clientupdateprohibited专利名称：INTERCONNECT ARRAY PATTERN WITH A
3:1 SIGNAL-TO-GROUND RATIO
账户性质
发明人：Zhaoqing Chen,Matteo Cocchini,Rohan U.
Mandrekar,Tingdong Zhou
折损申请号：US14824125blous
pmo
申请日：20150812
公开号：US20160149611A1
经典美剧推荐
公开日：
20160526
专利内容由知识产权出版社提供
专利附图：
摘要：An electronic device including a plurality of interconnects are orthogonally arranged in a grid pattern and evenly spaced by a first distance, the plurality of
interconnects include: a first conductor pair with conductors arranged next to each other in a first direction, the first direction is oriented diagonally relative to the orthogonal grid pattern, a cond conductor pair with conductors arranged next to each other in a cond direction substantially perpendicular to the first direction, each conductor of the cond conductor pair is spaced by the first distance from each signal conductor of the first conductor pair, and a third conductor pair with conductors arranged next to each other in a third direction substantially parallel to the first direction, each conductors of the third conductor pair is spaced by the first distance from one of the signal elements of the cond conductor pair.
申请人：International Business Machines Corporation
地址：Armonk NY UStake on
英语b级真题水果硬糖 影评国籍：US
umix
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