专利名称：Methods for connecting inter-layer
conductors and components in 3D
structures
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发明人：Ryan B. Wicker,Francisco Medina,Eric
MacDonald,Danny W. Mu,David Espalin
申请号：US15185078
申请日：20160617
公开号：US10660214B2
公开日：
20200519
专利内容由知识产权出版社提供
formulate专利附图：
last name摘要：Systems and methods for creating interlayer mechanical or electrical
攀谈
attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic, or electromechanical component/device.
体恤的意思申请人：Board of Regents, The University of Texas System
地址：Austin TX US
adiemus>domain com国籍：USmy best friend 作文
中韩词典
代理机构：Yee & Associates, P.C.
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