Inner layer dry/film 内层干菲林 | |||
Blocking boards | 卡板 | Lack copper | 少铜 |
Inner scrap | 内层报废 | Uncomplete tearing film | 撕膜不净 |
Soft inner | 内层变软 | Conductor lift | 崩线 |
Inner misregistration | 内层错位 | Bulge on conductor | 线路凸位 |
Inner short | 内层短路 | Poor conductor | 线路不良 |
Inner open | 内层开路 | Pattern misregistration | 线路图形歪 |
Inner slight short | 内层微短 | Elliptical hole | 椭圆孔 |
Pressing 压板 | |||
DRY PLY | DRY PLY | Inner shift | 内层偏位 |
Tg value out of spec. | Tg超出要求 | Inner hole position incorrect | 内层歪孔 |
Tg value not meet the requirement | Tg达不到要求 | Lay up in rever | 排反板 |
Dent | 凹折 | The incision length not meet the requirement | 切割长度达不到要求 |
Measling | 白斑 | Board poor cutting | 切坏板 |
Poor edge | 板边不良 | Burnt | 烧焦 |
Burrs on board edge | 板边毛刺 | The resin content lower than the requirement | 树脂含量低于要求 |
Resin shortage in board edge | 板边缺树脂 | Void in resin | 树脂空洞 |
Fibre in board edge | 板边纤维丝 | Dissipation factor beyond criteria | 损耗因子达不到要求 |
Thin board thickness | 板薄 | Make wrong guide hole | 挑错管位 |
Excess board thickness | 板厚 | Thinner copper thickness | 铜箔偏薄 |
Board out of spec. | 板厚不合要求 | Dlamination between surface copper and prepreg | 铜箔气泡 |
Lamination wrinkles | 板料布纹 | Bow and twist out of spec | 弯曲性超标 |
Lamination blisters | 板料气泡 | Dusty and damage | 污损 |
Rough board surface | 板面不光滑 | Absorption beyond criteria | 吸水性超标 |
Board surface extrusion | 板面突起 | 畜禽粪便 Construction of fiber not meet requirement | 纤维结构不符要求 |
Dent by pressing board | 板面压伤 | Pressing dent | 压板凹痕 |
Board warp/bow | 板弯/曲 | Poor lamination | 压板不良 |
Board small | 板小 | Failed pressure vesl test | 压力锅测试未达标 |
Protective film too thick or thin | 保护膜偏厚&偏薄 | Fracture | 压伤 |
Delamination | 爆板 | Oxide | 氧化 |
Peel strength under requirement | 剥离强度未达标 | Misu prepreg | 用错P片 |
Black oxide scratch | 擦花黑化 | Laminate misud | 用错板料 |
Layer structure not meet MI requirement | 层压结构不符MI要求 | Misu inner P/R | 用错内层P/R |
Poor dimensional stability | 尺寸稳定性未达标 | Misu Cu coil | 用错铜箔 |
Delamination/Blister王筱雨 | 分层/起泡 | Weave texture | 织纹显露 |
Poor cutting | 割板不良 | Wrinkles | 皱折痕 |
Guide hole over size | 管位大孔 | Marked legend shift | 字唛打偏 |
Guide pin shift | 管位钉打偏 | 字体间距Marked legend in unit | 字唛入单元 |
Guide hole shift | 管位歪孔 | Stain on board | 板面污渍 |
Poor black oxide | 黑化不良 | Bow | 板弯 |
Board slip in pressing | 滑板 | Copper clad thickness under spec. | 表面铜薄 |
Foreign material in laminate | 基材内异物 | Copper clad thickness over spec. | 表面铜厚 |
Joint glue too thick or thin | 接着剂偏厚&偏薄 | Drilling wrong guide hole | 打错管位 |
