电放电 (ESD) 灵敏度测试 – 在数据表上报告 ESD 耐受⽔平)
53JESD2262013
RF BIASED LIFE (RFBL) TEST METHOD(射频偏置寿命 (RFBL) 测试⽅法)
54JESD22-B117B 2014Solder Ball Shear(焊球剪切测试)
55JESD86A 2009(R2020)Electrical Parameters Asssment( 电参数评估)
56JESD22-B118
2011
Semiconductor Wafer and Die Backside External Visual Inspection(半导体晶圆和
芯⽚背⾯外部外观检查)
57JEP001-3A 2018
Foundry Process Qualification Guidelines – Product Level (制造⼯艺鉴定指南 - 产
品级别)
58
JESD22-A120B
2014Test Method for the Measurement of Moisture Diffusivity and Water Solubility in
Organic Materials Ud in Electronic Devices(电⼦设备中使⽤的有机材料中⽔分扩散
率和⽔溶性的测量⽅法
59
JESD22-B101Csignal
2015External Visual(外观)
60JEP001-2A 2018
FOUNDRY PROCESS QUALIFICATION GUIDELINES – FRONT END TRANSISTOR
LEVEL(芯⽚⼯⼚⼯艺资格指南 – 前端晶体管级)
61
JESD22-B115A.01
2016Solder Ball Pull(焊球拉⼒ )
62
JEP130B
2016
Guidelines for Packing and Labeling of Integrated Circuits in Unit Container
Packing (Tubes, Trays, and Tape and Reel) -单位容器包装(管、托盘和卷带)中集成电
路的包装和标签指南
63
JEP119A
2003(R2018)
Procedure for Performing SWEAT(执⾏ SWEAT 的程序)权利游戏
No
Document
#Issued Date
Title
Remarks
63JEP119A2003(R2018)Procedure for Performing SWEAT(执⾏ SWEAT 的程序)
64
JESD22-
B110B.01
2019Mechanical Shock – Device and Subasmbly(机械冲击 - 设备和组件)
65JESD22-
A107C
2013Salt Atmosphere(盐雾)
66
JESD22-
A101D.01
2021Steady-State Temperature-Humidity Bias Life Test(稳态温度-湿度偏差寿命测试)
67JESD22-
B106E
2016
Resistance to Solder Shock for Through-Hole Mounted Devices (通孔安装器件的
抗焊接冲击性 )
68JESD22-
B107D
2011(R2018)Mark Permanency(标记永久性)
69
JESD22-
A103E.01
2015High Temperature Storage Life(⾼温储存寿命)
70JS97032009IPC/JEDEC-9703: Mechanical Shock Test Guideline For Solder Joint Reliability(焊
点可靠性的机械冲击测试指南)
如需要请私信
或微信:
John-130
71JEP172A2015(R2020)Discontinuing U of the Machine Model for Device ESD Qualification (停⽌使⽤
机器模型进⾏设备 ESD 认证)
72JESD22-
A108F
2017Temperature, Bias, And Operating Life(温度,偏置和使⽤寿命)
73JESD22-
B109C
2021Flip Chip Tensile Pull(倒装芯⽚拉伸强度)
74J-STD-033D2018
IPC/JEDEC Standard For Handling, Packing, Shipping, And U Of
Moisture/Reflow Sensitive Surface-Mount Devices(对湿度/回流敏感的表⾯贴装器件
的处理、包装、运输和使⽤标准)
如需要请私信
或微信:
John-130
75JESD22-
B119
2018Mechanical Compressive Static Stress Test Method( 机械抗压静态应⼒测试法)
76JESD89-1B2021Test Method for Real-Time Soft Error Rate(实时软错误率的测试⽅法)
英语培训机构排行榜
77
JESD22-
A118B.01
2021Accelerated Moisture Resistance - Unbiad HAST(加速的耐湿性-⽆偏的HAST)
78
JESD22-
A119A
2015Low Temperature Storage Life(低温储存寿命 )
79JESD22-
A102E
2015(R2021)
Accelerated Moisture Resistance - Unbiad Autoclave (加速的耐湿性-⽆偏⾼压灭
菌器)
80JEP167A2020Characterization of Interfacial Adhesion in Semiconductor Packages (半导体封装
中界⾯粘附的表征)
81JESD22-
A110E
2015
Highly Accelerated Temperature and Humidity Stress Test (HAST) - ⾼加速温度和
湿度应⼒测试(HAST)
82JESD22-
A105D
2020Power and Temperature Cycling(功率和温度循环)
83JESD22-
B108B
2010
Coplanarity Test for Surface-Mount Semiconductor Devices( 表⾯贴装半导体器件
的共⾯性测试 )
84
JESD22-
A106B.01
2016Thermal Shock(热冲击)
85JESD22-
B100B
2003(R2016)Physical Dimensions(物理尺⼨)
86J-STD-020E2014
IPC/JEDEC Standard For Moisture/Reflow Sensitivity Classification For
