工程圖檔資料中常見的英文縮寫匯總
¾AOI : Automatic Optical Inspection 自動光學檢測
¾SMD : Surface Mount Devices 表面安裝設備
¾SMB : Surface Mount Board 表面安裝板
¾SMT : Surface Mount Technology 表面安裝技術
¾MIL : Military Standard 美國軍用標准
¾LPI : Liquid Photo Imageable Solder Mask 液態感光阻焊油
¾SMOBC : Solder Mask On Bare Copper 裸銅覆蓋阻焊工藝
¾OSP : Organic Solderability Prervative 焊錫性有機保護劑
¾PTI : Proof Tracking Index 耐電壓起痕指數
¾CTI : Comparative Tracking Index 相對漏電起痕指數
¾HASL : Hot Air Solder Leveling 噴錫HAL : Hot Air Leveling 噴錫¾PCB : Printed Circuit Board 印制電路板
¾PWB : Printed Wiring Board 印制線路板
¾CCL : Copper-clud laminat 覆銅箔層壓板
¾FPC： Flexible printed board 柔性线路板简称，又称软板
¾CAD : Computer Aided Design 計算機輔助設計
¾CAM : Computer Aided Manufacturing 計算機輔助制造
¾CAT : Computer Aided Testing 計算機輔助測試
¾PTH : Plated Through Hole 鍍通孔
¾IC : Integrated Circuit 集成線路
¾UL : Under Writers Laboratories 美國保險商實驗室
¾CNS : Chine National Standards 中國國家標准
¾BGA : Ball Grid Array 球柵陣列
¾BUM : Build-up Multilayer 積層法多層板
¾CFR : Code of Federal Regularations 聯邦法規全書
安全心得体会300字
¾AQL : Acceptable Quality Level 允收品質水准
¾LDI : Lar Direct Imaging 鐳射直接成像
¾HDI : High Density Interconnection –-Build-up Multilayer 高密度互連積層多層板
1.依照標准(in according with related standards)：
IPC : The Institute for International and Packaging Electronic Circuit美國電路互連與安裝學NEMA : National Electronic Manufacturing Association 國家電子制造協會/美國電氣制造協會
2.基本材料 ( ba material)：
natural color 自然色 external copper weight 外層銅厚copper clad覆銅箔prepreg 預浸材料（指半固化膠片）Tg rating 玻璃化溫度laminate 基板cross-ction切片cutout 切口Metal core 金屬芯
type of board 板類 (single sided 單面 double sided 雙面 multilayer 多層)
柏树叶治脱发>制度经济学epoxy glass fiber 環氧玻璃纖維flammability rating/class 防火等級
dielectric material 介質材料temperature 溫度Resin Content 膠含量Glass Transition Temperature (由”玻璃态”转化为”橡皮态”简称为TG!)
ba copper (基銅)
3.偏差及公差(deviation & tolerance) :
registration 對位(重合度) dimension (長/寬/高)尺寸大小 radius &diameter半徑/直徑hole size/aperture孔徑 width 寬度length 長度 depth深度height 高度thickness 厚度spacing間距axis軸coordinate坐標parameter參數copper foil 銅箔board outline/contour 板輪廓圖 edge to edge 邊到邊heat sink plane 散熱層stack up 疊層 $ 疊放 finish(ed) thickness 完成厚度trace = track = line = pattern = conductor ＝rail = circuit 線路
top layer 上層& bottom layer 下層 layer to layer registration 層與層對位inter layer & external layer 內層&外層clearance 空隙、間空、間隔 & gap 間隙guide hole = pilot hole導引孔tangency 切線、相接觸＆diagonal對角線、對頂線signal plane 信號層voltage plane電源層 ground plane 接地層
目标设定理论
C/S＝component side 元件面 S/S=solder side 焊接面
Primary side 主層condary side 輔層 supporting plane 支撐面Film 底片/菲林master film 主稿片artwork 底稿片master drawing布設總圖
4. 工藝（process）:
