Learning Substrate Technology
From
End-customer’s Perspectives
呂宗興
Charlie Lu
increa是什么意思載板工程師應該具備的IC 封裝知識
BGA / Flip Chipoutdated
封裝可靠性測試
與載板間的關係
從使用者角度學習模具设计学校
IC載板製程技術
掉球
gjt金屬介面反應理論在IC封裝及SMT的應用
載板工程師基本訓練課程
Outline
•Wire-bonding process v.s. Flip chip process •Frequent en defect modes
–Relationship between substrate and package •Various substrate Mfg. technology
–Tenting process
–Etching back
–GPP (full body gold, double image)
–Selective gold
Wire-bonding v.s. Flip Chip
教师节快乐英文•Wire-bonding
–Die attach:
epoxy adhesives –Die attach curing
机经网–(plasma clean)
–Wire bonding
–(plasma clean)
–Molding
–Post-mold cure
–Ball mount •Flip chip
–Die attach:
solder reflow
我的幸福英文
–Flux cleaning
–Substrate baking
–plasma cleaning
–Underfilling
–Underfill curing
–(ring / lid attach or molding)
–Ball mount
Substrate
Frequent Seen Defect Modes –Substrate Related •Warpage
–Die attach failed
•Bonding pad contamination
–Stitch lift
king cobra•Substrate / mold cap delam
•Cu trace crack / Via crack
•Solder ball drop-off (missing ball)
–Either assy related or substrate related
•Solder ball pad peelingmalindi>campaigns
•Short failure due to “foreign material”
Substrate Process Overview
