专利名称：Wafer bonded virtual substrate and methodchiefly
for forming the same
boox vieweroj发明人：Harry A. Atwater, Jr.,James M. Zahler,Anna
Fontcuberta i Morral
申请号：US10761918
申请日：20040120deryck
公开号：US07238622B2
上海电脑学校公开日：
joan osborne
20070703
专利内容由知识产权出版社提供
专利附图：
摘要：A method of forming a virtual substrate comprid of an optoelectronic device substrate and handle substrate compris the steps of initiating bonding of the device
expert
pandaria>民权运动substrate to the handle substrate, improving or increasing the mechanical strength of the device and handle substrates, and thinning the device substrate to leave a single-crystal film on the virtual substrate such as by exfoliation of a device film from the device substrate. The handle substrate is typically Si or other inexpensive common substrate material, while the optoelectronic device substrate is formed of more expensive and specialized electro-optic material. Using the methodology of the invention a wide variety of thin film electro-optic materials of high quality can be bonded to inexpensive substrates which rve as the mechanical support for an optoelectronic device layer fabricated in the thin film electro-optic material.
申请人：Harry A. Atwater, Jr.,James M. Zahler,Anna Fontcuberta i Morral
地址：So. Pasadena CA US,Pasadena CA US,Paris FR
国籍：US,US,FR
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代理机构：Foley & Lardner LLP
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