ITEM: FMEA For TO PKG CONTROL NUMBER/ISSUE: 83WHW00002A_BK TYPE: ___ DESIGN V PROCESS COMPANY : ASE Weihai
PREPARED BY: Jin Qian (Dept:process engineer / Tel :84104)FMEA DATE:Jun.3'2014
CORE TEAM: Robin Lee / RM Tang / ZL Ji /Jin Qian
Process Function/ Requirementsyxd
Machine step
Potential Failure
Mode
Potential Effect(s) of
Failure S E
white dayV
C
l
a
s
s Potential Cau(s)/ Mechanism(s) of
Failure O
C
2011湖北高考分数线C Current Process Controls
Prevention
Current Process Controls
Detection D
E
T
R
P
N
Recommended Action(s)
Responsibility &
Target Completion
Date
Actions Taken &
Effective Date
S
E
V
O
C
C
D
E
T
R
P
N wrong wafer
mapping
information
delay cycle time3
wrong mapping conversion or wrong
mapping data manually copy to machine or
wrong mapping data transport from
customer.
1
Customer nd the mapping file
to our FTP rver directlymachete
3 wafer map file check / wafer lot721None
scaryno mapping file delay cycle time3
no data download from FTP ver, no data
upload data to FTP ver, no data
transport from customer.
奥运会竞技体操项目
2
1.check mapping data on FTP
rver.
. feedback to PC team to
contact with customer
3 wafer map file check / wafer lot742None
Format transfer
incorrect
delay cycle time3
error in conversion format, encoding,
dramatize
compressing.
2
check consistency of the
conversion protocol & check
conversion software.
3 wafer map file check / wafer lot742None
wafer ID not
readable
delay cycle time3Wafer fab problem1N/A 3 wafer map file check / wafer lot721None
wafer broken Low yield5Operator mishandling1Visual aid educate operators Checked by lead girl every shift735None
Foreign material & Roughness on chuck
table
1Cleanning chuck every shift Visual inspection every wafer by
operator
530None
Operator mishandling1Visual aid educate operators Checked by lead girl every shift742None
Wafer tape mounting backside void Low yield3Operator mishandling3Visual aid educate operators
Visual inspection every wafer by
operator and de-taping
19None
wafer mapping
barcode missing
Die bonding impossible3
Mistaken by operator or transfer careless3Visual aid educate operators Visual inspection every wafer by
operator545None
wafer mapping
illegible printing
Barcode not readable in
D/B process
3
Ink or print problem2Weekly PM Visual inspection every wafer by
operator
530None
wafer mapping
barcode label
position offt
Die bond impossible3
Alignment tting problem2Visual aid educate operators Visual inspection every wafer by
operator530None
Improper saw parameter2Define sawing parameter range Checked by technician every tup
570None
chuck table type wrong2Visual aid educate operators Checked by operater every tup
228None
Chuck table surface deflection1Check the condition of chuck
(Monthly PM)
Checked by gradienter
535None
Foreign material & Roughness on chuck
table
1. Cleanning chuck every wafer
lot
Visual inspection every wafer by
operator
749None
Worn out blade1Llifetime control of saw blade Auto alarm monitor214None
Improper saw blade2Define sawing blade on the
process order
Put the blade type on the lot
card
Checked by operators every tup
570None
New blade no dressing2Put dress program into sawing
machine
Machine aotomatically t after
blade change
228None
Blade broken during sawing2Check ink die heigh before
sawing
.BBD(broken blade detecter)
228None
Improper saw blade
2
Define sawing blade on the
process order
Put the blade type on the lot
card
Checked by operators every tup
570Bar code scan Jun.30'13
Wafer burnt
Test open / short failure
wzyoule com
(low yield)
7
DI water resistivity out of spec1Resistivity limit tting Auto alarm monitor
214None
建筑工程施工合同5
Chuck table surface deflection1Check the condition of chuck
(Monthly PM)
Checked by gradienter
525None
Wrong chip size in program1Check actual chip size Skip function at least 10 times
every tup
525None
Viscosity problem of mount tape1Check C of C during incoming Check every wafer after sawing525None
No curing after mounting2Record mounting condition in lot
card
Check mounting condition every
wafer lot
550None
Sawing (only for inkless wafer)N/A Manual ink die low yield5
Ink defect units by manual and no update
quantity on wafer map after visual
inspection.
2
Take out the sawing defect units
after sawing
100% visual inspection
550None
SEMI-Auto jig jamming1Weekly PM
Process monitor by audit team1
time / shift
560None
Operators miss handling1
U manual jig or magazine for
inspection
U magazine cover
Process monitor by audit team 1
time / shift
735None
Loader, unloader, Index jaming4Monthly PM Equipment auto alarm20None
Lead frame stop on the heat block long
time (solder die bond)
2
Lead frame stop on the heat
block time control
Machine auto transfer the strips
after 3 minutes
224None
Improper oven condition (epoxy die bond)
2
N2 flow rate control for oven
Oven program control
Checked by operator every tup
560None
POTENTIAL FAILURE MODE AND EFFECTS ANALYSIS (FMEA)
Page :1 of 2
Wafer incoming (only for inkless wafer)
Wafer mount
Wafer mount (only for inkless wafer)
Wafer saw
Surface
contamination /
scratch
chiping / crack
kerf width
decline是什么意思N/A
Wafer manual handling
before tape mounting
Before wafer mounting
Wafer sawing
(Blade cutting duration)
LF loading
Sawing
misalignment
Chip drop
Lead frame
deformation
Leadframe
oxidation
Test open / short failure
(low yield)
Electrical failure
Electrical failure
Low yield
Low yield
low yield
Test open failure (low yield)
6
7
7
5
5
6
