专利名称：Semiconductor substrate reimburment system
omegle英文版>kollie发明人：野中 浩
申请号：JP特願昭60-255543
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申请日：19851114
公开号：JP特公平6-101514B2
domesticate公开日：
19941212
微笑的英文
专利内容由知识产权出版社提供
摘要：PURPOSE:To make rolling dies pitch adjusting among housing grooves for a substrate housing preci, and to prevent the damage of wafers and the displacement of pitches on the pushing-up of the wafers by a wafer push-up rod by mounting a pair of wafer holding plates, to which grooves at the same pitches as the housing grooves are formed, in a displaceable manner in the direction orthogonal to the housing grooves for the housing. CONSTITUTION:When a pair of wafer holding plates 1, 1 are lowered and the holding plates 1, 1 are positioned with the upper edge of a carrier 3 by positioning plates 5, feed rods 6, 6 are handled respectively and the wafer holding plates 1 are displaced in the direction orthogonal to grooves for the carrier 1 and rolling dies pitch adjusting among the grooves is conducted when displacement is generated among the grooves of the wafer holding plates 1, 1 and the carrier 3. Wafers 2 are pushed up from the carrier 3 by a push-up rod 4, and the wafers are pasd through a pair of the wafer holding plates 1 and re- erected to another carrier. Rolling dies pitch adjusting among the grooves is performed, and the wafers are re-erected, thus preventing the damage of the wafers on the pushing-up of the wafers.
文洛克申请人：九州日本電気 株式会社
地址：熊本県熊本市八幡町100番地国籍：JP
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代理人：京本 直樹
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