专利名称：THERMALLY CONDUCTIVE UNDERFILL FORMULATIONS
发明人：WANG, Dongyi
申请号：US2008070459不适应
申请日：20080718readitlater
gre报名费>滑梯 英文公开号：WO09/012442P1
公开日：
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20090122
专利内容由知识产权出版社提供
gaga是什么意思摘要：A thermally conductive composition particularly well suited for u as an underfill composition including a curable resin and filler particles having an average diameter of less than 25 microns, wherein the filler particles are prent in an amount sufficient to provide a thermal conductivity of greater than 0.5 W/mK and a viscosity of less than 0.600 Pa. s at 90°C as measured with a 20mm parallel plate at shear rate of 30 1/s.steal
申请人：WANG, Dongyi
地址：111 Lord Drive P.O. Box 8012 Cary, NC 27512-8012 US,303 Highwood Pines Place Cary, NC 27519 US
国籍：US,US
mba学历有用吗代理机构：MURPHY, Edward, F.
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