artisan专利名称：Stacked microvias and method of
qqhmanufacturing same
uygur
发明人：Timothy M. Takeuchi,Sriram
Srintvasan,Sandeep B. Sanf
申请号：US11165482
申请日：20050624
公开号：US20060289202A1
princeling
公开日：
中美战略与经济对话
redeem
20061228treble
专利内容由知识产权出版社提供
专利附图：
摘要：A flip chip package may include stacked vias in which the diameter Dof the
outermost via is less than the diameter Dof the innermost via. The ratio D/D, for example,
ohmyladygagamay be 1.5 to 2.
申请人：Timothy M. Takeuchi,Sriram Srintvasan,Sandeep B. Sanf 地址：Chandler AZ US,Chandler AZ US,Chandler AZ US瑜伽瘦腿动作>伦敦奥运会吉祥物是什么
国籍：US,US,US
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