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专利名称：METHOD AND DEVICE FOR HEAT ADHESION OF RESIN PACKING MATERIAL
发明人：YAMAMOTO YOSHIHARUpity
申请号：JP31934890the ring
unistore
国庆的诗申请日：19901122
1636公开号：JPH04189721A
公开日：
首尔表演艺术高中19920708
running专利内容由知识产权出版社提供jason williams
摘要：PURPOSE:To prevent deformation of a ba sheet due to heat to achieve fine packing by a method wherein a ca of resin on which a flange is formed is presd against a hole of an insulated ba board, on the edge of which a heat generating body is provided, while the flange of said ca only is being heated to thermally bond the flange of said ca to said ba sheet. CONSTITUTION:A ca 18 made of resin is inrted in a direction of an arrow E into a hole 20d of an insulated ba board 12 on a conveyor device 15 and a product 16 is inrted into a recess of the ca 18, over which a ba sheet 19 coated with resin membrane is placed, while the sheet 19 is being positioned by a guide pin 25. When the board 12 is transferred in a direction of an arrow F to a specified position by the device 13, a movable connector 22 is connected to a fixed connector 14 to energize a heat generating body 21 and at the same time a push device 15 lowers a push plate 25 in a direction of an arrow G so that the sheet 19 is presd against the body 21. The heat generated by the body 21 heats a limited area L near a flange 18a, whereby a part of the flange in the thickness direction is melted so that the flange 18a is thermally bonded to the sheet 19.
sonim
申请人：TAMAPATSUKU KK
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