专利名称：ARRANGEMENT AND METHOD FOR CONDITIONING A POLISHING PAD 发明人：FAUSTMANN, Peter,GLASHAUSER,英汉词典在线查询
Walter,PURATH, Andreas,UTESS, Benno 申请号：EP2002006856
english news申请日：20020620
公开号：WO03/000462P1
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公开日：
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20030103
培训专利内容由知识产权出版社提供
毅力是什么意思摘要：An in-situ measurement of thickness profiles of polishing pads (1) ud in chemical mechanical polishing (CMP) is enabled by arranging nsors (7) for measuring distances together with a conditioner (6). The nsors (7) are provided lar nsors (7a-c) performing an indirect measurement from a calibrated height level above the pad (1) surface or lar (7a-c) or ultrasonic nsors (7e) performing a direct thickness measurement from the pad surface to the pad-platen contact surface. A thickness profile (10) is obtained by co-moving the nsor (7a, 7b) with the conditioner (6) during conditioning or by leading a nsor (7c) along a guide-rail (14) above the pad surface (1) a constant distance. A reference distance measurement to the polishing platen (2) can be achieved by a cond nsor (7d) mounted at a position, where there is no pad on the platen (2), e.g. a hole or the edge. Using the arrangement a disadvantageous thickness profile (10) with a steep slope resulting in polishing inhomogeneities affecting miconductor device (4) surfaces can be detected and a warning signal be issued. A destructing micrometer measurement is not necessary, thus prolonging the pad (1) lifetime and increasing the device yield.
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申请人：FAUSTMANN, Peter,GLASHAUSER, Walter,PURATH, Andreas,UTESS, Benno 地址：DE,DE,US,DE,DE
brat国籍：DE,DE,US,DE,DE
代理机构：EPPING HERMANN FISCHER PATENTANWALTSGESELLSCHAFT MBH
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