Failure Analysis (FA) Introduction (Failure Analysis Concept)
To identify the failure mechanism of failed product.FA Concept:
Not only to confirm the failure, but trace the root caus .FA Attitude:
1) Why/What/Who/When/How it failed.2) What should we do now.3) How do we improve better.
FA Value:
1) Identification of material-related defects.
2) Solving manufacturing problems.
3) Solving rvice-related problem.
4) Providing corrective or prevention measures.
5) Providing manufacturers’insurance or legal defen/claim cas 6) To improve product design, production yield and reliability
-Failure mode
-Failure mechanism纯洁无暇
-Root cau
•Current Status (Failure rate)•Failure Mode (EFA)
•Failure Mechanism (Possible)•Failure Analysis Technology (Tools)•FA Procedure (Flowchart)•Result Consistence (Date Speak)•Time Pressure (Resource Limit)
-Large Elastic
Deformation
-Yield
-Buckling
-Brittle Fracture
-Ductile Fracture
英国国旗-Interfacial
De-adhesion
-Electromagnetic
Interference
Damage
-Electrical
Overstress
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Breakdown
Discharge
-Second
Breakdown
-Ionic
Contamination
-Single Event
Upt
-Soft Error
权威的意思-Fatigue Crack
Initiation
-Fatigue Crack
Propagation
-Creep
-
Wear
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Breakdown
Time Dependent
Dielectric
Breakdown
-Slow Trappingingreen
-Surface charge
Spreading
-Hot electrons
-Hillock
Formation
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-Contact Spiking
-Electromigration
-Diffusion
-Interdiffusion
-Corrosion
-Stress Corrosion
-Dendritic Growth
audacity-Soft Error
juniorhigh-Excessive Leakage
Currents
-
Radiation Induced
Thermal Breakdown Thermo-
mechanical
Electrical Chemical
and Radiation
DC --Open/Short: Pin Continuity/ESD Test
--Leakage: Input Buffer High/Low Current Test --ICC: Standby/Dynamic/Refresh Current Test
AC --High/Low Voltage Applied
--Data High/Low (1/0) Applied
--Pattern (Scan/Checkerboard/March) Applied --Timing (Speed) Test
DC (Direct Current): Asmbly related EFA
AC (Alternative Current): Device related EFA
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