MP3H6115A Rev 2, 09/2006
Freescale Semiconductor Technical Data
© Freescale Semiconductor, Inc., 2006. All rights rerved.
High Temperature Accuracy
Integrated Silicon Pressure Sensor for Measuring Absolute Pressure,On-Chip Signal Conditioned,Tem
perature Compensated and Calibrated
Freescale's MP3H6115A ries nsor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and
temperature compensation. The small form factor and high reliability of on-chip integration make the Freescale pressure nsor a logical and economical choice for the system designer.
The MP3H6115A ries piezoresistive transducer is a state-of-the-art,
monolithic, signal conditioned, silicon pressure nsor. This nsor combines advanced micromachining techniques, thin film metallization, and bipolar
miconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure.
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure nsor chip.Features •Improved Accuracy at High Temperature •Available in Super Small Outline Package • 1.5% Maximum Error over 0° to 85°C
•Ideally suited for Microprocessor or Microcontroller-Bad Systems •Temperature Compensated from -40° to +125°C
•
Durable Thermoplastic (PPS) Surface Mount Package
Application Examples •Aviation Altimeters •Industrial Controls
•Engine Control/Manifold Absolute Pressure (MAP)
•Weather Station and Weather Reporting Device Barometers
ORDERING INFORMATION
Device Type
Options
Ca No.
MPX Series Order No.
Packing Options
Marking
Basic Element Absolute, Element Only
1317MP3H6115A6U Rails
MP3H6115A Absolute, Element Only
1317MP3H6115A6T1Tape and Reel MP3H6115A Ported Element
Absolute, Axial Port 1317A MP3H6115AC6U Rails
MP3H6115A Absolute, Axial Port
1317A
MP3H6115AC6T1
Tape and Reel
MP3H6115A
MP3H6115A SERIES
INTEGRATED PRESSURE SENSOR
15 TO 115 KPA (2.2 TO 16.7 PSI)0.12 TO 2.9 VOLTS OUTPUT
NOTE:Pins 1, 5, 6, 7, and 8 are internal device
connections. Do not connect to external circuitry or ground. Pin 1 is denoted by the chamfered corner of the package.
PIN NUMBER在线课堂教学
1N/C 5N/C 2V S 6N/C 3GND 7N/C 4
V OUT
8
N/C
MP3H6115A Figure1. Fully Integrated Pressure Sensor Schematic
Pins 1, 5, 6, 7, and 8 are No Connects Sensing
Element V OUT先生们女士们
V S
Gain Stage #2
GND
and Ground
Reference
Shift
Circuitry
Thin Film
Temperature
Compensation
and
Gain Stage #1
Table1.Maximum Ratings(1)
Parametrics Symbol Value Units Maximum Pressure (P1 > P2)P max400kPa
Storage Temperature T stg-40° to +125°°C Operating Temperature T A-40° to +125°°C
Output Source Current @ Full Scale Output(2)I o+0.5mAdc
Output Sink Current @ Minimum Pressure Offt(2)I o--0.5mAdc
1.Exposure beyond the specified limits may cau permanent damage or degradation to the device.
2.Maximum Output Current is controlled by effective impedance from V out to Gnd or V out to V S in the application circuit.
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MP3H6115A
Table 2.Operating Characteristics
(V S = 3.0 Vdc, T A = 25°C unless otherwi noted, P1 > P2.)
Characteristic
Symbol Min Typ Max Unit Pressure Range P OP 15—115kPa Supply Voltage (1)V S 2.7 3.0 3.3Vdc Supply Current
I o — 4.08.0mAdc Minimum Pressure Offt (2)
(0 to 85°C)@ V S = 3.0 Volts V off 0.0790.120.161Vdc Full Scale Output (3)
(0 to 85°C)@ V S = 3.0 Volts V FSO 2.780 2.82 2.861Vdc Full Scale Span (4)
(0 to 85°C)@ V S = 3.0 Volts V FSS 2.660 2.70 2.741Vdc Accuracy (5)(0 to 85°C)
———±1.5%V FSS Sensitivity V/P —27—mV/kPa Respon Time (6)t R — 1.0—ms Warm-Up Time (7)——20—ms Offt Stability (8)
—
—
±0.25
—
%V FSS
1.Device is ratiometric within this specified excitation range.
