THERMOMODULE

更新时间:2023-05-31 05:56:19 阅读: 评论:0

专利名称:THERMOMODULE 发明人:AZUMA IZUMI
寻梦记申请号:JP22681789
情侣香水
申请日:19890901
电脑内存怎么清理
公开号:JPH0391272A
公开日:
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疫情期间党员19910416
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专利内容由知识产权出版社提供
九日登高摘要:PURPOSE:To suppress the heat resistance of each junction low easily to enable asmbly without needing soldering work in asmbly and without being influenced by the dispersion in dimensions of individual parts by pressurizing and fastening a ries laminate of thermoelements en bloc, using a fastening stud, a disc spring, etc. CONSTITUTION:A p-type miconductor, 1, an n-type miconductor 2, a heat absorbing fin 8 also rves as the electrode at the junction of heat absorption and heat generation, and a heat sink fin 9 are stacked alternately in a line so as to constitute the ries laminate of thermoelements consisting of plural pairs, and further the whole of this laminate is pressurized and fastened in a body in the direction of lamination through a fastening stud 10, a disc spring 11, and a nut 12, whereby a thermomodule is constituted. In such constitution, by adding the specified fastening force to the stud 10 and fastening the laminate of thermoelements en bloc in the direction of its lamination, the are junctioned cloly with each other. Furthermore, even if there is dispersion of dimension in the thickness of individual parts, the pressure adding to each junction is equal, therefore so long as the lamination end face of each part is procesd flat, the parts stick fast to each other, and the thermoplastic resistance of a contact part inside each heat-conductive element can be suppresd low.
申请人:FUJI ELECTRIC CO LTD 更多信息请下载全文后查看
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