专利名称：PACKAGE CONFIGURATIONS FOR LOW EMI CIRCUITS
白痴的英文发明人：WU, Yifeng西方情人节
carme
留学个人陈述申请号：EP10827654.4
scofield
申请日：20101102
公开号：EP2497109A4
公开日：暧昧的英文
chainsaw>企业内训培训
xgnyy
20170419
专利内容由知识产权出版社提供
摘要：An electronic component includes a high voltage switching transistor encad in a package. The high voltage switching transistor compris a source electrode, a gate electrode, and a drain electrode all on a first side of the high voltage switching transistor. The source electrode is electrically connected to a conducting structural portion of the package. Asmblies using the abovementioned transistor with another transistor can be formed, where the source of one transistor can be electrically connected to a conducting structural portion of a package containing the transistor and a drain of the cond transistor is electrically connected to the cond conductive structural portion of a package that hous the cond transistor. Alternatively, the source of the cond transistor is electrically isolated from its conductive structural portion, and the drain of the cond transistor is electrically isolated from its conductive structural portion.
申请人：TRANSPHORM INC.
地址：115 Castillian Drive Goleta, CA 93117 US
国籍：US
代理机构：Peterreins Schley青春向上
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