专利名称：Solder extrusion pressure bonding process and bonded products produced thereby 发明人：Leonard C. Beavis,Maurice M.
Karnowsky,Frederick G. Yost
申请号：US07/511684
申请日：19900420
公开号：US05121871A
公开日：
liuji
索引是什么19920616
reminded
ect是什么意思专利内容由知识产权出版社提供
kame摘要：Production of soldered joints which are highly reliable and capable of surviving 10,000 thermal cycles between about -40° C. and 110. degree. C. Process involves interposing a thin layer of a metal solder composition between the metal surfaces of members to be bonded and applying heat and up to about 1000 psi compression pressure to the superpod members, in the prence of a reducing atmosphere, to extrude the major amount of the solder composition, contaminants including fluxing gas and air, from between the members being bonded, to form a very thin, strong intermetallic bonding layer having a thermal expansion tolerant with that of the bonded members.kravitz
2012美国大选申请人：THE UNITED STATES OF AMERICA AS REPRESENTED BY THE UNITED STATES DEPARTMENT OF ENERGY
maggy代理人：Anne D. Daniel,James H. Chafin,William R. Mor
earthhour
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