Unqualified dielectric layer | 介电层不合格 | Inner layer cu thickness under spec. | 内层铜薄 |
Thin dielectric layer thickness | 介电层偏薄 | Inner layer cu thickness over spec. | 内层铜厚 |
Excess dielectric layer | 介电层偏厚 | Foreign material in inner layer | 内层杂物 |
Electronic inductivity beyond standard | 介电常数未达标 | Length and width not meet spec. | 外围尺寸不符合要求 |
Cutting wrong laminate | 开错料 | Marking wrong | 打错字唛 |
Missing guide hole | 漏打管位 | Missing marking | 漏打字唛 |
Missing black oxide | 漏黑化 | Poor staff | 板料不良 |
Expod/Disrupted fibres | 露纤维/纤维断裂 | Poor marking | 打字唛不良 |
Routing guide hole shift | 锣偏管位孔 | Board break | 板裂 |
Pits | 麻点 | The joint of copper foil | 铜箔接口 |
Inner white spot | 内层白点 | Skipping inner-layer | 少排内层 |
Improper inner layer | 内层不配套 | Skipping prepreg | 少排P片 |
Inner scratch | 内层擦花 | Pattern perforation | 线路穿孔 |
Inner pink ring | 内层粉红圈 | Poor mechanical pressing | 机械压伤不良 |
Inner glue residue | 内层胶渍 | ||
Drilling 钻房 | |||
Broken guide hole | 打爆管位 | Hole diameter over size | 钻大孔 |
Drill bit broken | 断针 | Drilling extra hole | 钻多孔 |
Scrape | 刮花 | Drilling in rever | 钻反孔 |
Deformed hole | 孔变形 | Poor drilling | 钻孔不良 |
Burrs in hole | 孔内披锋 | Drilling un-through | 钻不穿 |
Drilling skip | 漏钻孔 | Drilling hole misalignment | 钻歪孔 |
Drilling wrong boards | 钻错板 | Hole diameter under size | 钻小孔 |
Drilling wrong hole | 钻错孔 | Hole damaged | 钻炸孔 |
Tenting hole/Plugging | 塞孔 | ||
PTH/PP 沉铜/板面电镀 | |||
Board surface dent | 板面凹痕 | Copper thread in hole | 孔内铜丝 |
Board surface copper nubbles | 板面铜粒 | No copper in hole | 孔内无铜 |
Board folding and breaking | 板折坏 | Copper in hole（NPTH） | 孔内有铜(非镀铜孔) |
Poor plating | 电镀不良 | Board damaged by scrubbing | 磨坏板 |
The plating thickness not uniform | 电镀层不均匀 | Plating copper peel off | 铜层剥离 |
Rough plating | 电镀粗糙 | Wicking | 渗铜 |
Hole plugged by plating | 电镀塞孔 | Drilling hole failure | 钻飞孔 |
Burnt board by plating | 电镀烧板 | Board scratched by machine | 机械刮伤 |
Boards-drop into the tunnel | 缸底板 | Mechanical drilling hole misalignment | 机械钻歪孔 |
Burrs on hole-edge | 孔边毛刺 | Poor mechanical drilling | 机械钻孔不良 |
Rough hole wall | 孔粗 | Big hole of mechanical drilling | 机械钻大孔 |
Hole black | 孔黑 | Extra hole of mechanical drilling | 机械钻多孔 |
Missing hole of mechanical drilling | 机械钻漏孔 | ||
Dry/Film 干菲林 | |||
Hole breakout | 崩孔 | Glue residue | 胶渍 |
Film scratch | 擦花菲林 | Missing PAD | 漏PAD |
Scratching prevent tin | 擦花锡面 | Missing date code | 漏印周期 |
Under developing | 冲板不净 | Poor in D/F lamination | 辘菲林不良 |
Over developing | 冲板过度 | Poor exposure | 曝光不良 |
Broken dry film | 穿菲林 | Exposure foreign material | 曝光垃圾 |
