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专利名称：Wafer-to-wafer bonding structure
发明人：Tae-yeong Kim,Pil-kyu Kang,Seok-ho
Kim,Kwang-jin Moon,Ho-jin Lee
mistake怎么读申请号：US15413824唇线
申请日：20170124
公开号：US09941243B2
出厂价英文公开日：
20180410
专利内容由知识产权出版社提供
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专利附图：
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摘要：A wafer-to-wafer bonding structure includes a first wafer including a first
conductive pad in a first insulating layer and a first barrier layer surrounding a lower surface and side surfaces of the first conductive pad, a cond wafer including a cond
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conductive pad in a cond insulating layer and a cond barrier layer surrounding a lower surface and side surfaces of the cond conductive pad, the cond insulating layer being bonded to the first insulating layer, and at least a portion of an upper surface of the cond conductive pad being partially or entirely bonded to at least a portion of an upper surface of the first conductive pad, and a third barrier layer between portions of the first and cond wafers where the first and cond conductive pads are not bonded to each other.
申请人：Samsung Electronics Co., Ltd.carmen electra
地址：Suwon-si, Gyeonggi-do KR
国籍：KR
代理机构：Harness, Dickey & Pierce, P.L.C.
研究生报名时间
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