专利名称：Tape automated bonding in miconductor
resampletechnique
发明人：Yumoto, Kazuhito,Wakabayashi,
Norio,Nakazawa, Masao,Wakabayashi,英孚
Shinichi,Wada, Norio,Kuraishi, Fumio,Shimada,
lzgToshihiko
申请号：EP91306787.2sie
申请日：19910725
公开号：EP0468787A2
绯闻女孩第六季
公开日：
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幽魂权杖
19920129
abcd英语26个字母的读法专利内容由知识产权出版社提供
专利附图：
摘要：A tape uful for an automatic bonding process when manufacturing a high-
frequency miconductor device, the tape comprising an insulating flexible film (2), and circuit patterns (3) consisting of copper or copper-alloy formed on the insulating film, each of the circuit patterns having inner (12) and and an outer lead portions (13). A tin or tin-lead plated film (16) is formed on the pattern, and an intermediate plated film is formed on at least the outer lead portion as an underlayer. The intermediate plated film consists of a metal or metal alloy lected from nickel, cobalt, gold, silver, platinum, palladium, indium or rhodium.
respects申请人：SHINKO ELECTRIC INDUSTRIES CO. LTD.
地址：711, Aza Shariden, Oaza Kurita Nagano-shi, Nagano 380 JP
国籍：JP
代理机构：Wells, David
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