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专利名称：Thermal conduction element for miconductor devices气球的英文
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发明人：Horvath, Joph Louis
申请号：EP82105772.6
申请日：19820629buffet是什么意思
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公开号：EP0071748B1
公开日：
19870506法语 我爱你
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摘要：A disk shaped thermal bridge element (24) for u in a miconductor package to conduct heat from a miconduc- tor device (12) to a cold plate (16), which disk element has a bulged shape with a first t of inwardly extending slots (28) and a cond t of outwardly extending slots (26) emanating from the center of the disk.
申请人：International Business Machines Corporation
地址：Old Orchard Road Armonk, N.Y. 10504 US
国籍：US
代理机构：Gaugel, Heinz
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