专利名称:TIN-LEAD ALLOY PLATING 申请号:JP12808672
mcp
五年级英语上册点读>约束是什么意思申请日:19721220
fxdis公开号:JPS5729553B2
公开日:
ending是什么意思
起源英文
19820623
rf2
专利内容由知识产权出版社提供
views
阿奎莱拉摘要:1411970 Electro-depositing tin-lead alloy M & T CHEMICALS Inc 19 Dec 1972 [20 Dec 1971] 58627/72 Heading C7B Fine, white, mi-glossy Sn-Pb alloy is electodeposited on to a metal cathode from an acqueous bath containing stannous, e.g. 4-53 g/l, and lead, e.g. 1-85 g/l, ions, preferably using the fluoborate salts, and brightening agents consisting (a) at least one polyether 4-12 g/l, and (b) at least one aryl hydroxyl 0.5-1 g/l. The bath may also contain 100-200 g/l fluoboric acid and optionally 25 g/l boric acid. (a) may be a polyalkoxylated (e.g. ethoxylated) alkyl (C 5-15 ) phenol, or a N-containing aliphatic polyether of formula R 1 R 2 R 3 C-NH(C 2 H 4 O) n SO 4 M where R is a C 3-15 alkyl, n is 5-20 and M is H, Na, K or NH 4 . (b) may be optionally substituted naphthol, e.g. # or α-napthol, 2, 7-naphtholene dio, 1, 11-bi-2-naphthol, or substituted 2, 4, 6 trichlorophenol, p,p1-dihydroxydiphenylsulphone. The bath may be ud for through-hole plating in printed using barrel or rack plating, or for high speed plating on wire or strip. The plating bath may be agitated and cooled for high current densities.六级评分
更多信息请下载全文后查看