Alpha锡膏OM340EN规格书英文版
FINE __, ZERO __1, LOW HEAD IN PILLOW DEFECT, HIGHLY PIN __E
__TION
__-340 - NO-CLEAN, LEAD-FREE SOLDER PASTE
total eclip ALPHA OM-340 is a lead-free, no-clean solder paste designed for a broad range of applications. ALPHA OM-340 provides best in class low defect rate for Head in Pillow defects combined with excellent first pass yield on ICT/pin testing. ALPHA OM-340 also yields excellent print capability performance across various board designs and, particularly, with ultra fine feature repeatability and high “through-put” applications.
Outstanding reflow process window delivers superior soldering on CuOSP with excellent coalescence on a broad range of deposit sizes, excellent random solder ball resistance and mid-chip solder ball performance. ALPHA OM-340 is formulated to deliver excellent visual joint cosmetics and best in class in circuit pin test yields. Additionally, ALPHA OM-340’s cap
ability of IPC Class III for voiding and ROL0 IPC classifications ensures maximum long-term product reliability.
1
Zero halogen is defined as no halogen is intentionally added to the formulation
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Maximizes reflow yield for lead-free processing, allowing full alloy coalescence at circular dimensions as small as 200μm (8 mil) with 100μm (4 mil) thick stencils
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Excellent print consistency with high process capability index across all board designs.
Print speeds of up to 150mm/c (6”/c), enabling a fast print cycle time and a high throughput. Wide reflow profile window with good solderability on various board / component finishes. Excellent solder and flux cosmetics after reflow soldering Best in class low defect rate for Head in Pillow Best in class in circuit pin test yield
Reduction in random solderballing levels, minimizing rework and increasing first time yield Meets highest IPC 7095 voiding performance classification of Class III Excellent reliability properties, halide-free material Compatible with either nitrogen or air reflow
Zero halogen (No halogen intentionally added to the formulation)
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SAC305 (96.5%Sn/3.0%Ag/0.5%Cu) SAC405 (95.5%Sn/4.0%Ag/0.5%Cu)
动画片大全 SACX Plus 0307 (99%Sn/0.3%Ag/0.7%Cu) SACX Plus 0807 (98.5%Sn/0.8%Ag/0.7%Cu)
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beneath InnoLot (90.95%Sn/3.8%Ag/0.7%Cu/1.4%Sb/0.15%Ni/3%Bi)
For other alloys, plea contact your local Cookson Electronics Sales Office. Type 3 (25 - 45μm per IPC J-STD-005) Type 4 (20 - 38μm per IPC J-STD-005)
Type 4.5 (Proprietary Powder Size Distribution) C available upon request Type 5 (15 -
25μm per IPC J-STD-005) C available upon request Approximately 5% by (w/w) Complies with RoHS Directive 2022年/95/EC.
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Formulated for both standard and fine pitch stencil printing, at print speeds of between 25mm/c (1”/c) and 150mm/c (6”/c), with stencil thickness of 100μm (4 mil) to 150μm (6 mil), particularly when ud with ALPHA Stencils. Blade pressures should be 0.18-0.27 kg/cm of blade (1.0 -1.5 Ibs/inch), depending upon the print speed. The higher the print speed employed, the higher the blade pressure that is required. The reflow process window will give high soldering yield with good cosmetics and minimized rework.
__ STATUS
ALPHA OM-340 is a Zero Halogen product and pass the standards listed in the Table below:
Halogen Standards
help sb do sth Standard
JEITA ET-7304
Definition of Halogen Free Soldering Materials IEC __-2-21
jamie cullum JEDEC
g开头的英文名 A Guideline for Defining “Low Halogen" Electronics
Requirement
1000 ppm Br, Cl, F in solder material solids Post Soldering Residues contain
900 ppm each or total of 1500 ppm Br or Cl from flame retardant source
Post soldering residues contain
1000 ppm Br or Cl from flame retardant source
Test Method Status
Pass
TM EN __
Pass
Pass
Zero Halogen: No halogenated compounds have been intentionally added to this product
SAFETY
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While the ALPHA OM-340 flux system is not considered toxic, its u in typical reflow will generate a small amount of reaction and decomposition vapors. The vapors should be adequately exhausted from the work area. Consult the most recent MSDS (available at ) for additional safety information.
