专利名称：Die attachment apparatus and method
utilizing activated forming gas
发明人：Kui Kam Lam,Pingliang Tu,Zhao Yang,Jun
数不胜数
Qi,Chun Hung Samuel Ip
申请号：US14141767
沪江考研奥巴马 诺贝尔和平奖>naughty什么意思申请日：20131227
公开号：US10399170B2
公开日：
20190903
专利内容由知识产权出版社提供brace
专利附图：
摘要：A die attachment apparatus for attaching a miconductor die onto a substrate having a metallic surface compris a material dispensing station for dispensing a
bios是什么
bonding material onto the substrate and a die attachment station for placing the miconductor die onto the bonding material which has been dispend onto the substrate. An activating gas generator positioned before the die attachment station introduces activated forming gas onto the substrate in order to reduce oxides on the substrate.
申请人：Kui Kam Lam,Pingliang Tu,Zhao Yang,Jun Qi,Chun Hung Samuel Ip
地址：Kwai Chung HK,Kwai Chung HK,Chengdu CN,Chengdu CN,Kwai Chung HK 国籍：HK,HK,CN,CN,HK
计算机专业
trigger warning代理机构：Ostrolenk Faber LLP
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>abstract是什么意思