Overlap boards | 叠板 | Bleeding copper plating (wicking) | 渗镀 |
Same location trace open | 定位断线 | Peel off D/F | 甩菲林 |
Short | 短路 | Misu film | 用错菲林 |
Trace open | 断线 | Foreign inclusions | 杂物 |
Put wrong D/F | 放错菲林 | Pin hole | 针孔 |
Put D/F in rever | 放反菲林 | Unclear date code | 周期不清 |
Film wring | 菲林起皱 | Mistake date code | 用错周期 |
Film in hole | 菲林入孔 | Foreign material under film | 菲林下杂物 |
D/F residue | 菲林碎 | ||
Pattern plating & Etching & M/I图电/蚀刻/中检 | |||
Dishdown | 碟形凹痕 | Trace undersize | 线幼 |
Dirty | 板污 | Chemical solution polluting | 药水 |
Copper residue | 残铜 | Lower impedance | 阻抗偏低 |
Dropped D/F | 掉菲林 | Higher impedance | 阻抗偏高 |
Poor tin plating | 镀锡不良 | Resistance out of requirement | 电阻不合要求 |
Trace broken by clamper | 夹崩线路 | Hole knocked down | 撞崩孔 |
D/F clamping | 夹菲林 | Trace shift (by damage) | 撞歪（断）线 |
Under etching | 蚀板不净 | Scrap by machine blocking | 塞机报废 |
Over etching | 蚀板过度 | Mechanical broken trace | 机械撞断路 |
Unclear etching legend | 蚀字不清 | Poor circuit reworking | 补线不良 |
Thin copper plating | 铜薄 | Poor rework | 修理不良 |
Excess copper thickness | 铜厚 | Burned trace open | 烧断线 |
Film under stripping | 褪菲林不净 | SMT PAD undersize | 锡手指幼 |
Tin under stripping | 褪锡不净 | Edge roughness(dull line) | 线路狗牙 |
Thin tin coating | 锡薄 | Trace spacing undersize | 线隙不足 |
Nicks | 缺口 | Boards damaged | 板损坏 |
W/F 湿绿油 | |||
Board discolor | 板黄 | S/M on SMT PAD | 绿油上锡手指 |
S/M skipping | 不过油 | Foreign material under S/M | 绿油下杂物 |
Scratch | 擦花 | Poor S/M color | 绿油颜色不良 |
Damaged by pin pressing | 钉床压伤 | Poor scrubbing | 磨板不良 |
Weave exposure | 基材白点 | Solder mask bleeding | 渗油 |
Board poor baking | 焗坏板 | Hand print | 手印 |
Expo cu in hole | 孔内露铜 | Solder mask peel off | 甩油 |
Expod conductors | 露线 | Over micro-etching | 微蚀过度 |
S/M skip | 漏印绿油 | S/M on PAD | 绿油上焊盘 |
S/M uneven | 绿油不匀 | Missing boards | 遗失板 |
S/M under developing | 绿油冲不净 | Misu W/F net | 用错W/F网 |
Solder mask misregistration | 绿油偏位 | S/M thickness under spec. | 油薄 |
Solder mask blistering | 绿油超泡 | Solder mask over developing | 绿油冲过度 |
Solder mask wrinkles | 绿油起皱 | Misu solder mask | 用错油墨 |
Solder mask in hole | 绿油入孔 | S/M thickness over spec. | 油厚 |
S/M on gold finger | 绿油上金手指 | ||
C/M 白字 | |||
C/M in hole | 字符入孔 | Plugging hole shift | 塞偏孔 |
C/M on PAD | 字符油上焊盘 | Unclear trademark | 商标不清 |
Mark Illegible | 字符不清 | Double C/M | 双重白字 |
Legend dissolved | 字符溶解 | Poor carbon ink | 碳油不良 |
Carbon ink on board | 板面有碳油 | Carbon ink short | 碳油短路 |
Broken ink | 爆油 | Carbon ink saw-tooth shaped | 碳油狗牙 |
