专利名称：ADVANCED PROCESS CONTROL (APC) OF COPPER THICKNESS FOR CHEMICAL
MECHANICAL PLANARIZATION(CMP)
好莱坞电影明星>niorityOPTIMIZATION
圣诞色发明人：CHRISTIAN, Craig, William,STICE, James, Clayton
申请号：US2002028982
申请日：20020912
公开号：WO03/060990P1
公开日：
福州新东方
promptly20030724gulf of mexico
谷歌英语在线翻译
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摘要：A method is provided that compris forming a copper ed layer (335) on a workpiece (300) and measuring the uniformity of the copper ed layer (335) on the workpiece (300). The method further compris applying the uniformity measurement to modify processing to form a copper layer (425) having a desired uniformity profile for incread planarization in subquent planarizing.
dance flick申请人：ADVANCED MICRO DEVICES, INC.
地址：US
国籍：US
代理机构：DRAKE, Paul, S.,PICKER, Madeline, M.
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