IPC-A-600E 中英文对照
一．外观特性（Externally Obrvable Characteristics）
1．板边（Board edges）
1.1毛刺 (Burrs)
1.2缺口 (Nicks)
1.3晕圈（Haloing）
2.基材的表面与次表面(Ba Material Surface and Subsurface) 2.1露织物/显布纹（Weave Exposure/Texture Conditions）
2.2麻点和微空洞 (Pits and Micro voids)
3.基材的次表面 (Ba Material Subsurface)
3.1白斑/龟裂 (Measling/Crazing)
3.2分层/起泡 (Delamination/Blister)
3.3外来夹杂物 (Foreign Inclusions)
4.焊料涂覆层和熔融锡铅层 (Solder Coatings and Fud Tin Lead) 4.1不润湿 (No wetting)
4.2半润湿 (De wetting)
5.镀通孔 (Holes-Plated Through)
5.1结瘤/毛刺 (Nodules/Burrs)
5.2粉红圈 (Pink Ring)
5.3铜镀层空洞 (Plating Voids- Copper Plating)
5.4成品镀覆层的镀层空洞 (Plating Voids – Finished Coating)
6.非支撑孔 (Holes Unsupported)
6.1晕圈（Haloing）
7．印制插头 (Printed Contacts)
7.1表面镀层概况 (Surface Plating – General)
7.2板边插头的毛刺 (Burrs on Edge-Board Contacts)
7.3表面镀层的附着力 (Adhesion of Over plate)
8.标记 (Marking)
9.阻焊剂（阻焊） (Solder Resist or Solder Mask)
9.1导线表面的涂覆层 (Coverage Over Conductors)
9.2对焊盘的重合度 (Registration to Lands)
9.3镀通孔焊盘以外其它图形的重合度
(Registration to Features other than PTH Lands)
9.4起泡/分层 (Blisters/Delamination)
9.5附着力（剥落或起皮） Adhesion (Flaking or Peeling)
9.6涂层漏印 (Skip Coverage)
9.7波纹/皱褶/皱纹 (Waves/Wrinkles/Ripples)
9.8掩孔（导通孔） Tenting (Via Holes)
9.9吸管式空隙 (Soda Strawing)
9.10厚度 (Thickness)
10.尺寸特性 (Dimensional Characteristics)
10.1导线宽度和间距 (Conductor Width and Spacing)
10.2孔环的测量 (Annular Ring – Measurement)
10.3支撑孔的孔环 (Annular Ring – Supported Holes)
10.4非支撑孔的孔环 (Annular Ring – Unsupported Holes)
10.5不规则形状焊盘的孔环（Annular Ring –Irregular Shaped Lands）10.6平整度 (Flatness)
二．可观测的内在特性
(Internally Obrvable Voids (outside thermal zone)
1.介质材料 (Dielectric Materials)
1.1层压空洞（受热区之外） Laminate Voids (outside thermal zone 1.2重合度/连接通孔的导体 (Registration/Conductors to Holes)
1.3非支撑隔离孔对电源层/接地层的关系
(Clearance Hole, Unsupported, to Power/Ground Planes
1.4分层/起泡 (Delamination/Blister
1.5凹蚀 (Etch back)
1.5.1正凹蚀 (Positive Etch back)
1.5.2负凹蚀 (Negative Etch back)
1.6金属层间的介质间隙 (Dielectric Material, Clearance, Metal
Planes)
1.7层间的间距 (Layer-to-layer Spacing)
1.8树脂凹缩 (Resin Recession)
2.导电图形概述 (Conductive Patterns – General)
2.1 蚀刻特性 (Etching Characteristics)
2.2标准的印制与蚀刻 (Standard Print & Etch)
2.3内层铜箔导体的列缝 (Conductor Crack – Internal Foil)
2.4外层铜箔导体的列缝 (Conductor Crack – External Foil)
2.5表面导体厚度（铜箔加镀层）
Surface Conductor Thickness (foil plus plating)
2.6内层铜箔厚度 (Foil Thickness – Internal Layers)
3.镀通孔概述 (Plated – Through – Holes – General)
3.1内层孔环 (Annular Ring – Internal Layers)
3.2焊盘起翘（显微切片）Lifted Lands – (Cross – ctions)
3.3孔壁镀层裂缝 (Plating Crack – <Barrel>)
3.4拐角镀层裂缝 (Plating Crack – <Corner>)
3.5镀层结瘤 (Plating Nodules)
3.6孔壁铜镀层厚度 (Copper Plating Thickness – Hole Wall)
3.7镀层空间(Plating Voids)
3.8焊料涂覆层厚度 (Solder Coating Thickness)
3.9芯吸作用 (Wicking)
3.9.1 有空隙的通孔的芯吸作用 (Wicking, Clearance Holes)
3.10 内层间分离-垂直的（纵向）显微切片
Inter-Plane Separation-Vertical (axial) Microction
3.11 内层间分离-水平的（横向）显微切片
Inter-Plane Separation-Horizontal (transver) Microction 4.钻孔的镀通孔 (Plated – Through – Holes – Drilled
4.1毛刺 (Burrs)
4.2钉头 (Nailheading)
5.冲孔的镀通孔 (Plated – Through – Holes – Punched)
5.1粗糙与结瘤 (Roughness and Nodules)
5.2嗽叭口 (Flare)
三．其它类型板 (Miscellaneous)
1.挠性印制电路 (Flexible Printed Circuits)
1.1.覆盖层分层 (Coverlay Delamination)
1.2.边缘修整 (Trimmed Edges)
1.3.余隙孔的重合度 (Access Hole Registration)
1.4.镀孔规范 (Plated Holes Criteria)
1.5.焊盘覆盖层(Land Coverage)
1.6.增强板的粘结 (Stiffener Bonding)
2. 刚-挠印制板 (Rigid – Flex Printed Boards)
2.1 层压缺陷 (Laminate Defects)
2.2挠性区的板边分层 (Edge Delamination – Flex Areas)
2.3刚性部分的板边缺陷 (Edge Imperfections – Rigid Section)
3. 金属芯印制板 (Metal Core Printed Boards)
3.1 分类 (Type Classifications)
3.2层压型的间距 (Spacing Laminated Type)
3.3绝缘厚度，绝缘的金属基材
(Insulation Thickness, Insulated Metal Substrate) 3.4层压型金属芯板的填充绝缘材料
(Isulation Material Fill, Laminated Type Metal Core) 3.5层压型的绝缘填料中的裂缝
(Cracks in Insulation Material Fill, Laminated Type) 3.6与镀通孔壁连接的金属芯
(Core Bond to Plated- Through –hole Wall)
4. 齐平印制板 (Flush Printed Boards)
4.1 表面导体的齐平度 (Flushness of Surface Conductor)
5. 清洁度测试 (Cleanliness Testing)
5.1 可焊性试验 (Solder ability Testing)
5.3电气完整性 (Electrical Integrity)