Yellow C/M in hole | 黄油入孔 | Missing print C/M | 印错字符 |
Peelable mask in hole | 蓝胶入孔 | Misu black oil net | 印错黑油网 |
Missing plug hole | 漏塞孔 | Wrong trademark | 印错商标 |
Missing C/M | 漏印字符 | Askew C/M | 印歪字符 |
S/M blocking hole | 绿油塞孔 | Misu C/M net | 印错字符网 |
Poor plug hole | 塞孔不良 | 酸奶苹果Expod conductor | 露导体 |
Illegible legend | 字符残缺 | Carbon ink peel off | 甩碳油 |
Carbon ink bleeding | 渗碳油 | C/M peel off | 甩字符 |
Return cycle print | 返印周期 | Misu carbon ink net | 用错碳油网 |
Solder powder | 品茗的佳句锡粉 | ||
HAL 喷锡 | |||
Scratching solder legend | 擦伤锡字 | Solder thickness over spec. | 锡厚 |
Dent in gold finger | 金手指凹痕 | Solder thickness under spec. | 锡厚度不足 |
Scratching gold finger | 金手指擦花 | Gray solder | 锡面灰 |
Expo cu on gold finger | 金手指露铜 | Tin blocking hole | 锡塞孔 |
Solder on gold finger | 金手指上锡 | Line peel off | 线路剥离 |
Dirty hole | 孔灰 | Solder on trace | 线路上锡 |
Poor melting | 熔锡不良 | Solder on S/M | 板面上锡 |
PAD peel off | 甩焊盘 | Non-wetting | 不上锡 |
Copper peel off | 甩铜 | Solder whiten | 锡白 |
Solder peel off | 甩锡 | Solder surface roughness | 锡面粗糙 |
Excessive solder | 锡高 | Solder thread in hole | 孔内锡丝 |
Dewetting | 缩锡 | Undersized hole | 孔细 |
SMT PAD damaged | 损坏锡手指 | Rust solder | 锈色 |
G/F plating & Immersion gold 金手指电镀&沉金 | |||
Gold burnt in plating | 电镀烧金 | Gold bleeding | 渗金 |
Poor gold plating | 镀金不良 | Water residue | 水渍印 |
Poor Ni plating | 镀镍不良 | Poor gold stripping | 褪金不良 |
Gold plating skip | 漏镀金 | White hole edge | 孔边发白 |
Ni plating skip | 漏镀镍 | No gold in hole | 孔内无金 |
Ni thickness under spec. | 镍薄 | Gold on guide hole | 管位孔上金 |
Gold on trace | 线路上金 | Gold or Ni peel off | 甩金镍 |
Ni or gold skipping | SKIP | Watercolor printing | 水纹印 |
Gold on the edge | 板边有金 | Chemical solution on gold surface | 药水上金面 |
Poor gold immersion | 沉金不良 | Rough G/F | 金手指粗糙 |
Gold whiten | 金白 | G/F damaged | 金手指损坏 |
Gold thickness under spec. | 金薄 | Ni spot on board surface | 板面镀上镍 |
Poor gold color | 金颜色不良 | Nodule on G/F | 金手指有突出块 |
Pin hole on G/F | 金手指针孔 | ||
Profiling 外形加工 | |||
Poor V-cut | V坑不良 | Board damaged by punching | 啤坏板 |
Too shallow V-cut | V坑过浅 | Damage G/F by punching | 啤坏金手指 |
Excess depth of V-cut | V坑过深 | Damage board by model | 啤模压伤 |
V-cut shift | V坑偏位 | Double V-cut | 双重V坑 |
Dimension not meet requirement | 尺寸不合要求 | Out of upper tolerance | 外围偏大 |
Missing V-cut | 漏V坑 | Out of lower tolerance | 外围偏小 |
Miss routing board | 漏锣板 | Poor bevel | 斜边不良 |
Miss punching boards | 漏啤板 | Board cracked by punching | 啤爆板 |
Poor routing edge | 锣边不良 | Bevel edge over size | 斜边偏大 |