surface finishing = surface treatment = finish 表面處理hard gold 重金Entek / Flux 防氧化Immersion Ag 化银gold plating 鍍金immersion gold 沉金flash gold 閃金tin / lead plating 鍍鉛錫electroless gold (plating)（無電）鍍金nickel /gold plating 鍍鎳金HASL : Hot Air Solder Leveling 噴錫 HAL : Hot Air Leveling 噴錫NPTH : Not Plated Through Hole 非鍍通孔（非電鍍孔）Flat package type平裝型SMOBC : Solder Mask On Bare Copper 裸銅覆阻焊工藝 plug through hole 塞孔Void 空洞slot 開槽 / 槽孔 tented vias掩孔 / 導通孔 annular ring 孔環mounting hole安裝孔 tooling hole 管位孔（定位孔）wet solder mask濕膜dry film /dry solder mask干膜preflux & postflux 預塗助焊劑&後塗助焊劑
carbon ink 碳油silkscreen legend 絲印字符 non-conductive 非導電的
Permanent 耐久的Solder resist阻焊劑 & solder mask 阻焊油（膜）
Flow soldering 流焊Reflow soldering 再流焊 Wave soldering 波焊
Dip soldering 浸焊Drag soldering 曳焊Float soldering 浮焊withdrawal lacquer = peelable solder mask 藍膠
圆的容积计算公式
2. 25mm window around fiducial without solder resist
Overall diameter of solder resist free area = 6.0mm
5. 標識(marking ):
vender’s identification (賣主身份) = manufacture’s identification (制造商名)
= company name (公司名稱)
date code 生產周期 UL logo (denotation) UL標識trademark 商標type designation 型號標志 revision letter 版本字母dustbin symbol 垃圾箱標志stamp 蓋印、壓印short /open test 短/斷路測試 lia
ble to read易於辯认
6．彎曲與扭曲 (bow and twist or twist and warp )：not exceed 不超過
7. 外形（profiling）:
mechnical outline 外形圖 countersink 鑽孔route bit 鑼鑽頭
score 劃痕、刻痕、劃線 score line分割線 slot 開槽 / 槽孔& cutouts 切口panelization detail 拼板圖cosmetic =appearance外觀keepout area 保留區域breakaway rails 沖破導線array size 拼板尺寸punch 沖床
drill 鑽孔route 鑼板V-cut 切割、分割
8. 清潔度（clealiness）:
姓氏的英文
Finished circuit board shall be free of dirt ，oil ，ionic contaminates or other foreign matter which could affect solderability circuit performance ，lift or appearance 。
譯文：成品電路板應無污塵、油污、微粒污染及可能影響到阻焊性能、線路性能、翹度及外觀的異物。
9. 包裝（packaging）:
slip sheets 簿襯紙vacuum packaging 真空包裝
10. 其它（others）:
detail (詳細)appear (出現) enlarge (擴大)confirm (確認) Provide (提供) method (方法)ignore (忽視)avoid (避免) minor (較輕)major (嚴重) critical (致命性) drawn by (制作) Model (型號) Warp-wi (經向) Weft-wi (緯向) Stencil (網版) pattern (圖形) pattern (線路圖)grade 等級issued date 發行日期
corresponding (相應的)build (製作，構造) adjacent (臨近的，接近的) Indicate (指出，簡要說明) exact (精確的，準確的)accuracy (精確性，正確度) attachment (附件，附加裝置)modify (更改，修改) according to (依照) properly (適當地。完全地)dummy pad (假盤) thermal pad (散熱盤) isolation pad (孤立盤)specification 規格說明 hatching part 陰影部分production process 生產工藝 matt finish 粗化面printed contacts印制插頭thermal stress熱應力thermal shock熱沖擊repeatability 再現性
view from top 頂層府視圖 vertical view 俯視圖upward view 仰視圖
新的一年的祝福语side view 側視圖prepared by 制作Drawing No. 圖檔編號checked by (audited by) 審核approved by批
准acceptability 可接受性reproducibility 再生性traceability 可追溯性Fly probe : 飞针测试solderability 可焊性paration line (隔離線) clearance hole (隔離孔) dimensioned hole (注尺寸孔)hole location (孔位) stamp/perforated hole (郵票孔) datum reference (參考基準) fiducial mark (光學點) solder plug (焊料塞孔) Laminate para form (壓合參數表) stack up data (曡構圖)drill hole sheet (鑽孔資料單) Aspesct Ratio (纵横比) Delamination : (分层) Flip flop (鏡像排版) electroless plating (無電鍍)tenting (一銅蓋孔法) narrow/reduce 狹窄/縮小NB : notebook (笔记本电脑) MB : mainboard 主机板Fool proof method : 防呆线dielectric constant (介電常數)arc resistivity耐電弧數（弧阻）Mass production (量产) Layer-to-layer spacing (層間距) dielectric tangent 介電正切
