winny专利名称：Thermally conductive electrically resistive
diamond filled epoxy adhesive
发明人：Lee, Chune,Bradley, Susan Jane,Lee, James
C.K.
申请号：EP89306756.1
申请日：19890704
decision的用法公开号：EP0379773A1
birthdate公开日：
19900801
backpack专利内容由知识产权出版社提供
pssp专利附图：
摘要：A diamond particle filled epoxy resin provides an adhesive with high thermal conductivity and electrical resistance. The amount of diamond filler is in the range 75 to
85% by weight. The adhesive can be ud to provide an electrically insulating, thermally conductive, bond between two elements, such as an integrated circuit chip and a metal heat sink.
营养师培训申请人：DIGITAL EQUIPMENT CORPORATIONstitched
the wedding planner地址：111 Powdermill Road Maynard Massachutts 01754-1418 US
left out
国籍：US
代理机构：Goodman, Christopher
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