winny专利名称:Thermally conductive electrically resistive
diamond filled epoxy adhesive
发明人:Lee, Chune,Bradley, Susan Jane,Lee, James
C.K.
申请号:EP89306756.1
申请日:19890704
decision的用法公开号:EP0379773A1
birthdate公开日:
19900801
backpack专利内容由知识产权出版社提供
pssp专利附图:
摘要:A diamond particle filled epoxy resin provides an adhesive with high thermal conductivity and electrical resistance. The amount of diamond filler is in the range 75 to
85% by weight. The adhesive can be ud to provide an electrically insulating, thermally conductive, bond between two elements, such as an integrated circuit chip and a metal heat sink.
营养师培训申请人:DIGITAL EQUIPMENT CORPORATIONstitched
the wedding planner地址:111 Powdermill Road Maynard Massachutts 01754-1418 US
left out
国籍:US
代理机构:Goodman, Christopher
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