武汉翻译专利名称：Chip stack, method of fabrication thereof,
and miconductor package having the same
发明人：Jong-Joo Lee
申请号：US11710490cute什么意思
2014金球奖>kaven
jmlab申请日：20070226
公开号：US20070278657A1
在线英语
公开日：none是什么意思
打听一下
20071206
专利内容由知识产权出版社提供
专利附图：急切的
摘要：A chip stack may include a first miconductor chip and a cond miconductor chip stacked on the first miconductor chip. Each miconductor chip may have an active surface, a back surface opposite to the active surface, and a plurality of connection pads
arranged in the center of the active surface. At least one through electrode may be formed in the first miconductor chip and may be connected to at least one of the plurality of connection pads, and a portion of the at least one through electrode may be expod by the back surface of the first miconductor chip. The active surface of the first miconductor chip may be arranged to face the active surface of the cond miconductor chip. The plurality of connection pads of the first miconductor chip may be electrically connected to the plurality of connection pads of the cond miconductor chip.
申请人：Jong-Joo Lee
扇子的拼音
地址：Suwon-si KR
国籍：KR
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