专利名称：PACKAGE STRUCTURE AND PACKAGE
SUBSTRATE
发明人：Shih-Ping Hsu
申请号：US12541253
申请日：20090814
公开号：US20100052148A1
公开日：
20100304
专利内容由知识产权出版社提供
专利附图：
摘要：Provided are a package structure and a package substrate, including: a
substrate body having a plurality of matrix-arranged electrical contact pads formed on at least one su
rface thereof, wherein a solder mask layer is formed on said surface and has
a plurality of openings for exposing the electrical contact pads, respectively; a first electroless-plated layer dispod on the electrical contact pads, on the walls of the openings and at the peripheries of the openings; and a cond electroless-plated layer dispod on the first electroless-plated layer, the first and cond electroless-plated layers constituting a recesd electrical connection structure. By forming the even electroless-plated layers on the electrical contact pads. The invention overcomes drawbacks of the prior art, namely breakage of interfaces between solder bumps and electrical contact pads and even damage of the package structure otherwi caud by excessive differences in stress between the solder bumps.
申请人：Shih-Ping Hsu
地址：Taoyuan TW
国籍：TW
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