2.Offt (V off ) is defined as the output voltage at the minimum rated pressure.
3.Full Scale Output (V FSO ) is defined as the output voltage at the maximum or full rated pressure.
4.Full Scale Span (V FSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure.
5.Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25°C due to all sources of error including the following:•Linearity:Output deviation from a straight line relationship with pressure over the specified pressure range.
•T emperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
•Pressure Hysteresis:Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum
or maximum rated pressure at 25°C.
•TcSpan:Output deviation over the temperature range of 0° to 85°C, relative to 25°C.•TcOfft:Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.6.Respon Time is defined as the time for the incremental change in the outp
ut to go from 10% to 90% of its final value when subjected to a specified step change in pressure.7.Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized.8.Offt Stability is the product's output deviation when subjected to 1000 cycles of Puld Pressure, Temperature Cycling with Bias Test.
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MP3H6115A Figure 2.Cross Sectional Diagram SSOP (not to scale)
Figure 2 illustrates the absolute nsing chip in the basic Super Small Outline chip carrier (Ca 1317).
Figure 3.Typical Application Circuit (Output Source Current Operation)
bl什么意思Figure 3 shows a typical application circuit (output source current operation).
Figure 4.Output versus Pressure Differential
englishcornerFigure 4 shows the nsor output signal relative to pressure input. Typical minimum and maximum output
curves are shown for operation over 0 to 85°C temperature range. The output will saturate outside of the rated pressure range.
A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to
be transmitted to the silicon diaphragm. The MP3H6115A ries pressure nsor operating characteristics, internal reliability and qualification tests are bad on u of dry air as the pressure media. Media other than dry air may have adver effects on nsor performance and long-term
reliability. Contact the factory for information regarding media compatibility in your application.
Wire Bond Stainless Steel
pyramid是什么意思Cap Thermoplastic
Ca
Die Bond
Sealed Vacuum Reference
Fluoro Silicone Gel Die Coat
Leadframe
Absolute Elelment
P1
Die
V S Pin 2
+3 V
GND Pin 3
V OUT Pin 4MP3H6115A
to
100 nF
51 K
47 pF
GND
O u t p u t (V o l t s )
Pressure (Reference to Sealed Vacuum) in kPa
Min
Typ
Max
Transfer Function:
V OUT = V S x (.009xP–.095) ± Error
V S
= 3.0 V DC
Temp = 0 to 85°C 3.0
2.752.52.252.01.751.51.251.00.750.50.250
5101520253035404550556065707580859095100105110115120
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MP3H6115A
Transfer Function (MP3H6115A)
Normal Transfer Value:V OUT = V S x (0.009 x P – 0.095)
± (Pressure Error x Temp. Factor x 0.009 x V S ) V S = 3.0 ± 0.3 V DC
Temperature in C°
4.0
3.0
great是什么意思
2.00.0
1.0-40
-20
gallia20
40
60
140
120
100
80
Temperature Error Factor
NOTE: The Temperature Multiplier is a linear respon from 0°C to -40°C and from 85°C to 125°C
MP3H6115A Series
Temperature Error Band
Temp
Multiplier -4030 to 851125
1.75
Break Points
Error Limits for Pressure
1.0-1.0-
2.0
0.0
2.0-
担心的英文3.0
3.0Pressure (in kPa)
P r e s s u r e E r r o r (k P a )
Pressure
Error (Max)
15 to 115 (kPa) ±1.5 (kPa)
20406080100120
Pressure Error Band
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MP3H6115A MINIMUM RECOMMENDED FOOTPRINT FOR SUPER SMALL OUTLINE PACKAGES
Surface mount board layout is a critical portion of the total design. The footprint for the miconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will lf-align when subjected to a
solder reflow process. It is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts.
Figure 5.SSOP Footprint (Ca 1317 and 1317A)
0.027 TYP 8X 0.690.053 TYP 8X 1.35
inch mm
0.3879.83
0.1503.81
0.0501.27TYP
