White Paper THE CAD LIBRARY OF THE FUTURE June 2010绯闻少女第二季
ABSTRACT
如何美白脸
The electronics industry is constantly growing and introducing new technology sometimes faster than we
can keep up with. This paper reviews one of the single most important, but sometimes overlooked or taken for granted, aspects of the electronics industry—The CAD Library Land Pattern.高中语文知识点
Every electronic component requires a solder land pattern for PCB layout. The solder pattern can be placed into two categories.
1.Meet all the industry standard requirements for the sole purpo of electronic product creation
automation.
2.Fail to meet the industry standard requirements and create electronic product creation chaos.
This paper will describe the industry standard requirements so EE Engineers, PCB Designers and PCB
Asmbly Lines can fully automate their process, become more efficient and productive. Of cour, this will lead to faster product development cycles, reduction in overall costs, and reduction in error rate. If correctly implemented, you can eventually achieve elimination of duplication.
However, if you do not follow standardization, there are companies that exist that will gladly take your money
to verify whether the land patterns you created are correctly built. But, even if the component will fit the land pattern that you created, there are still other factors, like “Zero Component Rotation”, that must be considered
to automate the manufacturing process.个人电脑的英文缩写
The CAD Library of the Future will be a “One World Standard Library”, across all CAD tool platforms, that will be accepted by the electronics industry to eliminate duplication of effort and automate all of the engineering, design layout, manufacturing and asmbly process.
The following pages explain the criteria needed to create “The CAD Library of the Future”. But first, let’s meet the key players who goal is to standardize the electronics product development industry.
Author:
Tom Hausherr
EDA Library Product Manager
Mentor Graphics Corp.
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CONTENTS
guardiansSECTION PAGE
1 ABSTRACT ................................................................................................................. 1-1
1.1 Abstract ................................................................................................................................................ 1-1
2 ELECTRONIC STANDARD ORGANIZATIONS ......................................................... 2-1
2.1 Standard Organizations ....................................................................................................................... 2-1
考雅思哪个培训机构好3 LAND PATTERN NAMING CONVENTION ................................................................ 3-1 3.1 IPC-7351B SMT Standard Land Pattern Names ................................................................................ 3-1 3.2 PCB Libraries SMT Non-Standard Land Pattern Names .................................................................. 3-2 3.3 IPC-7251 Through-Hole Land Pattern Names ................................................................................... 3-3 3.
4 Connector Land Pattern Names .......................................................................................................... 3-4
3.5 Syntax Explainations ........................................................................................................................... 3-5
4 COMPONENT LEAD FORMS .................................................................................... 4-1
4.1 Standard JEDEC Component Leads ................................................................................................... 4-1
5 SOLDER JOINT TOLERANCE ................................................................................... 5-1 5.1 Component Lead Space Tolerance ..................................................................................................... 5-1
5.2 Land Pattern Pad Length Tolerance .................................................................................................... 5-2
6 SOLDER JOINT ANALYSIS ....................................................................................... 6-1
6.1 Solder Joint Toe, Heel and Side Goal ................................................................................................. 6-1
7 MANUFACTURING TOLERANCE ............................................................................. 7-1 7.1 Fabrication Tolerances ........................................................................................................................ 7-1 7.2 Asmbly Tolerances .......................................................................................................................... 7-1 7.3 Component Terminal Tolerances ........................................................................................................ 7-2
7.4 Dimension and Tolerance Analysis .................................................................................................... 7-3
8 ZERO COMPONENT ORIENTATION ........................................................................ 8-1
8.1 Pick & Place Machine Tape & Reel Orientation Requirements ........................................................ 8-1
9 LAND PATTERN ORIGIN ........................................................................................... 9-1 9.1 CAD Library Part Origins ................................................................................................................... 9-1
9.2 Sample Pictures of Land Pattern Origins ............................................................................................ 9-1
安徽二级建造师培训
10 PLACEMENT COURTYARD .................................................................................... 10-1 10.1 SMT Placement Courtyard ................................................................................................................ 10-1 10.2 Sample Part Placement ...................................................................................................................... 10-1
10.3 Land Pattern . 10-2
11 SILKSCREEN OUTLINE & POLARITY .................................................................... 11-1 11.1 Silks
mirkocreen Outlines ............................................................................................................................ 11-1
11.2 Silkscreen Polarity Markings ............................................................................................................ 11-1
12 ASSEMBLY OUTLINE & POLARITY MARK ............................................................ 12-1 12.1 Asmbly Drawing Outlines ............................................................................................................. 12-1 12.2 Asmbly Polarity Marking .............................................................................................................. 12-1
13 PADSTACKS ............................................................................................................. 13-1 13.1 Surface Mount Padstack .................................................................................................................... 13-1
13.2 Through Hole Padstack ..................................................................................................................... 13-1
14 3D COMPONENT OUTLINE .................................................................................... 14-1 14.1 Component 3D Modeling .................................................................................................................. 14-1
14.2 Sample 3D Model Using Solidworks ............................................................................................... 14-2
15 IPC-7351 3-TIER LIBRARY SYSTEM ...................................................................... 15-7 15.1 The IPC-7351 3-Tier Construction ................................................................................................... 15-7
15.2 IPC-7351 Specification ..................................................................................................................... 15-8
16 IPC-2581 NEUTRAL CAD FORMAT ........................................................................ 16-1 16.1 Electronic Product Hardware Design Automation ........................................................................... 16-1 16.2 The Electronics Industry ................................................................................................................... 16-1
16.3 IPC-2581 Neutral CAD Databa Format ........................................................................................ 16-3
17 TRANSITIONING TO THE METRIC SYSTEM ......................................................... 17-4
17.1 Metrication of the PCB Design Industry ..........................................................................................
17-4
18 CONCLUSION .......................................................................................................... 18-5
1.1 Abstract
The electronics industry is constantly growing and introducing new technology幻觉的英文
sometimes faster than we can keep up with. This paper reviews one of the single most important, but sometimes overlooked or taken for granted, aspects of theajk
electronics industry—The CAD Library Land Pattern.
Every electronic component requires a solder land pattern for PCB layout. The
solder pattern can be placed into two categories.
1. Meet all the industry standard requirements for the sole purpo of electronic
product creation automation.
2. Fail to meet the industry standard requirements and create electronic product
creation chaos.
This paper will describe the industry standard requirements so EE Engineers, PCB Designers and PCB Asmbly Lines can fully automate their process, become more efficient and productive. Of cour, this will lead to faster product
development cycles, reduction in overall costs, and reduction in error rate. If
correctly implemented, you can eventually achieve elimination of duplication.
However, if you do not follow standardization, there are companies that exist that will gladly take your money to verify whether the land patterns you created are
correctly built. But, even if the component will fit the land pattern that you created, there are still other factors, like “Zero Component Rotation”, that must be
considered to automate the manufacturing process.
The CAD Library of the Future will be a “One World Standard Library”, across all
CAD tool platforms that will be accepted by the electronics industry to eliminate
duplication of effort and automate all of the engineering, design layout,
manufacturing and asmbly process.
The following pages explain the criteria needed to create “The CAD Library of the Future”. But first, let’s meet the key players who goal is to standardize the
electronics product development industry.
2
Standard component package outlines come from industry standard organizations that specialize in component packaging data and standardization of documents and publications.
The organizations include JEDEC, EIA, IEC, NIST, IPC, ANSI, EIAJ, NEMI and JEITA
2.1 Standard
Organizations
One
World
Standard
CAD
Library
