专利名称：TIN-LEAD ALLOY PLATING 申请号：JP12808672
mcp
五年级英语上册点读>约束是什么意思申请日：19721220
fxdis公开号：JPS5729553B2
公开日：
ending是什么意思
起源英文
19820623
rf2
专利内容由知识产权出版社提供
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阿奎莱拉摘要：1411970 Electro-depositing tin-lead alloy M & T CHEMICALS Inc 19 Dec 1972 [20 Dec 1971] 58627/72 Heading C7B Fine, white, mi-glossy Sn-Pb alloy is electodeposited on to a metal cathode from an acqueous bath containing stannous, e.g. 4-53 g/l, and lead, e.g. 1-85 g/l, ions, preferably using the fluoborate salts, and brightening agents consisting (a) at least one polyether 4-12 g/l, and (b) at least one aryl hydroxyl 0.5-1 g/l. The bath may also contain 100-200 g/l fluoboric acid and optionally 25 g/l boric acid. (a) may be a polyalkoxylated (e.g. ethoxylated) alkyl (C 5-15 ) phenol, or a N-containing aliphatic polyether of formula R 1 R 2 R 3 C-NH(C 2 H 4 O) n SO 4 M where R is a C 3-15 alkyl, n is 5-20 and M is H, Na, K or NH 4 . (b) may be optionally substituted naphthol, e.g. # or α-napthol, 2, 7-naphtholene dio, 1, 11-bi-2-naphthol, or substituted 2, 4, 6 trichlorophenol, p,p1-dihydroxydiphenylsulphone. The bath may be ud for through-hole plating in printed using barrel or rack plating, or for high speed plating on wire or strip. The plating bath may be agitated and cooled for high current densities.六级评分
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