缩写 | 全称 | 中文 | |
CAL | Calibration | 仪教 | |
CL | Chemical Laboratory | 化验室 | |
FV | Final Visual Inspection | 最终目视检验 | |
CQE | Customer Quality Engineer | 客服工程师 | |
IPQC | In Process Quality Control | 制程品质管控 | |
IQC | Incoming Quality Control | 进料品质管控 | |
OQC | Outgoing Quality Control | 出货品质管控 | |
OQA | Outgoing Quality Assurance | 出货品质保证 | |
QA | Quality Assurance | 品质保证部 | |
REL LAB | Reliability Laboratory | 信赖性实验室 | |
QMS | Quality Management System | 品质管理系统 | |
VQA windows me | Vendor Quality Assurance | 供应商品质保证 | |
SQE | Supplier Quality Engineer | 供应商品质工程师 | |
MIS | Management Information System | 管理信息系统 | |
DCC | take youDocument Control Center | 文管中心 | |
HR | Human Resources | 人力资源部 | |
FI | Finance | 财务部 | |
MKT | Marketing | 市场营销部 | |
PUR | Purchasing | 采购部 | |
MAIN | Maintenance | 维护部 | |
GM | General Manager | 总经理 | |
GM | General Motors | 通用汽车 | |
邮编英文VP | Vice President | 副总 | |
CEO | Chief Execution Office | 执行总裁/首席执行官 | |
CFO | Chief Financial Officer | 财务总监 | |
WT | sanhe Waste Treatment | 废水处理部 | |
PPE | Pre-production Engineering | 试生产部 | 胡萝卜英语|
TD | Technology Development | 技术开发部 | |
缩写 | 全称 | 中文 | |
R&D | Rearch&Development | 研发部 | |
PE | Process Engineering | 工程部 | |
PC | Production Control | 生管部 | |
TS | Traffic&Shipping | 海关货运部 | |
ET | Electrical Test | 电性测试 | |
ENIG | Electroless Nickel and Immersion Gold | 化学镍金 | |
AOI | Automated Optical Inspection | 自动光学检测 | |
B/O | Black Oxide | 黑氧化 | |
HASL | Hot Air Soldering Level | 热风整平/喷锡 | |
PTH | Plated Through Hole | 镀通孔 | |
DF | Dry Film | 干膜 | |
DES | Develop, Etch &Stripping | 显影,蚀刻,除胶 | |
EHS | Environment Health&Safety | 环境保护部 | |
DP | Direct Plating | 直接电镀 | |
B/F | Bond Film/Brown Oxide | 棕化 | |
I/L | Inner Layer | 内层线路 | |
O/L | Outer Layer | 外层线路 | |
S/M | Solder Mask | 防焊myhappyending | |
P/P | Pattern Plating | 图形电镀aaa培训 | |
LCD | Liquid Crystal Display | 液晶显视器 | |
2nd E | Second Exposure | 二次曝光 | |
NC | Numerically Controlled | 数控钻孔 | |
二.其它缩略语 | |||
缩写 | 全称 | 中文 | |
QC | Quality Control | 品质管控 | |
QM | Quality Manual | 品质手册 | |
CIP | Continuous Improvement Project | 持续改善项目 | |
CP | Control Plan | 控制计划 | |
缩写 | 全称 | 中文 | |
ICD | Interconnection Defect | 内连缺陷问题 | |
RPN | Risk Priority Number | 风险优先顺序 | |
APQP | Advanced Product Quality Plan | 先期产品品质计划 | |
PPAP | Production Part Approval Procedure | 生产零部件核准程序 | |
AQL | Acceptable Quality Level | 品质允收水准 | |
AVL | Approved Vendor List | 合格供应商清单 | |
CPK | Process Capability Index | 制程能力指数 | |
FMEA | Failure Mode And Effect Analysis | 失效模式与效应分析 | |
IPC | The Institute For Interconnection& | 美国电子电路互连及 | |
Packaging Electronic Circuits 阅读 | 封装协会 | ||
ISO | International Organization for | 国际标准化组织 | |
Standardization/International | |||
Standard Organization | |||
JIT | Just In Time | 及时 | |
MPI | Manufacturing Process Instruction | 制程作业说明书 | |
SOP | Standard Operation Procedure | 标准操作规范 | |
SPC沪科版初中数学目录 | Statistical Process Control | 统计制程管制 | |
6 ó | 6 Sigma | 6个标准差 | |
CPCA | China Printed Circuit Association | 中国印刷电路板协会 | |
TPCA | Taiwan Printed Circuit Association | 台湾印刷电路板协会 | |
JPCA | Japan Printed Circuit Association | 日本印刷电路板协会 | |
R&R | Repeatability & Re-productivity | 重复性&再现性 | |
A/W | Artwork | 底片 | |
OP | Operation Instruction | 操作说明 | |
IPA | Isopropyl Alcohol | 异丙醇 | |
IC | Ionic Contamination | 离子污染度 | |
IC | Integrated Circuit | 集成电路 | |
BGA | Ball Grid Array | 球形栅格阵列 | |
缩写 | 全称 | 中文 | |
AA | Atomic Absorption Spectrophotometer | 原子吸收光谱仪 | |
CVS | Cyclic Voltametric Stripping | 循环伏安剥离分析仪 | |
IC | Ion Chromatography | 离子液相色谱 | |
OGP | Optical Gauging Products | 光学计量器/三次元 | |
OTD | On Time Delivery | 按时交货 | |
QP | Quality Procedure | 品质程序文件 | |
R.C | Resin Content | 胶含量 | |
R.F | Resin Flow | 胶流量 | |
SEM | Scanning Electronic Microscope | 扫描电子显微镜 | |
PP | Prepreg | 预浸材料/半固化片 | |
ACC | Accept | 接受 | |
REJ | Reject | 拒收 | |
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