A flexible device for encapsulating electronic com

更新时间:2023-05-27 19:50:50 阅读: 评论:0

专利名称:A flexible device for encapsulating electronic components
发明人:KARL-ERIK LEEB
申请号:AU3909993分手快乐英文
申请日:19930211
公开号:AU3909993A哲布尊丹巴
公开日:
psycholinguistics
19940829
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摘要:The prent invention relates to a device for flexibly encasing electronic circuitry, where an electronic circuit (1) is enclod in a casing which compris a laminate (2) consisting of metal and plastic sheets such as to form a diffusion impervious and electrically conductive structure which prevents harmful substances from reaching the electronic circuit (1) and also prevents inductive electromagnetic exchange. Electrical conductors (3) pass through the joint region (4) of the laminate (2).
申请人:TELEFONAKTIEBOLAGET LM ERICSSON
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