Stamp-hole/thread hole 郵票孔layer-to-layer registration (層對準度) multilayer construction (層疊構)multilayer lay up (多層疊層)
ground plane clearance (接地層隔離)voltage plane clearance (電源層隔離)
loss tangent 損頛因數、損頛角正切non functional land (無功能連接盤)
the solder resist clearance(防焊凈空度)Manufacturing drawing (加工圖)
drill map/drill drawing/hole chart（孔圖）Lamination structure 壓合結構minimum plating thickness(電
鍍最小厚度)sold plate stripping method二銅圖形電鍍V-grooving(V-CUT) dimension/score(刻痕) cam instruction cam制作指示(OP指示) Design rule checking（DRC）設計規則檢查Characteristic impedance 特性阻抗
線路板常見不良項目術語
nick 缺口tears撕裂splay 斜孔
haloing 暈邊crazing 龜裂dent 凹坑壓痕
burnt 燒焦measling 白斑micro-void 微空洞protrusions 象牙expod copper露銅breakout 破裂
poor plating 電鍍不良skip plating漏鍍misregistration 錯位
burr 毛刺、披峰dewetting半潤濕hole pull out 孔斷裂pinhole 針孔corner crack孔緣斷裂pit 麻點
weave texture 顯布紋discoloration 變色、褪色gouge 劃溝
weave exposure 露織物mis-drilled hole鑽孔錯位fray 磨傷
Crack of foil 金屬箔裂縫Wrinkle 皺褶Lifted land 銅皮卷起breakout or flare 沖破及喇叭口 delaminatio
安全措施n 分層、爆板
blistering/bubble 起泡、冒泡foreign inclusion異物
scratch 刮花、擦傷、劃痕、刮傷 resin smear 樹脂污染
loss of adhesion 附著力喪失 pink ring 粉紅圈
projection 疤點（凸出的事物）physical damage外傷
liable to be misread 易於誤認cross-talk 漏線/交連
illegible 難讀的、難認的annular ring孔環
excessive etchback 過蝕break sharp edge破邊
breakaway tabs 突出物、凸出物 blind/buried vias肓/埋孔
foil burr (箔毛刺) hole breakout (孔破)
IPQA ENGLISH KNOWLEDGE TRAINING
(IPQA英語知識培訓)
(一)ABOUT ENGINEERING CHANGE (工程變更)
1. Engineering Change flow (工程變更流程)
(1)engineering 工程學/工程/設計engineer: 工程師
(2)Change 改變，變化 (3)Flow 流動 (4)Bank (河，海的)岸堤
2. Engineering change flow : (工程變更流程)
SCR ECN MECN PECN ECR
(客戶或業務提出變更要求) (R/D發變更通知) (工廠正式變更)
3. SCR : Sales change Request (業務變更需求)
(1)Sales ad : 銷售的業務 (2)request vt: 要求，請求要求
4. ECR: Engineering change Request (工程變更需求)
5. ECN: Engineering change notice (工程變更通知)notice 警告.通知
6. MECN : Material Engineering change notice (材料工程變更通知)
7. PECN : Process Engineering change Notice (制程工程變更通知)
8. TECN: Temporary Engineering change notice (臨時工程變更通知)
9. change mode (變更方式)
(1). Change immediately (立即變更)
指以發出通知日期起，所有材料，半成品。成品均需符合變更後之要求。如半成品，成品有變更前之物料，則ReworkØ As soon as relea notice date ，ALL material 。WIP. F/G would conform with request changed。For example 。Material before change for WIP or F/G 。It must be reworked。
(2). change by lots (批量變更)
Ø 以工單/訂單(周期)月份等為單位于變更，同單位內必須使用同種材料，其中lot 一堆，一批Eg (1): 整批 round lot . (2) returned lot 退回的一批貨。(3)Production lot 生產批量Ø ALL change ba on month of W/O &S/O，And the same material must be ud in the same month 。
(3). Running change (持續變更)
Ø指變更前後之物料可同時使用，一般是指把舊料用完，再使用新材料。