Nonhermetic Surface-Mount Devices(⾮封闭式表⾯贴装设备的湿度/回流敏感性分类标
如需要请私信
或微信:
No Document
#
Issued Date Title Remarks
86J-STD-020E2014Nonhermetic Surface-Mount Devices(⾮封闭式表⾯贴装设备的湿度/回流敏感性分类标
准)
或微信:John-130
87JESD22-
A100E
2020
Cycled Temperature-Humidity-Bias with Surface Condensation Life Test (循环温
度-湿度-偏差与表⾯凝结寿命测试 )
88JEP149.012021Application Thermal Derating Methodologies(应⽤热降额⽅法)
89JEP118A2018Guidelines for GaAs MMIC PHEMT-MESFET and HBT Reliability Accelerated Life Testing (砷化镓MMIC PHEMT-MESFET和HBT可靠性加速寿命测试指南 )
90JEP148B2014(R2019)
Reliability Qualification of Semiconductor Devices Bad on Physics of Failure Risk and Opportunity Asssment(基于失效风险和机会评估物理的半导体器件可靠性
鉴定)
91JEP153A2014(R2019)Characterization and Monitoring of Thermal Stress Test Oven Temperatures(热
应⼒测试炉温度的表征和监测)
92JEP122H2016Failure Mechanisms And Models For Semiconductor Devices ( 半导体器件的失效机管理者英文
制和模型 )
93JEP156A2018Chip-Package Interaction Understanding, Identification, and Evaluation(芯⽚与封
装的相互作⽤的理解、识别和评估)
94JESD4711980(R2018)Symbol and Label for Electrostatic Sensitive Devices(静电敏感设备的符号和标签)95JEP1742016Understanding Electrical Overstress - EOS (了解电⽓过载 - EOS)
96JEP1542008(R2011)
Guideline for Characterizing Solder Bump Electromigration under Constant Current and Temperature Stress (在恒定电流和温度应⼒下表征焊点电迁移的指南)
97JEP1762018Adapter Test Board Reliability Test Guidelines(适配器测试板可靠性测试指南)
98JEP1512015
Test Procedure for the Measurement of Terrestrial Cosmic Ray Induced Destructive Effects in Power Semiconductor Devices (测量地球宇宙射线在功率半导
体器件中引起的破坏性影响的测试程序)
99JEP150.012013
Stress-Test-Driven Qualification of and Failure Mechanisms Associated with Asmbled Solid State Surface-Mount Components (与组装的固态表⾯贴装元件相
关的压⼒测试驱动的鉴定和失效机制)短期培训班
100JEP131C2018Potential Failure Mode and Effects Analysis (FMEA)-潜在的故障模式和影响分析
(FMEA)
101JEP1582009
Chip Stack with Through-Silicon Vias (TSVS):Identifying, Evaluating and Understanding Reliability I
nteractions (具有硅通孔 (TSVS) 的 3D 芯⽚堆栈:识别、
评估和理解可靠性相互作⽤)
102JEP159A2015Procedure for the Evaluation of Low-k/Metal Inter/Intra-Level Dielectric Integrity(低 k/⾦属层间/层内介电完整性评估程序)
103JEP1602011(R2016)Long-Term Storage for Electronic Solid-State Wafers, Dice, and Devices(电⼦固态
晶圆、晶粒和器件的长期储存)
104JEP1402002(R2015)Beaded Thermocouple Temperature Measurement of Semiconductor Packages
(半导体封装的珠状热电偶温度测量 )
105JEP146A2009Guidelines for Supplier Performance Rating(供应商绩效评级指南)
106JEP1702013Guidelines for Visual Inspection and Control of Flip Chip Type Components (FCxGA) - 倒装芯⽚类型组件(FCxGA)的外观检查和控制指南
107JEP1392000(R2012)
Constant Temperature Aging to Characterize Aluminum Interconnect Metallization for Stress-Induced Voiding (恒温⽼化表征铝互连⾦属化的应⼒诱发空洞
现象 )
108JEP1341998Guidelines for Preparing Customer-Supplied Background Information Relating to a Semiconductor-Device Failure Analysis (准备客户提供的与半导体器件故障分析相关
的背景信息的指南
109JESD218B.012016Solid-State Drive (SSD) Requirements and Endurance Test Method(固态硬盘
No Document
#
Issued Date Title Remarks

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