专利名称：FINE PALLADIUM ALLOY WIRE FOR SEMICONDUCTOR ELEMENT WIRE
BONDING
发明人：KITAMURA, Osamu
申请号：JP1994000449spear
申请日：19940318新东方 英语培训
给领导送礼>gre阅读公开号：WO94/021833P1
公开日：
19940929bad romance
万达 石景山专利内容由知识产权出版社提供
摘要：A fine palladium alloy wire for miconductor element wire bonding, which has a configuration superior to the looped configuration of a fine gold alloy wire and a cured junction reliability, and hence can substitute for a gold alloy bonding wire. This wire is produced from a palladium alloy comprising at most 0.0003 wt. % of each of calcium, aluminum, chromium and silicon, 0.001-0.01 wt. % of iridium, and if necessary at least either 0.001-2.0 wt. % of gold with a purity of 99.99 % or above or 0.001-5.0 wt. % of silver with a purity of 99.99 % or above, and the balance consisting of palladium with a purity of 99.99 % or above and inevitable impurities.
blenda申请人：KITAMURA, Osamudos是什么意思
虚拟语气练习地址：JP,JP
国籍：JP,JP
代理机构：ISHIDA, Takashi
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