Thermal link

更新时间:2023-06-28 11:19:23 阅读: 评论:0

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tough是什么意思专利名称:Thermal link
发明人:Joph M. Daszkowski 申请号:US06/824834
申请日:19860131
公开号:US04689720A
公开日:
英语机构加盟
日程表英文19870825
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英语阅读
摘要:A thermal link provides a thermal path between a heat source and a heat sink which compensates for irregularities on the surface of the heat source and/or heat sink and/or nonuniformity in the spacing therebetween. One embodiment utilizes a spring metal device having a free arm which allows the link to align itlf under low pressure so that it is in intimate contact with both the heat source and heat sink. Another embodiment utilizes an elastomeric material filled with thermally conducting particles to form a mat that has a plurality of raid ctions having air spaces between each of the ctions. The raid areas deform under low pressure by expanding laterally into the air spaces to conform to the space between the heat source and the heat sink.
申请人:FAIRCHILD WESTON SYSTEMS, INC.
代理机构:Lowe, Price, LeBlanc, Becker & Shur
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