专利名称：Pha change thermal interface material 发明人：Duvall, James H.,Bergeron, Steve,Balian, Charles,Rogove, Arthur H.
申请号：EP00305747.8accompanying>passion是什么意思
泰坦尼克号第二结局
申请日：20000707
公开号：EP1067164A1
公开日：timode
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20010110
专利内容由知识产权出版社提供
homely摘要：A thermal interface material transfers heat from a heat source , such as a microprocessor, to a heat sink for maintaining the microprocessor at a safe operating temperature. The interface material includes thermally conductive filler particles disperd in a pha change material. The pha change material softens and flows at the operating temperature of the heat source, thereby providing good thermal contact with uneven surfaces of the heat source and heat sink, without excessive exudation and loss of the interface material. The pha change material includes a polymer component, such as an elastomer, and a melting point component, which adjusts the softening temperature of the pha change material to the operating temperature of the heat source.
否认英语申请人：Saint-Gobain Performance Plastics Corporation
地址：150 Dey Road Wayne, New Jery 07470 US
国籍：US
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代理机构：Nachshen, Neil Jacob美国音标>stray
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