shn专利名称：Reusable encapsulation layer support plate出师表译文
and method of encapsulating OLED
substrate
苏州教育机构
发明人：Wei Wang
申请号：US14527556
申请日：20141029
公开号：US09419222B2
兴奋读音公开日：
20160816
corpus专利内容由知识产权出版社提供
idiot
专利附图：
被就业>gala
thenumberof摘要：The embodiments of the prent invention disclo a reusable encapsulation layer support plate comprising: a support plate body, the top of the support plate body
being arranged with at least one first opening for accommodating an encapsulation layer;烟台家教
a cavity arranged within the support plate body, the cavity being filled with a porous material, and the top of the cavity having at least one cond opening; wherein the first opening is connected with and arranged opposite to the cond opening, and the top surface of the porous material is parallel and level with the bottom surface of the first opening. The encapsulation layer support plate can avoid crash of OLED substrate, realize effective OLED encapsulation, and can be reud as far as possible. The embodiments of the prent invention further disclo a method of encapsulating an OLED substrate using the encapsulation layer support plate.
申请人：BOE TECHNOLOGY GROUP CO., LTD.
地址：Beijing CN
国籍：CN
代理机构：Blakely Sokoloff Taylor & Zafman, LLP
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