ATTACHMENT: SAMPLE PREPARATION INSTRUCTIONS
附件：样品准备说明
General
总述
SAMPLE PREPARATION Prepare samples by subjecting them to ALL operations of the specified process.
样品准备－准备之样品必须经受所有的指定的工艺流程
∙Include all etching, baking and curing steps.
包括所有蚀刻，烘烤和干燥过程。
∙Expo the samples to all maximum times, temperatures and pressures.
使样品经受所有的最长时间，最高温度和最大压力。
∙Subject samples to the maximum number of cycles specified in any step.
使样品经受任何指定步骤中的最多次循环。
Part A
章节A
BD SAMPLES –
Make certain the conductor pattern which you u to build the samples reflect your rating requirements. The include:
BD样品－务必确定样品的导线分布反映您所要求的等级，包括：
∙minimum copper thickness
最小铜厚
∙minimum conductor widths
最小导线宽度
∙maximum unpierced diameter
最大区域直径
∙minimum thickness of laminate
基材最小厚度
We will assign pattern limits bad on actual measurements of the test samples.
我们将根据您所提供的测试样品的实际尺寸来标定样品规格界限。
Attachment T1, taken from the Standard for Printed Wiring Boards, UL 796, Figure 10.1, illustrates a typical test pattern. The test pattern should appear on both sides of the samples, one side being the mirror image of the other. If you desire Recognition for singlesided printed wiring boards only, the test pattern only need appear on one side of the samples.
附件T1，取自印刷线路板标准－UL796，图10.1，图示为典型的样品测试式样。若为双面板，则双面的布线式样应互为镜像。若为单面板，则仅有一面为此布线式样。
If the maximum unpierced diameter won't fit on the test pattern, plea provide a parate t of samples. You may etch the into either a circle or a square. See Figure 10.3.
若最大直径区域在附件T1样品图中无法容下，请另外准备一组体现最大直径的样品。可以蚀刻成圆形或者正方形。参见图10.3。
COPPER THICKNESS If you plan to buy copper clad laminate with a minimum copper thickness of less than 34 microns (1 oz./square foot), you should plate your samples to 34 microns for testing purpos.
铜厚－若您将要使用的覆铜基材的铜厚小于34微米，则为了测试需要，请将您的样品铜厚镀至34微米。
In production, if you plan to plate copper to more than 102 microns thick (3 oz./square foo
t), plea provide an extra t of samples built up to your maximum copper thickness.
在实际生产中，若您使用的铜箔厚度超过102微米，请另外提供一组符合您最大铜厚的样品。
MULTILAYER CONSTRUCTION For multilayer boards, you must u the same conductor pattern on the external and internal layers. Position the unpierced areas directly over each other.
多层板结构－对于多层板，在内外层上都必须使用相同的导线分布式样。最大直径区域应互相覆盖。
We require the construction to include two or more internal conductor layers. One of the internal conductor layers must be the maximum internal conductor thickness. The sample must also include the minimum laminate (core) and prepreg thickness to be Recognized for the Printed Wiring Board Type.
我们要求的结构应包含两层或两层以上的内部导线层。其中的一层必须符合最大内层铜厚
要求。样品也必须包含申请认证的印刷线路板的基材最小厚度和半固化片最小厚度。
For additional instructions on multilayer sample construction, refer to Standard UL 796, Sections 17 and 20.
多层板样品结构的其他说明，请参照标准UL 796，第17节和第20节。
Note The board total buildup thickness should be at the thickness or within the range specified in the sample requirements.
注意 – 压合后的最小厚度应符合样品要求的最小厚度或在指定的厚度允许范围内。
PART A: ATTACHMENT T1
Figure 10.1 BD Test Pattern
BD测试样品图
A – Minimum width conductor of configuration specified by the fabricator. See note e.
PWB生产商指定布线中宽度最小的导线。见注释e 。
B – 1.6 mm (0.062 inch) wide conductor of configuration specified by the fabricator. See note e
PWB生产商指定布线中宽度为1.6mm的导线。见注释e 。
B1 – (Not Shown) one or more potential conductor widths may be included between the minimum
conductor width A and the 1.6 mm conductor width B. See note e.
可以在最小导线A和1.6mm导线B的宽度之间增加1条和多条导线（没有画出）。见注释e 。
C – 10 mm (0.375 inch) diameter unpierced circular conductora.
直径为10 mm（0.375 inch）的圆形导体a 。
D – 13 mm (0.5 inch) diameter unpierced circular conductora.
直径为13 mm(0.5inch)的圆形导体a 。
E – Maximum diameter unpierced circular conductor specified by fabricator. See note b.
PCB生产商指定的最大的圆形导体。见注释b 。
F – Edge conductor of a minimum width specified by the fabricator. Shall be within 0.4 mm (0.015 inch)
of the board edge, and not sheared at the edge. See notes a and e.
制造商制定的最小边缘导线。应距离板边缘0.4mm (0.015 inch) 内，且不切边。见注释 a，e 。
G – Plated-through holes. At least 4 plated-through holes shall be prent on the samplea. The
plated-through hole sample location is optional, but shall not contact other circuit pattern features. See note b.
镀通孔a ，至少4个镀通孔，位置不限，但不能跟其他线路图形接触。见注释b 。
H — Plated contactsa, of minimum width. See notes b and c.
有最小宽度的金手指a 。见注释b，c 。
I — Three contactsa, of maximum width. See notes b, e and e.
