Catching the Mobile Wave: Packaging is Going 3D
2008 Burn-in and Test Socket Workshop
March 9 -12, 2008丰田汽车广告歌曲
剑桥商务英语报名时间Belgacem Haba, Ph.D.
Tesra
Outline
•Introduction
•Driving forces and limitations
经济危机英语
•3-D package stacking惠特尼休斯顿死因
•3-D wafer-level stacking
手机学英语>from time to time•3-D by embedding technologies
脱产成考
•3-D in optics
•Conclusion
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03/09/2008Catching the Mobile Wave: Packaging is Going 3D 3
Packaging is the key
•About 1cm cube of silicon
•The rest is Packaging
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Mobile Phone Evolution
1970s ~$5000Voice 1980s ~$4000Voice 1990s ~$300Voice Today Free Voice, Data
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Evolution of Memory
•5MB IBM hard drive, 1956Jan 7th PR: SanDisk Announces the 12-
Gigabyte microSDHC Card –
the World's Largest Capacity Card for
Mobile Phones
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Outline
•Introduction
•Driving forces and limitations •3-D package stacking
•3-D wafer-level stacking
•3-D by embedding technologies •3-D in optics
•Conclusion
03/09/2008Catching the Mobile Wave: Packaging is Going 3D 7The Inside of Mobile Phones Display
Camera Module LEDs Substrate负鼠英文
Discretes Subsystem Connector
Mobile Phone Distribution of BOM
Mobile Phone Components IC Packaging
6%
ICs
35%
Other 22%
Displays
17%
Discretes
谷歌英文在线翻译& LEDs
4%
Connectors 3%
Substrates 5%Cameras 8%
“Off-Chip
Electronics”
热销产品Source: Portelligent, Tesra 03/09/2008Catching the Mobile Wave: Packaging is Going 3D 8
Source: ITRS & iNEMI 2007 updates
Macro Trends in Packaging 2007 ITRS & iNEMI Updates
Which way to go?
Source: ITRS Asmbly & Packaging WG, April ‘07
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Mobile Phone
Source: Portelligent 03/09/2008Catching the Mobile Wave: Packaging is Going 3D 10
