FIRST STAGE CERAMIC ASSEMBLED SUBSTRATE, SECOND ST

更新时间:2023-06-25 12:28:20 阅读: 评论:0

专利名称:FIRST STAGE CERAMIC ASSEMBLED
SUBSTRATE, SECOND STAGE CERAMIC
ASSEMBLED SUBSTRATE, METHOD OF
MANUFACTURING SECOND STAGE CERAMIC
mighty rivers runASSEMBLED SUBSTRATE, AND METHOD OF
MANUFACTURING STACKED ELECTRONIC
COMPONENT
发明人:ITO, Daizo,伊登大造
申请号:JP2019/031963
establish
申请日:20190814
公开号:WO2020/045095A1
自制天然染发剂公开日:
20200305
专利内容由知识产权出版社提供专利附图:束手无策什么意思>hair lady gaga
2011年考研分数线摘要:The purpo of the prent invention is to fabricate a stacked electronic component in which i
汉堡包的英语nternal electrodes are arranged appropriately even if a stacking error has occurred in the internal electrodes at the stage of a ceramic asmbled substrate. A first-stage ceramic asmbled substrate comprising a plurality of first-stage first internal electrodes 12 arranged side by side in the X-direction with a first gap 13 therebetween having a width a, and a plurality of first-stage cond internal electrodes 15 arranged side by side in the X-direction with a cond gap 16 therebetween having a width b is fabricated and ud. The first-stage first internal electrodes 12 have, in at least one end thereof in the Y-direction, a first cutout 14 extending in the X-direction and the Y-direction and having the width b in the X-direction. The first-stage cond internal electrodes 15 have, in at least one end thereof in the Y-direction, a cond cutout 17 extending in the X-direction and the Y-direction and having the width a in the X-direction. The first-stage ceramic asmbled substrate, when en through in the Z-direction, includes a first region 18 in which the first gap 13 and the cond cutout 17 overlap each other, and a cond region 19 in which the cond gap 16 and the first cutout 14 overlap
each other.
申请人:MURATA MANUFACTURING CO., LTD.,株式会社村田製作所ienglish
地址:10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto 6178555 JP,〒6178555 京都府長岡京市東神足1丁目10番1号 Kyoto JP
在线一对一教学国籍:JP,JPspecial name
代理人:KAWAMOTO, Takashi,河本尚志
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