SMT常用术语中英文对照
SMT常用术语&中英文对照微組裝技術﹕MPT/Microelectronic Packaging echnology
混裝技術﹕Mixed Component Mounting Technology
封裝﹕Package
貼片﹕Pick and Place
拆焊﹕Desoldering
再流﹕Reflow
浸焊﹕Dip Soldering
拖焊﹕Drag soldering
印制電路﹕Printed Circuit
印制線路﹕Printed Wiring
印制電路板﹕printed circuit board
印制線路板﹕printed wiring board
層壓板﹕laminate
覆铜銅薄层壓板﹕copper-clad laminate
基材﹕ba material
成品板﹕production board
印刷﹕printing
導電圖形﹕conductive pattern
印制元件﹕printed component
單面印制板﹕single-sided printed board
雙面印制板﹕double-sided printed board
多層印制板﹕multilayer printed board
電烙鐵﹕Iron
熱風嘴﹕hot air reflowing noozle
吸錫帶﹕soldering wick
吸錫器﹕tin extractor
焊後檢驗﹕post-soldering inspection
目視檢驗﹕visual inspection
機器檢驗﹕machine inspection
焊點質量﹕soldering joint quality
焊電缺陷﹕soldering jont defect
錯焊﹕solder wrong
漏焊﹕solder skips
虛焊﹕pudo soldering
冷焊﹕cold soldering
橋焊﹕solder bridge
脫焊﹕open soldering
焊點剝離﹕solder off
不潤濕焊點﹕soldering nonwetting
錫珠﹕solder ball
拉尖﹕icicle ；solder projection
孔洞﹕void
焊料爬越﹕solder wicking
過熱焊點﹕overheated solder connection
不飽和焊點﹕insufficient solder connection
過量焊點﹕excess solder connection
助焊劑剩余﹕flux residue
焊料裂紋﹕solder crazeing
焊角翹起﹕fillet-lifting ；lift-off
AI :Auto-Inrtion 自動插件
AQL :acceptable quality level 允收水準
ATE :automatic test equipment 自動測試
ATM :atmosphere 氣壓
BGA :ball grid array 球形矩陣
CCD :charge coupled device 監視連接元件(攝影機)
CLCC :Ceramic leadless chip carrier 陶瓷引腳載具
COB :chip-on-board 晶片直接貼附在電路板上
cps :centipois(黏度單位) 百分之一
CSB :chip scale ball grid array 晶片尺寸BGA
CSP :chip scale package 晶片尺寸構裝
CTE :coefficient of thermal expansion 熱膨脹系數
DIP :dual in-line package 雙內線包裝(泛指手插元件)
FPT :fine pitch technology 微間距技術
FR-4 :flame-retardant substrate 玻璃纖維膠片(用來製作PCB材質) IC :integrate circuit 積體電路
IR :infra-red 紅外線
Kpa :kilopascals(壓力單位)
LCC :leadless chip carrier 引腳式晶片承載器
MCM :multi-chip module 多層晶片模組
MELF :metal electrode face 二極體
MQFP :metalized QFP 金屬四方扁平封裝
NEPCON :National Electronic Package and
Production Conference 國際電子包裝及生產會議
ppm:parts per million 指每百萬PAD(點)有多少個不良PAD(點) psi :pounds/inch2 磅/英吋2
PWB :printed wiring board 電路板
QFP :quad flat package 四邊平坦封裝
SIP :single in-line package
SIR :surface insulation resistance 絕緣阻抗
SMC :Surface Mount Component 表面黏著元件
SMD :Surface Mount Device 表面黏著元件
SMEMA :Surface Mount Equipment
Manufacturers Association 表面黏著設備製造協會
SMT :surface mount technology 表面黏著技術
SOIC :small outline integrated circuit
SOJ :small out-line j-leaded package
SOP :small out-line package 小外型封裝
SOT :small outline transistor 電晶體
SPC :statistical process control 統計過程控制
SSOP :shrink small outline package 收縮型小外形封裝
TAB :tape automaticed bonding 帶狀自動結合
TCE :thermal coefficient of expansion 膨脹(因熱)係數
Tg :glass transition temperature 玻璃轉換溫度
THD :Through hole device 須穿過洞之元件(貫穿孔)
TQFP :tape quad flat package 帶狀四方平坦封裝
UV :ultraviolet 紫外線
uBGA :micro BGA 微小球型矩陣
cBGA :ceramic BGA 陶瓷球型矩陣
PTH :Plated Thru Hole 導通孔
IA Information Appliance 資訊家電產品
MESH 網目
OXIDE 氧化物
FLUX 助焊劑
LGA (Land Grid Arry)封裝技術LGA封裝不需植球，適合輕薄短小產品應用。
TCP (Tape Carrier Package)
ACF Anisotropic Conductive Film 異方性導電膠膜製程
Solder mask 防焊漆
Soldering Iron 烙鐵
Solder balls 錫球
Solder Splash 錫渣
Solder Skips 漏焊
Through hole 貫穿孔
Touch up 補焊
Briding 穚接(短路)
Solder Wires 焊錫線
Solder Bars 錫棒
Green Strength 未固化強度(紅膠)
Transter Pressure 轉印壓力(印刷)
Screen Printing 刮刀式印刷
Solder Powder 錫顆粒
Wetteng ability 潤濕能力
Viscosity 黏度
Solderability 焊錫性
Applicability 使用性
Flip chip 覆晶
Depaneling Machine 組裝電路板切割機
Solder Recovery System 錫料回收再使用系統