Board damaged by routing | 锣坏板 | Bevel edge under size | 斜边偏小 |
Poor punch | 啤板不良 | Missing slot hole | 漏SLOT孔 |
Hole cracked by punching | 啤爆孔 | Missing routing G/F bevel edge | 漏锣G/F斜边 |
Damaged board | 烂板 | Miss routing hole | 漏锣孔 |
Measling after punching | 泳衣写真啤后有白点 | Miss punching hole | 漏啤孔 |
Rouging board scrapped by machine | 机械锣坏板 | Outdated boards | 周期过期 |
Others 其它 | |||
Unclear E-T | E-T印不清 | Outdated boards | 过期板 |
Damaged edge | 板边损坏 | Old boards(stocked boards | 旧板(存仓板) |
Damaged corner | 板角损坏 | Old boards (customers clean board) | 旧板(客清板) |
Dent by E-Test | 电测压伤 | Customer returned boards | 客户退货 |
Broken board | 断板 | Collected mantissa boards | 清尾数板 |
Missing E-T stamp | 漏盖E-T印 | Wrong REV | 做错REV |
Out of inner scraps | 超出内层报废 | ||
ME trial | ME试验 | Old REV | 旧REV |
PE scrap | PE报废 | Receive extra order | 接多单 |
QA trial | QA试验 | PPC changed revision | PPC转版本 |
ME take board | ME取板 | ||
PE take board | PE取板 | Overdue prepreg | 过期P片 |
QA take board | QA取板 | Prepreg broken | P片折裂 |
PMC take board | PMC取板 | Black yarn | 黑纱 |
Return to material vendor | RTV物料供应商 | Black spot | 黑点 |
Return to machine vendor | RTV机器供应商 | Prepreg wrinkle | P片折痕 |
Return to subcontractor | RTV外发供应商 | Resin not proportion | 树脂分布不均 |
Yellow spot | 黄斑(点) | Smeary | 油污 |
Glue particle | 胶粒(印) | GT not meet requirement | GF不符合要求 |
Fish-eye | 鱼眼 | Dimension deviation | 尺寸偏差 |
Extract yarn | 抽纱 | Design defect | 设计错误 |
Digging hole | 挖洞 | Distribute wrong laminate | 发错物料 |
Dry-ply 梦见在水里玩耍 | 树脂脱落 | Returned materials | 退料 |
Discolor | 变色 | White spot in prepreg | P片白点 |
Roll edge not neat | 卷边不齐 | Dry ply in prepreg | P片缺树脂 |
Cloth weight out of spec. | 布重超标 | Texture expo in prpreg | P片织纹显露 |
R/C not meet requirement | 树脂含量不符要求 | Material in prepreg | P片杂物 |
F/L not meet requirement | 比例流量不符要求 | Water dipped prepreg | P片浸水 |
The joint of cloth decrea | 接布头减少 | 电气控制 Incoming quantity is not enough | 来料数量不足 |
Voids | 空洞 | Nodules/Burrs | 结瘤/披锋 |
Scratches and dents | 擦花和凹痕 | Voids-Copper plating | 铜镀层空洞 |
Weave expod | 露织物 | Plating voids –Finished coating | 成品涂覆层的镀层空间 |
Crazing | 微裂纹 | Panel scratches and dents | 板面擦花与凹痕 |
Exposing copper in hole(voids) | 孔内露铜(破洞) | Skip coverage | 跳印 |
Nonmetallic burrs | 非金属披锋 | Weaves/wrinkles/Ripples | 波纹/皱褶/皱纹 |
Metallic burrs | 金属披锋 | Tenting (Via holes) | 封孔(导通孔) |
Haloing | 晕圈 | Soda strewing | 毛细管空隙 |
Etch back | 回蚀 | Roughness | 孔粗 |
Negative etch back | 负回蚀 | Flare | 锥口 |
Resin recession | 树脂凹痕 | ||
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