● L ow viscosity and high tacking power stabilize ball holding
force and ensures excellent solder wettability
● Easy to wash out water-soluble ux which can be ud for Pb-free re ow soldering at 250˚C ● P revents and inhibits contamination of re ow ovens with low-volatile ux
●Mounts solder balls with good squeezing property and ball holding force
●No ux residue after washing with
warm water at 40˚C
●Low-volatile ux inhibits contamination of re ow ovens
Ball fusion and bonding
Suction head
Suction head
Suction head
Suction head
Suction head
● Washing with water within 8 hours after mounting can remove ux residue
Washed after 0h Washed after 4h Washed after 8h Washed after 12h
Washing with water
No flux residue
●Excellent wettability even on Cu-OSP PBC
WF-6317Conventional flux
R e s i d u e (%)
100
英译汉翻译
50
250
Reflow temperature (˚C)
Low-volatile flux WF-6317
Low-residue flux
Residue-free flux
● Flux residue improves joint strength by approx. 50%● Even without cleaning, volatile components do not
suppress a good under ll injection property
● Flux residue prevents cracks during long-term temperature cycle tests
●
●Maintains good adhesion with acid anhydride-bad under ll agents
●
Flux residue reinforces joints and increas joint
strength by approx. 50%
●Flux residue reinforces joints and prevents cracks
● Maintains a good under ll injection
property regardless of the transfer amount
● JPK8
Temperature cycle -40°C ↔ 125°C/after 1000 cycles
Dipping
Transfer
Join by transfer and reflow and inject underfill without cleaning
Flux residue reinforces joints, and a low amount of volatile components does not contaminate joints
Initial stage After 250 cycles After 500 cycles
Ball diameter: 0.3 mm
Temperature cycle: -4.0°C /30 min. ↔ 125°C/30 min.
Results of a temperature cycle test
Result of a JEDEC Level 3 moisture nsitivity test
30℃/60％RH 196ｈ
Comparison of joint strength after high temperature exposure
Result of a temperature cycle test
Cracks
JPK8
Solder Ball
Storage time at 150°C (h )
S t r e n b t h (N )
6
5432
10
JPK8Normal flux
●Successful development of
halogen-free ux with no-residue
●Delivers excellent solder wettability
under a rapid-heating pro le
● Halogen-free and no-residue ux keeps residue level
at 1% or lower
● Maintains excellent solder wettability under a rapid-heating pro le
● Highly compatible with under- lling materials;
leaves no void
The improved product offers even better wetting extendability than conventional product ● Highly compatible even with
under- lling materials; no formation of delamination or voids
T G [%]
T e m p [d e g C ]
Time[c]
TGA evaluation result
Evaluation method
Evaluation results
Cross ction picture
Under -filling
X-ray void check
Post re ow solder ball with no ux
Copper plate
99% or Rapid-heating
advisorIt’s measured 4 times per each bump,
and they are averaged.
Heating profile (TCB process)
T e m p [d e g C ]
300250200150100500
0 20 40 60 80 100 120
Time[c]
S o l d e r s p r e a d [u m ]
Flux
1120
1100
1080
1060
1040
product
NRF-S13
There is no delamination and void.Compatibility is good.
英文地址There is no void after flow UFalso after cure .
NRF-S14
Solder
● E xcellent sticking characteristic forms ne bumps in
each process
● Realizes excellent melting characteristic even when Type 7 or ner powder ● G ood solder wettability enables bump formation with fewer voids
●Trend towards ne pitch
教师节教师发言稿
bump bump●Pitch sizes and bump formation in various
supplying methods
●Excellent ux prevents heat sags and forms
good bumps
● Even though ne powder, still has good
wettability and forms bumps with fewer voids
●Forms good bumps even when using paste
with ne powder becau of excellent
melting property
●Forms 120 µm pitch bumps with φ4µm alloy powder
Type 7 (φ1 to 10 μm)
Type 7 or ner (φ1 to 6 μm)
120 µm pitch printing
Narrower and thinner
Mask opening size
Conventional product
Conventional product
180˚C-3min
180˚C-3min
down是什么意思
BPS ries
BPS ries
After printing Bump formation after re ow
Uniquely developed ux prevents oxidation
Type 7 or ner 90 to 150 mm pitch
Type7
110 to 180 mm pitch
Type6
160 mm pitch or more
Dry lm method
Cartridge method Open squeegee method
●Achieves void-free soldering of power devices with the vacuum re ow oven SVR-625GT
●Changing heat-evaporating materials decreas the ux residue ratio to 5% or less and realizes no-clean solder paste ●Residue-free and excellent wettability even with N re ow oven
●Residue-free mounting of ne pitch microscopic components made possible with Type 5 powder and NRB70H ●No interference with repletion of under ll
in BGA mounting
Degree of vacuum (Pa)
ø200 µm dot printing part0.4 mm pitch part0603 -type component
法航447航班
mesnger是什么
V
o
i
d
a
r
e
a
r
a
t
i
o
%
R
e
冰雹英文
s
i
d
u
e
(
%
)
100武汉口译
50
250
Reflow temperature (℃)
Low-volatile flux
Low-residue flux
Residue-free flux
NRB70
Residue-free = Residue ratio is 5% or less
(defined by SMIC)
General-purpo paste
Residue-free paste
Oxygen density: 1500 ppm or less
φ200 µm dot printing part1005 -type chip component ●Vacuum re ow oven SVR-625GT realizes void-free
and residue-free soldering
●Achieves highly reliable soldering with residue-free
and no-clean solder paste
●No cleaning liquid reduces environmental burden
and realizes lower price
