专利名称：Skew compensation for a stacked die
发明人：Khaldoon S. Abugharbieh,Daniel J. Ferris,
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III,Loren Jones,Austin H. Lea
申请号：US13438814
申请日：20120403
公开号：US09003221B1
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公开日：
20150407
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摘要：An embodiment for skew compensation for a stacked die is disclod. For an embodiment of an apparatus, an interpor has a first and a cond integrated circuit die coupled to the interpor. The first integrated circuit die includes an information
generator, a signal delay compensator, and an input/output block. The information generator is configured to determine: a first delay value for a first path of the interpor between the first integrated circuit die and the cond integrated circuit die; a cond delay value for a cond path of the interpor between the first integrated circuit die and the cond integrated circuit die; and a difference between the first delay value and the cond delay value. The signal delay compensator is coupled to receive the difference and configured to adjust a parameter of the first integrated circuit die to reduce the difference.
申请人：Khaldoon S. Abugharbieh,Daniel J. Ferris, III,Loren Jones,Austin H. Leasy什么意思
地址：Happy Valley OR US,Lakeville MN US,Aromas CA US,Los Gatos CA US
国籍：US,US,US,US
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代理人：W. Eric Webostad
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