General Description
Mimix Broadband ’s 34.0-46.0 GHz GaAs MMIC
begin什么意思fundamental image reject mixer can be ud as an up- or down-converter. The device has a conversion loss of 7.0 dB with a 20.0 dB image rejection across the band. I and Q mixer outputs are provided and an external 90 degree hybrid is required to lect the desired sideband. This MMIC us Mimix Broadband ’s 0.15 µm GaAs PHEMT device model technology, and is bad upon electron beam lithography to ensure high repeatability and uniformity. The chip has surface passivation to protect and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM and VSAT applications.
+0.3 VDC +20.0 dBm +20.0 dBm -65 to +165 O C -55 to +125 O C
Absolute Maximum Ratings
Fundamental Image Reject Mixer 7.0 dB Conversion Loss 20.0 dB Image Rejection
+24 dBm Input Third Order Intercept 100% On-Wafer RF Testing
100% Visual Inspection to MIL-STD-883Method 2010
Features
Gate Bias Voltage (Vg)Input Power (RF Pin)Input Power (IF Pin)
Storage Temperature (Tstg)Operating Temperature (Ta)
Chip Device Layout
Electrical Characteristics (Ambient T emperature T = 25o C)
Units GHz GHz GHz GHz dB dB dB dB dBm dBc dB dB dB dBm VDC
Min.34.034.030.0DC -----15.0-----2.0
Typ.----18.010.08.07.0+12.020.011.030.030.0+24.0-0.5
元旦晚会策划Max.46.046.050.04.0---8.0------+0.1
Parameter
Frequency Range (RF) Upper Side Band Frequency Range (RF) Lower Side Band Frequency Range (LO)Frequency Range (IF)RF Return Loss (S11)IF Return Loss (S22)LO Return Loss (S33)Conversion Loss (S21)LO Input Drive (P LO )Image Rejection Isolation LO/RF Isolation LO/IF Isolation RF/IF
medium是什么意思
Input Third Order Intercept (IIP3)Gate Bias Voltage (Vg1)
Mixer Measurements
XM1002, USB Conversion Gain (6566 devices)
34
36
3840C o n v . G a i n (d B )
Max
Median
Mean
Min
XM1002, USB Image Rejection (6566 devices)
34
36
3840
I m a g e R e j e c t i o n (d B c )
Max
Median
Mean
XM1002, LSB Conversion Gain (6566 devices)
C o n v . G a i n (d B )
Max
Median
Mean
-3sigma
岗位竞聘演讲稿
XM1002, LSB Image Rejection (6566 devices)
I m a g e R e j e c t i o n (d B c )
Max
Median
Mean
lj是什么意思
RF Return Loss (dB)
3030.53131.53232.53333.53434.53535.53636.53737.53838.53939.540
小语种学什么好RF Freq (GHz)
(d B
)
LO Return Loss (dB)
3030.53131.53232.53333.53434.53535.53636.53737.53838.53939.540
LO Freq (GHz)
(d B )
Mixer Measurements (cont.)
LO to RF Isolation (dB)
minutes是什么意思
30
32
34
36
38
40
LO Freq (GHz)
(d B )
Mixer Measurements (cont.)
IF=200 MHz
IF=20 MHz IF=20 MHz
Mixer Measurements (cont.)
LO to IF Isolation (dB)
34
35
36
37
38
39
40
41
LO (GHz)
L O t o I F I s o l a t i o n (d B )
RF to IF Isolation (dB)
34
35
36
37
编程 培训机构38
39
40
41
RF (GHz)
R F t o I F I s o l a t i o n (d B )
Mechanical Drawing
Bias Arrangement
(Note: Engineering designator is 40IRM0421)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.215 mg.
Bond Pad #1 (RF)Bond Pad #2 (IF1)
Bond Pad #3 (Vg)Bond Pad #4 (LO)
Bond Pad #5 (IF2)
Bypass Capacitors
- See App Note [2]
0.5792
3
4
5
1
初中英语作文写作技巧1.6200.0
0.0
0.579hangover
(0.023) 1.210(0.048)
1.324(0.052)
0.725(0.029)
2
4
51
Vg
IF1
LO
RF
